Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

1. A circuit connecting material for electrical connection between opposing circuit electrodes,

wherein the circuit connecting material comprises an adhesive composition comprising a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a compound having at least one aminoxyl structure in the molecule.

2. The circuit connecting material according to claim 1 , wherein the compound having at least one aminoxyl structure in the molecule is an amine compound having a divalent organic group represented by the following general formula (A) and at least one aminoxyl structure in the molecule:

wherein X 1 , X 2 , X 3 and X 4 each independently represent hydrogen or C1-5 alkyl.

3. The circuit connecting material according to claim 1 , wherein the radical polymerizing compound has at least two (meth)acryloyl groups in the molecule.

4. The circuit connecting material according to claim 1 , wherein the radical polymerization initiator is a peroxy ester derivative with a one-minute half-life temperature of 90-175° C.

5. The circuit connecting material according to claim 1 , wherein the radical polymerization initiator is a peroxy ester derivative with a molecular weight of 180-1000.

6. The circuit connecting material according to claim 1 , which contains the radical polymerizing compound at 50-250 parts by weight, the radical polymerization initiator at 0.05-30 parts by weight and the compound having at least one aminoxyl structure in the molecule at 0.001-30 parts by weight with respect to 100 parts by weight of the thermoplastic resin.

7. The circuit connecting material according to claim 1 , characterized by further comprising conductive particles.

8. The circuit connecting material according to claim 7 , which comprises the conductive particles at 0.5-30 parts by weight with respect to 100 parts by weight of the thermoplastic resin.

9. A circuit connecting material film obtained by forming the circuit connecting material according to claim 1 into a film.

10. The circuit connecting material film according to claim 9 , wherein when opposing circuit members are bonded by heating under conditions with a compression time of 10 seconds, a pressure of 3 MPa and a heating temperature of 140-200° C., the maximum value of the connection resistance between the heat bonded connection members in the entire heating temperature range is no greater than 3 times the minimum value.

11. A connection structure for a circuit member comprising

a first circuit member having a first circuit electrode formed on the main side of a first circuit board,

a second circuit member having a second circuit electrode formed on the main side of a second circuit board, and

a circuit connecting member formed between the main side of the first circuit board and the main side of the second circuit board, which electrically connects the first circuit electrode and second circuit electrode which are positioned opposite each other,

characterized in that the circuit connecting member is the cured product of the circuit connecting material according to claim 1 .

12. A semiconductor device comprising

a semiconductor element,

a base on which the semiconductor element is mounted, and

a semiconductor element connecting member provided between the semiconductor element and the base and electrically connecting the semiconductor element and the base,

characterized in that the semiconductor element connecting member is the cured product of the circuit connecting material according to claim 1 .

13. The circuit connecting material according to claim 2 , wherein the compound having at least one aminoxyl structure in the molecule contains at least one of 2,2,6,6-tetramethylpiperidine-1-oxyl, 4-acetamide-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-amino-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-carboxy-2,2,6,6 -tetramethylpiperidine-1-oxyl, 3-carboxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-(2-chloroacetamide)-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-(2-iodoacetamide)-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-isothiocyanato-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-isocyanato-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-methoxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-oxo-2,2,6,6-tetramethylpiperidine-1-oxyl, a compound represented by following formula (19):

wherein R 11 represents a C1-5 alkylene chain or a phenylene chain, a compound represented by following formula (20):

wherein R 12 represents a C1-5 alkylene chain or a phenylene chain, and a compound represented by following formula (21):

wherein R 13 is a group represented by the following formula (12c):