Patent Assignment
Reel/Frame 020211/0550
Assignment of Assignor's Interest
Recorded: 2007-12-07
Pages: 4
Assignors
KATOGI, SHIGEKI
Executed: 2007-01-19
SUTOU, HOUKO
Executed: 2007-01-24
IZAWA, HIROYUKI
Executed: 2007-01-19
SHIRASAKA, TOSHIAKI
Executed: 2007-01-19
YUSA, MASAMI
Executed: 2007-01-19
KOBAYASHI, TAKANOBU
Executed: 2007-01-26
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1 NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Adhesive Composition, Circuit Connecting Material, Connecting Structure for Circuit Member, and Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →