Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler
View Patent ↗The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.
1. A liquid resin composition for electronic components which is used in sealing of electronic components, comprising (A) a liquid epoxy resin, (B) a curing agent containing a liquid aromatic amine, (F) a nonionic surfactant which is a silicone-modified epoxy resin that is liquid at ordinary temperature and is obtained by the reaction of an epoxy resin with an organosiloxane having a functional group reacting with an epoxy group, and (D) an inorganic filler.
2. The liquid resin composition for electronic components according to claim 1 , wherein the organsiloxane has a weight-average molecular weight of 500 to 5000.
3. The liquid resin composition for electronic components according to claim 1 or 2 , which is used in an electronic component device having an electronic component to be bump-bonded directly onto a wiring substrate.
4. The liquid resin composition for electronic components according to claim 3 , wherein the bump is lead-free metal.
5. The liquid resin composition for electronic components according to claim 3 , wherein the long side of the electronic component is 5 mm or more in length, and the distance between a wiring substrate constituting the electronic component device and the bump-connected surface of the electronic component is 80 μm or less.
6. The liquid resin composition for electronic components according to claim 3 , wherein the long side of the electronic component is 5 mm or more in length, and the electronic component is a semiconductor element having a dielectric layer with a dielectric constant of 3.0 or less.
7. The liquid resin composition for electronic components according to claim 1 , wherein the functional group reacting with an epoxy group is one or more groups selected from carboxyl groups, hydroxyl groups, phenolic hydroxyl groups, and mercapto groups, and wherein the organosiloxane has one or more functional groups in one molecule.
8. The liquid resin composition for electronic components according to claim 1 , wherein the nonionic surfactant as the component (F) is a silicone-modified epoxy resin obtained by the reaction of organosiloxane with an epoxy resin selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, and bisphenol AD epoxy resin.
9. The liquid resin composition for electronic components according to claim 1 , further comprising (E) silicone polymer particles.
10. The liquid resin composition for electronic components according to claim 9 , wherein the primary particles size of the silicone polymer particles as the component (E) is 0.05 to 10 μm.