Patent Assignment
Reel/Frame 062946/0125
Change of Name
Recorded: 2023-03-03
Pages: 21
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Properties
(409)
Polishing Fluid and Method of Polishing
Composition of Polycyanate Ester and Biphenyl Epoxy Resin
Cmp Polishing Compound and Polishing Method
Insulation Material, Film, Circuit Board and Method of Producing Them
Polishing Slurry and Polishing Method
Negative Electrode for Lithium Secondary Battery and Lithium Secondary Battery
Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board
Cmp Polishing Slurry and Method of Polishing Substrate
Binder Resin Composition for Nonaqueous Electrolyte Energy Device Electrode, Nonaqueous Electrolyte Energy Device Electrode, and Nonaqueous Electrolyte Energy Device
Method of Evaluating Polymide Dissolution Rate, Method of Producing Polymide, and Polymide Obtained Using Same Methods
Polishing Slurry for Polishing Aluminum Film and Polishing Method for Polishing Aluminum Film Using the Same
Adhesive Composition, Circuit Connecting Material, Connecting Structure for Circuit Member, and Semiconductor Device
Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Board Using Thereof
Polishing Composition And Polishing Method
Polishing slurry and polishing method
Novel Curable Resin, Production Method Thereof, Epoxy Resin Composition, and Electronic Device
Formation Method of Metal Layer on Resin Layer
Method of Treating the Surface of Copper and Copper
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Printed Wiring Board
Photosensitive Adhesive Composition, and Obtained Using the Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer with Adhesive Layer, Semiconductor Device and Electronic Part
Photosensitive Resin Composition, and, Photosensitive Element, Method for Forming Resist Pattern, Method for Manufacturing Printed Wiring Board and Method for Manufacturing Partition Wall for Plasma Display Panel Using the Composition
Resin Molding Material
Liquid Resin Composition for Electronic Components and Electronic Component Device
Sealant for Electronics of Epoxy Resin, Aromatic Amine, Accelerator and Inorganic Filler
Metal Polishing Slurry and Method of Polishing a Film to be Polished
Phenol Resin and Resin Composition
Cmp Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method
Substrate for Mounting an Optical Semiconductor Element, Manufacturing Method Thereof, an Optical Semiconductor Device, and Manufacturing Method Thereof
Thermosetting Resin Composition of Semi-Ipn Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same
Photosensitive Element, Method for Formation of Resist Pattern, and Method for Production of Print Circuit Board
Optical Semiconductor Element Mounting Package, and Optical Semiconductor Device Using the Same
Method for Producing Curing Agent Having Acidic Substituent and Unsaturated Maleimide Group, Thermosetting Resin Composition, Prepreg, and Laminate
Method for Manufacturing Multilayer Film
Production Method of Semiconductor Device and Bonding Film
Polishing Slurry for Cmp, and Polishing Method
Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board
Solar Battery Cell Connection Method and Solar Battery Module
Thermosetting Resin Composition and Prepreg and Laminate Obtained with the Same
Connected Structure and Method for Manufacture Thereof
Prepreg and Printed Wiring Board Using Thin Quartz Glass Cloth
Thermosetting Resin Composition for Light Reflection, Method for Manufacturing the Resin Composition and Optical Semiconductor Element Mounting Substrate and Optical Semiconductor Device Using the Resin Composition
Light Control Film and Light Control Glass
Light Control Film
Photosensitive Element
Metal Polishing Slurry and Polishing Method
Process for Producing Resin Varnish Containing Semi-Ipn Composite Thermosetting Resin and, Provided Using the Same, Resin Varnish for Printed Wiring Board, Prepreg and Metal-Clad Laminate
Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board
Friction Material Composition and Friction Material Produced Therewith
Polishing Slurry for Metal Films and Polishing Method
Cmp Slurry for Silicon Film Polishing and Polishing Method
Thermosetting Light-Reflecting Resin Composition, Optical Semiconductor Element Mounting Board Produced Therewith, Method for Manufacture Thereof, and Optical Semiconductor Device
Adhesive Composition, Electronic-Component-Mounted Substrate and Semiconductor Device Using the Adhesive Composition
Method for Producing Semiconductor Chip with Adhesive Film, Adhesive Film for Semiconductor Used in the Method, and Method for Producing Semiconductor Device
Method for Producing Semiconductor Chip with Adhesive Film, Adhesive Film for Semiconductor Used in the Method, and Method for Producing Semiconductor Device
Low Softening Point Glass Composition, Bonding Material Using Same and Electronic Parts
Thermosetting Resin Composition, Epoxy Resin Molding Material, and Polyvalent Carboxylic Acid Condensate
