Prepreg, laminate obtained with the same and printed-wiring board
View Patent ↗Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure. A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.
1. A prepreg comprising a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of the thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure, said phase separation structure being a sea-island structure, wherein an occupying area ratio of an island portion of the sea-island structure per unit area on an observation surface of the layer made of a thermosetting resin composition is 10% or more to 45% or less, and wherein the thermosetting resin composition contains at least one of a cyanate resin and an unsaturated imide resin.
2. The prepreg according to claim 1 , wherein the modified silicone oil or the compound having a skeleton derived from a modified silicone oil has a dimethyl silicone skeleton in the molecular structure thereof.
3. The prepreg according to claim 1 , wherein the modified silicone oil or the compound having a skeleton derived from a modified silicone oil has a reactive group in the molecular structure thereof.
4. The prepreg according to claim 1 , wherein a blending amount of the modified silicone oil or the compound having a skeleton derived from a modified silicone oil is 2 parts by mass or more to 80 parts by mass or less based on 100 parts by mass of a total blending amount of a thermosetting resin constituting the thermosetting resin composition and a curing agent to be optionally added.
5. The prepreg according to claim 1 , wherein the fiber substrate is a glass cloth.
6. The prepreg according to claim 1 , wherein the thermosetting resin composition further contains an epoxy resin.
7. The prepreg according to claim 1 , wherein the thermosetting resin composition further contains an inorganic filler.
8. The prepreg according to claim 1 , wherein the phase separation structure at a magnification of 2,000 times can be confirmed in the surface observation using an electron microscope.
9. The prepreg according to claim 1 , having a fine phase separation structure to such an extent that in the surface observation using an electron microscope, the phase separation structure cannot be confirmed at a magnification of 2,000 times, but the phase separation structure can be confirmed at a magnification of 10,000 times.
10. The prepreg according to claim 8 , wherein a number of island portions of the sea-island structure with a phase separation scale of 1.0 μm or more is 5 or more per 20 μm×20 μm in the surface observation using an electron microscope at a magnification of 2,000 times.
11. The prepreg according to claim 10 , wherein a number of island portions of the sea-island structure with a phase separation scale of 20 nm or more is 2 or more per 200 nm ×200 nm in the surface observation using an electron microscope at a magnification of 10,000 times.
12. A laminate prepared by lamination and molding using the prepreg according to claim 1 .
13. A printed wiring board manufactured by using the laminate according to claim 12 .
14. The prepreg according to claim 6 , wherein the thermosetting resin composition contains an inorganic filler.
15. The prepreg according to claim 1 , wherein the cyanate resin is a novolak cyanate resin and the unsaturated imide resin is a bismaleimide resin.
16. The prepreg according to claim 1 , wherein the island portion of the sea-island structure has a different elastic modulus than that of the sea portion of the sea-island structure.
17. The prepreg according to claim 1 , wherein the modified silicone oil or the compound having a skeleton derived from a modified silicone oil has a linear siloxane skeleton and also has hydrogen or a group other than a hydrocarbon group in a molecular structure thereof.
18. The prepreg according to claim 1 , wherein the modified silicone oil or the compound having a skeleton derived from a modified silicone oil has a reactive group in the molecular structure thereof, capable of reacting with a thermosetting resin of the thermosetting resin composition.
19. The prepreg according to claim 18 , wherein the modified silicone oil or the compound having a skeleton derived from a modified silicone oil, having said reactive group, also has a dimethyl silicone skeleton in a molecular structure thereof.
20. The prepreg according to claim 1 , wherein the modified silicone oil is contained in the sea portion of the sea-island structure.
21. The prepreg according to claim 1 , wherein the island portion and the sea portion of the sea-island structure have partially reacted with each other.
22. A prepreg comprising a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of the thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure, said phase separation structure being a sea-island structure,
wherein an occupying area ratio of an island portion of the sea-island structure per unit area on an observation surface of the layer made of a thermosetting resin composition is 10% or more to 45% or less,
wherein the thermosetting resin composition contains at least one of a cyanate resin and an unsaturated imide resin, and
wherein the modified silicone oil is a silicone oil modified with an epoxy group, a hydroxyl group, a methacryl group, a mercapto group, a carboxyl group, an alkoxy group or a silanol group.