Photosensitive element, photosensitive element roll, method for producing resist pattern, and electronic component
View Patent ↗A photosensitive element 1 comprises a support film 10 , a protective film (polypropylene film) 30 , and a photosensitive layer 20 which is arranged between the support film 10 and the protective film 30 , wherein the protective film 30 has a principal surface 30 a at a side of the photosensitive layer 20 and a principal surface 30 b at an opposite side of the principal surface 30 a , and the principal surface 30 a and the principal surface 30 b are smooth.
1. A photosensitive element, comprising:
a support film;
a polypropylene film; and
a photosensitive layer arranged between the support film and the polypropylene film, wherein
the polypropylene film has a first surface at a side of the photosensitive layer and a second surface at an opposite side to the first surface, and
an arithmetic mean roughness Ra of the first surface and the second surface is 0.05 μm or less.
2. A photosensitive element, comprising:
a support film;
a polypropylene film; and
a photosensitive layer arranged between the support film and the polypropylene film, wherein
the polypropylene film has a first surface at a side of the photosensitive layer and a second surface at an opposite side to the first surface, and
a maximum height Rmax of the first surface and the second surface is 0.5 μm or less.
3. The photosensitive element according to claim 1 , wherein a thickness of the photosensitive layer is less than 20 μm.
4. The photosensitive element according to claim 1 , wherein a thickness of the photosensitive layer is 10 μm or less.
5. The photosensitive element according to claim 1 , wherein an average light transmittance is 80% or more in a wavelength region of 400 to 700 nm.
6. The photosensitive element according to claim 1 , wherein the photosensitive layer contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator.
7. A method for producing a cured product, comprising:
a step of peeling the polypropylene film of the photosensitive element according to claim 1 ;
and then laminating the photosensitive layer and the support film on a base material; and
a step of irradiating the photosensitive layer with an active ray to form a photo-cured portion.
8. A photosensitive element roll, comprising:
a core, and
a photosensitive element which is wound around the core, wherein
the photosensitive element is the photosensitive element according to claim 1 .
9. A method for producing a resist pattern, comprising:
a step of peeling the polypropylene film of the photosensitive element according to claim 1 , and then laminating the photosensitive layer and the support film on a base material;
a step of irradiating a predetermined portion of the photosensitive layer with an active ray to form a photo-cured portion; and
a step of removing a portion other than the photo-cured portion in the photosensitive layer.
10. An electronic component, comprising a resist pattern obtained by the method for producing the resist pattern according to claim 9 .
11. The photosensitive element according to claim 2 , wherein a thickness of the photosensitive layer is less than 20 μm.
12. The photosensitive element according to claim 2 , wherein a thickness of the photosensitive layer is 10 μm or less.
13. The photosensitive element according to claim 2 , wherein an average light transmittance is 80% or more in a wavelength region of 400 to 700 nm.
14. The photosensitive element according to claim 2 , wherein the photosensitive layer contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator.
15. A method for producing a cured product, comprising:
a step of peeling the polypropylene film of the photosensitive element according to claim 2 ;
and then laminating the photosensitive layer and the support film on a base material; and
a step of irradiating the photosensitive layer with an active ray to form a photo-cured portion.
16. A photosensitive element roll, comprising:
a core, and
a photosensitive element which is wound around the core, wherein the photosensitive element is the photosensitive element according to claim 2 .
17. A method for producing a resist pattern, comprising: a step of peeling the polypropylene film of the photosensitive element according to claim 2 , and then laminating the photosensitive layer and the support film on a base material;
a step of irradiating a predetermined portion of the photosensitive layer with an active ray to form a photo-cured portion; and
a step of removing a portion other than the photo-cured portion in the photosensitive layer.
18. An electronic component, comprising a resist pattern obtained by the method for producing the resist pattern according to claim 17 .