Polishing Solution for Cmp, and Method for Polishing Substrate Using the Polishing Solution for Cmp
Circuit Connecting Method
Adhesive Sheet for Semiconductor, and Dicing Tape Integrated Adhesive Sheet for Semiconductor
Positive-Type Photosensitive Resin Composition, Method for Production of Resist Pattern, Semiconductor Device, and Electronic Device
Abrasive Compounds for Semiconductor Planarization
Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder
Cmp Polishing Slurry and Method of Polishing Substrate
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Printed Wiring Board
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Printed Wiring Board
Semiconductor-Encapsulating Adhesive, Semiconductor-Encapsulating Film-Form Adhesive, Method for Producing Semiconductor Device, and Semiconductor Device
Light Control Film
Cerium Salt, Producing Method Thereof, Cerium Oxide and Cerium Based Polishing Slurry
Method for Producing Light-Modulating Film and Light-Modulating Film
Two-Layered Laminate Having Metal Foil Cladded on Its One Surface, Method for Production of the Laminate, Single-Sided Printed Wiring Board, and Method for Production of the Wiring Board
Photosensitive Adhesive Composition, and Obtained Using the Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer with Adhesive Layer, Semiconductor Device and Electronic Part
Photosensitive Adhesive Composition, and Obtained Using the Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer with Adhesive Layer, Semiconductor Device and Electronic Part
Polishing Agent and Method for Polishing Substrate Using the Polishing Agent
Method for Manufacturing Light Control Particles and Light Control Film Using Light Control Particles Obtained by the Method
Heat Radiation Sheet and Heat Radiation Device
Film Having Low Refractive Index Film and Method for Producing the Same, Anti-Relection Film and Method for Producing the Same, Coating Liquid Set for Low Refractive Index Film, Substrate Having Microparticle-Laminated Thin Film and Method for Producing the Same, and Optical Member
Thermosetting Resin Composition for Sealing Packing of Semiconductor, and Semiconductor Device
Photosensitive Conductive Film, Method for Forming Conductive Film, Method for Forming Conductive Pattern, and Conductive Film Substrate
Light Control Film
Light Control Film
Method for Surface Treatment of Copper and Copper
Photosensitive Conductive Film, Method for Forming Conductive Film, Method for Forming Conductive Pattern, and Conductive Film Substrate
Postive-Type Photosensitive Resin Composition, Method for Producing Resist Pattern, and Electronic Component
Photosensitive Resin Composition for Protective Film of Printed Wiring Board for Semiconductor Package
Polishing Solution for Cmp and Polishing Method Using the Polishing Solution
Polishing Solution for Cmp and Polishing Method Using the Polishing Solution
Positive-Type Photosensitive Resin Composition, Method for Producing Resist Pattern, Semiconductor Device, and Electronic Device
Light Control Film
Light Control Film
Optical Semiconductor Element Mounting Package, and Optical Semiconductor Device Using the Same
Cmp Polishing Solution and Polishing Method
Abrading Agent and Abrading Method
Polishing Agent for Copper Polishing and Polishing Method Using Same
Wafer Processing Tape, Method of Manufacturing Wafer Processing Tape, and Method of Manufacturing Semiconductor Device
Method for Producing Photovoltaic Cell
Adhesive Composition, Circuit Connecting Material, Connecting Structure for Circuit Member, and Semiconductor Device
Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
Friction Material Composition, Friction Material Using the Same, and Friction Member
Prepreg, Laminate Obtained with the Same and Printed-Wiring Board
Resin Composition, Prepreg Laminate Obtained with the Same and Printed-Wiring Board
Photosensitive Conductive Film, Method for Forming Conductive Film, Method for Forming Conductive Pattern, and Conductive Film Substrate
Cmp Polishing Liquid and Polishing Method
CMP Fluid and Method for Polishing Palladium
Adhesive Sheet and Method for Manufacturing Adhesive Sheets
Polishing Agent, Concentrated One-Pack Type Polishing Agent, Two-Pack Type Polishing Agent and Method for Polishing Substrate
Photosensitive Adhesive Composition, Film-Like Adhesive, Adhesive Sheet, Adhesive Pattern, Semiconductor Wafer with Adhesive Layer, Semiconductor Device
Polishing Agent for Copper Polishing and Polishing Method Using Same
Conductive Fine Particles and Anisotropic Conductive Material
Adhesive Agent, Adhesive Material Using the Same, and Method of Use Thereof
Adhesive Agent, Adhesive Material Using the Same, and Method of Use Thereof
Adhesive Agent, Adhesive Material Using the Same, and Method of Use Thereof
Thermosetting Resin Composition of Semi-Ipn Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same
Outer Panel for Back Door
Material for Forming Passivation Film for Semiconductor Substrate, Passivation Film for Semiconductor Substrate and Method of Producing the Same, and Photovoltaic Cell Element and Method of Producing the Same
Solar Battery Cell, Solar Battery Module and Method of Making Solar Battery Module
Copper Metal Film, Method for Producing Same, Copper Metal Pattern, Conductive Wiring Line Using the Copper Metal Pattern, Copper Metal Bump, Heat Conduction Path, Bonding Material, and Liquid Composition
Material for Organic Electronics, Organic Electronic Element, Organic Electroluminescent Element, Display Element Using Organic Electroluminescent Element, Illuminating Device, and Display Device
Thermosetting Resin Composition, Method for Forming Protective Film for Flexible Wiring Board, and Flexible Wiring Board
Carbon Particles for Negative Electrode of Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Cmp Polishing Solution and Polishing Method
Polishing Liquid for Cmp and Polishing Method Using the Same
Method for Producing Curing Agent Having Acidic Substituent and Unsaturated Maleimide Group, Thermosetting Resin Composition, Prepreg, and Laminate
Slurry, Polishing Fluid Set, Polishing Fluid, and Substrate Polishing Method Using Same
Light Control Film
Varnish, Prepreg, Film with Resin, Metal Foil-Clad Laminate, and Printed Circuit Board
Method for Producing Abrasive Grains, Method for Producing Slurry, and Method for Producing Polishing Liquid
Slurry, Polishing Liquid Set, Polishing Liquid, Method for Polishing Substrate, and Substrate
Slurry, Polishing Liquid Set, Polishing Liquid, Method for Polishing Substrate, and Substrate
Novel Silicon-Containing Alicyclic Polyimide Resin, Polyamic Acid Resin, and Manufacturing Method for Same
Thermosetting Resin Composition of Semi-Ipn Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same
Laminate Body, Laminate Plate, Multilayer Laminate Plate, Printed Wiring Board, and Method for Manufacture of Laminate Plate
Laminate Body, Laminate Plate, Multilayer Laminate Plate, Printed Wiring Board, and Method for Manufacture of Laminate Plate
Polishing Solution for Copper Polishing, and Polishing Method Using Same
Method for Producing Charge Transport Film
Circuit Component and Method of Making the Same
Photosensitive Adhesive Composition, and Obtained Using the Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer with Adhesive Layer, Semiconductor Device and Electronic Part
Photosensitive Resin Composition, Photosensitive Film, Rib Pattern Formation Method, Hollow Structure and Formation Method for Same, and Electronic Component
Epoxy Resin Composition and Pre-Preg, Support-Provided Resin Film, Metallic Foil Clad Laminate Plate and Multilayer Printed Circuit Board Utilizing Said Composition
Prepreg, Metal-Clad Laminate, and Printed Circuit Board
Thermal Conductive Sheet, Method of Producing Thermal Conductive Sheet and Heat Releasing Device
Cerium Oxide Slurry, Cerium Oxide Polishing Slurry and Method for Polishing Substrate Using the Same
Slurry, Polishing Liquid Set, Polishing Liquid, Method for Polishing Substrate, and Substrate
Dicing/Die Bonding Integral Film, Dicing/Die Bonding Integral Film Manufacturing Method, and Semiconductor Chip Manufacturing Method
Anode Material for Lithium Ion Secondary Battery, Anode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Liquid Composition, and Resistor Film, Resistor Element and Circuit Board Using Same
Non-Asbestos Friction-Material Composition, and Friction Material and Friction Member Using Same
Non-Asbestos Friction Material Composition, Friction Material Using Same, and Friction Member
Non-Asbestos Friction Material Composition, and Friction Material and Friction Member Using Same
Positive Photosensitive Resin Composition, Method of Creating Resist Pattern, and Electronic Component
Tape for Processing Wafer, Method for Manufacturing Tape for Processing Wafer, and Method for Manufacturing Semiconductor Device
Conductive Pattern Formation Method, Conductive Pattern-Bearing Substrate, and Touch Panel Sensor
Polishing Liquid and Method for Polishing Substrate Using the Polishing Liquid
Polishing Agent and Method for Polishing Substrate Using the Polishing Agent
Low Softening Point Glass Composition, Bonding Material Using Same and Electronic Parts
Solar Battery Cell and Solar Battery Module
Resin Composition, and Printed Wiring Board, Laminated Sheet, and Prepreg Using Same
Cmp Polishing Fluid, Method for Manufacturing Same, Method for Manufacturing Composite Particle, and Method for Polishing Base Material
Electrically Conductive Adhesive Composition, Connector and Solar Cell Module
Application:
13/982,067 →
Publication:
US 2013/0340806
Photosensitive Element, Method for Forming Resist Pattern, and Method for Producing Printed Circuit Board
Thermosetting Resin Composition, Epoxy Resin Molding Material, and Polyvalent Carboxylic Acid Condensate
Composition for Forming N-Type Diffusion Layer, Method of Forming N-Type Diffusion Layer, and Method of Producing Photovoltaic Cell
Polishing Slurry for Metal Films and Polishing Method
Siloxane Compound, Modified Imide Resin, Thermosetting Resin Composition, Prepreg, Film with Resin, Laminated Plate, Multilayer Printed Wiring Board, and Semiconductor Package
Non-Asbestos Friction Material Composition
Adhesive Film, Multilayer Printed Wiring Board Using Adhesive Film, and Method for Manufacturing Multilayer Printed Wiring Board
Photosensitive Conductive Film, Method for Forming Conductive Film, Method for Forming Conductive Pattern, and Conductive Film Substrate
Light Control Film
Semiconductor-Encapsulating Adhesive, Semiconductor-Encapsulating Film-Form Adhesive, Method for Producing Semiconductor Device, and Semiconductor Device
Fe-Based Sintered Alloy and Manufacturing Method Thereof
Sintered Alloy and Manufacturing Method Thereof
Iron Based Sintered Sliding Member and Method for Producing Same
Iron Base Sintered Sliding Member and Method for Producing Same
Iron-Based Sintered Alloy for Sliding Member and Production Method Therefor
Method for Producing Alkyldiol Monoglycidyl Ether
Composition Set, Conductive Substrate and Method of Producing the Same, and Conductive Adhesive Composition
Photosensitive Resin Composition, Photosensitive Film, Permanent Resist and Method for Producing Permanent Resist
Oil-Impregnated Sintered Bearing and Production Method Therefor
Optical Semiconductor Element Mounting Package, and Optical Semiconductor Device Using the Same
Method of Manufacturing Fiber Substrate and Method of Manufacturing Resin Rotator
Composition Capable of Changing Its Solubility, Hole Transport Material Composition, and Organic Electronic Element Using the Same
Reflow Film, Solder Bump Formation Method, Solder Joint Formation Method, and Semiconductor Device
Organic Electronic Material, Ink Composition, and Organic Electronic Element
Organic Electronic Material, Ink Composition, and Organic Electronic Element
Method for Forming Resin Cured Film Pattern, Photosensitive Resin Composition, Photosensitive Element, Method for Producing Touch Panel, and Resin Cured Film
Method of Forming Protective Film for Touch Panel Electrode, Photosensitive Resin Composition and Photosensitive Element, and Method of Manufacturing Touch Panel
Photosensitive Resin Composition, Method for Manufacturing Patterned Cured Film, and Electronic Component
Liquid Curable Resin Composition, Method for Manufacturing Image Display Device Using Same, and Image Display Device
Polishing Liquid for Metal and Polishing Method
Photosensitive Resin Composition, Method for Manufacturing Patterned Cured Film, and Electronic Component
Abrasive, Abrasive Set, and Method for Abrading Substrate
Polishing Agent, Polishing Agent Set, and Substrate Polishing Method
Adhesive for Semiconductor, Fluxing Agent, Manufacturing Method for Semiconductor Device, and Semiconductor Device
Semiconductor Device and Production Method Therefor
Adhesive Sheet and Method for Manufacturing Semiconductor Device
Polishing Method
Sintered Member, Pinion Gear for Starters, and Production Method Therefor
Slurry, Polishing-Solution Set, Polishing Solution, Substrate Polishing Method, and Substrate
Slurry, Polishing-Solution Set, Polishing Solution, Substrate Polishing Method, and Substrate
Slurry, Polishing-Solution Set, Polishing Solution, Substrate Polishing Method, and Substrate
Slurry, Polishing-Solution Set, Polishing Solution, Substrate Polishing Method, and Substrate
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Wiring Board
Winding Core and Roll
Method for Manufacturing Semiconductor Device
Adhesive Composition and Semiconductor Device Using Same
Phenolic Resin Composition
Electronic Component, Method for Producing Same, and Sealing Material Paste Used in Same
Drum Sputtering Device
Polishing Agent, Polishing Agent Set and Method for Polishing Base
Silver Paste Composition and Semiconductor Device Using Same
Sliding Bearing Assembly
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Photosensitive Resin Composition, Method for Producing Patterned Cured Film, Semiconductor Element and Electronic Device
Cmp Polishing Liquid and Polishing Method
Friction Material Composition, Friction Material Using the Same, and Friction Member
Conductor Connection Member, Connection Structure, and Solar Cell Module
Photosensitive Element
Electrically Conductive Adhesive Composition, Connection Structure, Solar Battery Module, and Method for Producing Same
Photosensitive Resin Composition, Photosensitive Film, Rib Pattern Formation Method, Hollow Structure and Formation Method for Same, and Electronic Component
Expansion Method, Method for Manufacturing Semiconductor Device, and Semiconductor Device
Photosensitive Resin Composition, Photosensitive Film, and Method for Forming Resist Pattern
Thermosetting Resin Composition, and Prepreg, Insulating Film With Support, Laminate Plate, and Printed Wiring Board, Each Obtained Using Same
Organic Electronic Material, Ink Composition Containing Same, and Organic Thin Film, Organic Electronic Element, Organic Eletroluminescent Element, Lighting Device, and Display Device Formed Therewith
Conductive Pattern Formation Method, Conductive Pattern-Bearing Substrate, and Touch Panel Sensor
Tape for Processing Wafer, Method for Manufacturing Tape for Processing
Photosensitive Resin Composition, Dry Film Using Same, Printed Wiring Board, and Method for Producing Printed Wiring Board
Treatment Liquid Containing Ionic Compound, Organic Electronic Element, and Method for Producing Organic Electronic Element
Powder Magnetic Core for Reactor
Photosensitive Element, Photosensitive Element Roll, Method for Producing Resist Pattern, and Electronic Component
Lead-Free Low-Melting Glass Composition, Low-Temperature Sealing Glass Frit, Low-Temperature Sealing Glass Paste, Conductive Material, and Conductive Glass Paste Containing Glass Composition, and Glass-Sealed Component and Electric/Electronic Component Prepared Usi
Lead-Free Low-Melting Glass Composition, Low-Temperature Sealing Glass Frit, Low-Temperature Sealing Glass Paste, Conductive Material, and Conductive Glass Paste Containing Glass Composition, and Glass-Sealed Component and Electric/Electronic Component Prepared Using the Same
Film-Like Epoxy Resin Composition, Method of Producing Film-Like Epoxy Resin Composition, and Method of Producing Semiconductor Device
Polishing Liquid for Cmp, and Polishing Method
Method of Manufacturing Molding Material, Molding Die for Use in the Manufacturing Method, and Method of Manufacturing Resin Rotator
Laminate Containig Conductive Fiber, Photosensitive Conductive Film, Method for Producing Conductive Pattern, Conductive Pattern Substrate, and Touch Panel
Photosensitive Resin Composition, Film Adhesive, Adhesive Sheet, Adhesive Pattern, Semiconductor Wafer with Adhesive Layer, and Semiconductor Device
Photosensitive Resin Composition for Projection Exposure, Photosensitive Element, Method for Forming Resist Pattern, Process for Producing Printed Wiring Board and Process for Producing Lead Frame
Epoxy Resin Composition and Electronic Component Device
Slurry, Polishing Solution Set, Polishing Solution, and Substrate Polishing Method
Apparatus of Manufacturing Molding Material and Method of Manufacturing Resin Gear
Method and Apparatus of Manufacturing Molding Material, and Method of Manufacturing Resin Gear
Slurry, Polishing-Liquid Set, Polishing Liquid, Method for Polishing Substrate, and Substrate
Abrasive, Abrasive Set, and Method for Abrading Substrate
Photosensitive Film, Photosensitive Element, Cured Product and Touch Panel
Powder Magnetic Core and Reactor Using the Same
Adhesive Composition, Electronic-Component-Mounted Substrate and Semiconductor Device Using the Adhesive Composition
Composition Capable of Changing Its Solubility, Hole Transport Material Composition, and Organic Electronic Element Using the Same
Powder Magnetic Core, Method of Manufacturing Powder Compact for Magnetic Core, Die and Die Assembly for Manufacturing Powder Magnetic Core, and Die Lubricating Composition for Manufacturing Powder Magnetic Core
Photosensitive Resin Composition, Photosensitive Element, Semiconductor Device and Method for Forming Resist Pattern
Photosensitive Conductive Film, Conductive Pattern Formation Method Using Same, and Conductive Pattern Substrate
Prepreg Mica Tape and Coil Using Same
Vacuum Forming Method
Heat-Insulating Member, Low-Melting Glass Composition, and Sealing Material Paste
Method for Forming Resin Cured Film Pattern, Photosensitive Resin Composition, Photosensitive Element, Method for Producing Touch Panel, and Resin Cured Film
Organic Electronic Material, Ink Composition, and Organic Electronic Element
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern, and Method for Producing Printed Wiring Board
Film for Temporary Fixing, Film Sheet for Temporary Fixing and Semiconductor Device
Abrasive, Abrasive Set, and Method for Polishing Substrate
Resin Composition, Method for Manufacturing Semiconductor Device Using Resin Composition, and Solid-State Imaging Element
Adhesive Composition, Resin Cured Product Obtained from Adhesive Composition, Method for Manufacturing Semiconductor Device Using Adhesive Composition, and Solid-State Imaging Element
Aerogel
Photosensitive Conductive Film
Negative Electrode Material for Lithium-Ion Secondary Battery,Method for Manufacturing Negative Electrode Material for Lithium-Ion Secondary Battery, Negative Electrode Material Slurry for Lithium-Ion Secondary Battery, Negative Electrode for Lithium-Ion Secondary
Thermosetting Resin Composition, Method for Producing Resin Composition Varnish, Prepreg and Laminate
Conductive Pattern Formation Method, Conductive Pattern-Bearing Substrate, and Touch Panel Sensor
Non-Asbestos Friction Material Composition
Optical Semiconductor Element Mounting Substrate and Optical Semiconductor Device Using Thermosetting Resin Composition for Light Reflection
Method of Forming Protective Film for Touch Panel Electrode Photosensitive Resin Composition and Photosensitive Element, and Method of Manufacturing Touch Panel
Polishing Agent and Method for Polishing Substrate Using the Polishing Agent
Thermosetting Resin Composition and Prepreg and Laminate Both Made with the Same
Polyphenylene Ether Derivative Having N-Substituted Maleimide Group, and Heat Curable Resin Composition, Resin Varnish, Prepreg, Metal-Clad Laminate, and Multilayer Printed Wiring Board Using Same
Permeability Evaluation Method
Method for Forming Resist Pattern, Method for Manufacturing Printed Wiring Board, Photosensitive Resin Composition for Projection Exposure and Photosensitive Element
Polishing Liquid for Cmp, Polishing Liquid Set for Cmp, and Polishing Method
Cmp Polishing Liquid and Polishing Method
Epoxy Resin Molding Material for Sealing and Electronic Component Device
Method for Forming Resin Cured Film Pattern, Photosensitive Resin Composition, Photosensitive Element, Method for Producing Touch Panel, and Resin Cured Film
Adhesive Composition
Photosensitive Resin Composition, Photosensitive Element, Method for Producing Substrate with Resist Pattern, and Method for Producing Printed Wiring Board
Aerogel Composite, and Supporting Member and Heat Insulation Material Provided with Aerogel Composite
Semiconductor Device and Manufacturing Method Therefor, and Resin Composition for Forming Flexible Resin Layer
Photosensitive Resin Composition, Photosensitive Element, Cured Product, Semiconductor Device, Method for Forming Resist Pattern, and Method for Producing Circuit Substrate
Multilayer Transmission Line Plate
Resin Film for Flexible Printed Circuit Board, Metal Foil Provided with Resin, Coverlay Film, Bonding Sheet, and Flexible Printed Circuit Board
Thermosetting Resin Composition, Resin Film for Interlayer Insulation, Composite Film, Printed Wiring Board, and Method for Producing Same
Production Method for Aerogel Laminate, and Aerogel Laminate Roll
Method for Forming Molded Article by Press Molding
Conductive Joint Article and Method for Manufacturing Same
Thermosetting Resin Composition, Prepreg, Laminate and Multilayer Printed Wiring Board
Friction Material Composition, and Friction Material and Friction Member Using the Same
Epoxy Resin Composition, Thermally-Conductive Material Precursor, B-Stage Sheet, Prepreg, Heat Dissipation Material, Laminate, Metal Substrate, and Printed Circuit Board
Lead-Free Low-Melting Glass Composition, Low-Temperature Sealing Glass Frit, Low-Temperature Sealing Glass Paste, Conductive Material, and Conductive Glass Paste Containing Glass Composition, and Glass-Sealed Component and Electric/Electronic Component Prepared Using the Same
Light-Emitting Device and Method of Preparing Same, Optical Semiconductor Element Mounting Package, and Optical Semiconductor Device Using the Same
Electronic Component, Method for Producing Same, and Sealing Material Paste Used in Same
Organic Electronic Material, Ink Composition, and Organic Electronic Element
Polishing Agent, Storage Solution for Polishing Agent and Polishing Method
Aerogel
Semiconductor Device and Method for Manufacturing Same
Copper Paste for Joining, Method for Producing Joined Body, and Method for Producing Semiconductor Device
Assembly and Semiconductor Device
Organic Electronics Material and Use Thereof
Method for Manufacturing Semiconductor Device Including Heating and Pressuring a Laminate Having an Adhesive Layer
Poly(Amide-Imide) Resin Composition and Fluorochemical Coating Material
Sintered Alloy and Manufacturing Method Thereof
Pregreg, Film with Resin, Metal Foil with Resin, Metal-Clad Laminate, and Printed Wiring Board
Non-Asbestos Friction Material Composition, Friction Material Using Same, and Friction Member
Slurry, Polishing Liquid Set, Polishing Liquid, Method for Polishing Substrate, and Substrate
Light-Emitting Device and Method of Preparing Same, Optical Semiconductor Element Mounting Package, and Optical Semiconductor Device Using the Same
Organic Electronic Material, Ink Composition Containing Same, and Organic Thin Film, Organic Electronic Element, Organic Eletroluminescent Element, Lighting Device, and Display Device Formed Therewith
Fe-Based Sintered Alloy and Manufacturing Method Thereof
Resin Composition, Method for Manufacturing Semiconductor Device Using Resin Composition, and Solid-State Imaging Element
Slurry, Polishing Fluid Set, Polishing Fluid, and Substrate Polishing Method Using Same
Expansion Method, Method for Manufacturing Semiconductor Device, and Semiconductor Device
Method for Forming Resin Cured Film Pattern, Photosensitive Resin Composition, Photosensitive Element, Method for Producing Touch Panel, and Resin Cured Film
Photosensitive Film, Photosensitive Element, Cured Product and Touch Panel
Abrasive, Abrasive Set, and Method for Polishing Substrate
Organic Electronic Material Including Charge Transport Polymer or Oligomer Having Structural Unit Containing Aromatic Amine Structure Substituted with Fluorine Atom, Organic Electronic Element, and Organic Electroluminescent Element
Friction Material Composition, Friction Material, and Friction Member
Epoxy Resin Composition, Semi-Cured Epoxy Resin Composition, Cured Epoxy Resin Composition, Molded Article, and Cured Molded Article
Organic Interposer and Method for Manufacturing Organic Interposer
Friction Material Composition
Moisture-Curable Reactive Hot-Melt Adhesive Composition and Method for Producing the Same
Copper Paste for Joining, Method for Manufacturing Joined Body, and Method for Manufacturing Semiconductor Device
Method for Manufacturing Semiconductor Device
Varnish, Prepreg, Film with Resin, Metal Foil-Clad Laminate, and Printed Circuit Board
Aerogel
Negative Electrode Material for Lithium-Ion Secondary Battery, Method for Manufacturing Negative Electrode Material for Lithium-Ion Secondary Battery, Negative Electrode Material Slurry for Lithium-Ion Secondary Battery, Negative Electrode for Lithium-Ion Secondary Battery, and Lithium-Ion Secondary Battery
Liquid Resin Composition for Sealing and Electronic Component Device
Sealing Composition and Semiconductor Device
Resin Composition and Method of Producing Laminate
Epoxy Resin Composition, Cured Product and Composite Material
Thermosetting Resin Composition, Interlayer Insulation Resin Film, Composite Film, Printed Wiring Board, and Production Method Thereof
Adhesive Film for Multilayer Printed-Wiring Board
Slurry and Polishing Method
Application:
16/334,807 →
Publication:
US 2020/0016721
Resin Composition, Wiring Layer Laminate for Semiconductor, and Semiconductor Device
Resin Member and Sheet Using Same, and Heat Storage Material and Heat Control Sheet Using Same
Support-Provided Insulating Layer, Laminate, and Wiring Board
Epoxy Resin, Epoxy Resin Composition, Inorganic Filler-Containing Epoxy Resin Composition, Resin Sheet, Cured Product, and Epoxy Compound
Heat Conduction Sheet, Method of Manufacturing Heat Conduction Sheet, and Heat Dissipating Device
Treatment Agent for Treating Particles, Water-Repellent Particles and Production Method Therefor, Water-Repellent Layer, and Penetration Preventing Structure
Treatment Agent for Treating Fibers, Fibers and Production Method Therefor, and Fiber Sheet and Production Method Therefor
Method for Manufacturing Electronic Component, Resin Composition for Temporary Protection, and Resin Film for Temporary Protection
Water-Repellent Agent, Water-Repellent Structure, and Production Method for Said Structure
Application:
16/482,898 →
Publication:
US 2020/0010725
Friction Material Composition, Friction Material, and Friction Member
Slurry and Polishing Method
Negative Electrode Active Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Application:
16/499,257 →
Publication:
US 2021/0075003
Prepreg for Coreless Substrate, Coreless Substrate and Semiconductor Package
Coreless Substrate Prepreg, Coreless Substrate, Coreless Substrate Manufacturing Method and Semiconductor Package
Anode Material for Lithium Ion Secondary Battery, Method of Producing Anode Material for Lithium Ion Secondary Battery, Anode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Polishing Solution and Polishing Method
Slurry and Polishing Method
Polishing Solution, Polishing Solution Set, and Polishing Method
Application:
16/650,691 →
Publication:
US 2021/0189176
Polishing Liquid, Polishing Liquid Set, Polishing Method, Anddefect Suppression Method
Application:
16/652,451 →
Publication:
US 2020/0283659
Coating Solution, Method for Producing Coating Film, and Coating Film
Coating Solution, Method for Producing Coating Film, and Coating Film
Aerogel and Method for Producing Same
Coating Liquid, Production Method for Coating Film, and Coating Film
Adhesive for Semiconductor Device, and High Productivity Method for Manufacturing Said Device
Epoxy Resin Composition and Electronic Component Device
Aerogel Composite, and Supporting Member and Heat Insulation Material Provided with Aerogel Composite
Epoxy Resin Composition, Thermally-Conductive Material Precursor, B-Stage Sheet, Prepreg, Heat Dissipation Material, Laminate, Metal Substrate, and Printed Circuit Board
Member Connection Method
Method for Manufacturing Thermoelectric Conversion Module, Thermoelectric Conversion Module, and Binder for Thermoelectric Conversion Module
Charge-Transport Polymer and Organic Electronic Element
Barrier Material Formation Composition, Barrier Material, Production Method for Barrier Material, Product, and Production Method for Product
Film Capacitor Manufacturing Method and Case
Resin Composition, Cured Product, Molding and Method for Producing Same, and Film Capacitor and Method for Producing Same
Iron-Based Sintered Alloy Material and Production Method Therefor
Application:
16/762,737 →
Publication:
US 2020/0331068
Compound and Tablet
Prepreg, Laminate, and Production Methods Therefor, as Well as Printed Circuit Board and Semiconductor Package
Slurry, Polishing-Liquid Set, Polishing Liquid, and Polishing Method for Base
Adhesive Film
Polishing Liquid, Polishing Liquid Set, and Polishing Method
Application:
16/962,375 →
Publication:
US 2021/0062041
Compound Powder
Application:
16/971,796 →
Publication:
US 2020/0391287
Sintered Valve Guide and Method for Producing Same
Temporary Protective Film for Semiconductor Sealing Molding, Lead Frame with Temporary Protective Film, Sealed Molded Body with Temporary Protective Film, and Method for Producing Semiconductor Device
Epoxy Resin, Epoxy Resin Composition, Resin Sheet, B-Stage Sheet, C-Stage Sheet, Cured Product, Metal Foil with Resin, Metal Substrate, and Power Semiconductor Device
Epoxy Resin Composition and Electronic Component Device
Application:
16/981,188 →
Publication:
US 2021/0061986
Polishing Liquid, Polishing Liquid Set, and Polishing Method
Polishing Liquid, Polishing Liquid Set, and Polishing Method
Organic Interposer and Method for Manufacturing Organic Interposer
Method for Manufacturing Negative Electrode Material for Lithium-Ion Secondary Battery, and Method for Manufacturing Lithium-Ion Secondary Battery
Application:
17/041,572 →
Publication:
US 2021/0091373
Thermosetting Resin Composition, Prepreg, Resin-Coated Metal Foil, Laminate, Printed Wiring Board, and Semiconductor Package
Organic Electronic Material, Ink Composition Containing Same, and Organic Thin Film, Organic Electronic Element, Organic Eletroluminescent Element, Lighting Device, and Display Device Formed Therewith
Resin Composition, Prepreg, Metal Foil with Resin, Laminate, Printed Wiring Board, and Method for Producing Resin Composition
Adhesive Tape
Patent:
655,341 →
Application:
29/365,982 →
Portion of a Cartridge for an Ion Density Measuring Instrument
Patent:
664,869 →
Application:
29/385,944 →
Body Core of a Cartridge for an Ion Density Measuring Instrument
Patent:
665,283 →
Application:
29/385,949 →
Cartridge for an Ion Density Measuring Instrument
Patent:
665,284 →
Application:
29/385,952 →
Cartridge for an Ion Density Measuring Instrument
Patent:
665,681 →
Application:
29/385,955 →
Portion of a Reagent Container
Patent:
666,735 →
Application:
29/388,523 →
Reagent Container
Patent:
666,736 →
Application:
29/388,525 →
Adhesive Tape for Semiconductor Manufacturing
Patent:
656,909 →
Application:
29/389,788 →
Adhesive Tape for Semiconductor Manufacturing
Patent:
664,511 →
Application:
29/389,790 →
Adhesive Tape for Semiconductor Manufacturing
Patent:
664,512 →
Application:
29/389,794 →
Adhesive Tape for Semiconductor Manufacturing
Patent:
656,910 →
Application:
29/389,797 →
Adhesive Tape for Semiconductor Manufacturing
Patent:
680,505 →
Application:
29/413,509 →
Adhesive Tape for Semiconductor Manufacturing
Patent:
690,278 →
Application:
29/413,539 →
Adhesive Tape for Semiconductor Manufacturing
Patent:
689,831 →
Application:
29/413,548 →
Cell-Collecting Cartridge
Patent:
738,524 →
Application:
29/476,088 →
Packaging Container
Patent:
743,250 →
Application:
29/477,833 →
Filter Sheet for a Cell Collecting Cartridge
Patent:
748,267 →
Application:
29/486,988 →
Filter Sheet for a Cell Collecting Cartridge
Patent:
750,785 →
Application:
29/486,991 →
Filter Sheet for a Cell Collecting Cartridge
Patent:
747,487 →
Application:
29/486,992 →
Filter Sheet for a Cell Collecting Cartridge
Patent:
748,801 →
Application:
29/486,995 →
Filter Sheet for a Cell Collecting Cartridge
Patent:
746,467 →
Application:
29/487,034 →
Flap in an Adhesive Tape for Semiconductor Manufacturing
Patent:
804,435 →
Application:
29/491,391 →
Filter Sheet for a Cell Collecting Cartridge
Patent:
752,227 →
Application:
29/533,746 →
Filter Sheet for a Cell Collecting Cartridge
Patent:
751,189 →
Application:
29/533,749 →
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 8, 2011
From: OHTAKE, GOUKI; ISHIBASHI, KAZUHIRO; HONDA, KEIJIROU; OKUDA, NAOKI
To: HITACHI CHEMICAL CO., LTD.
Reel/Frame 025918/0711 →
Change of Address
Jan 22, 2014
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 032111/0916 →
Assignment of Assignor's Interest
Oct 27, 2014
From: SHOWA DENKO K.K.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 034035/0134 →
Change of Address
Mar 3, 2016
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 037987/0215 →
Assignment of Assignor's Interest
Oct 1, 2018
From: SUN, SHOUQI; MAGARA, AKIHITO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 047016/0762 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →