Photosensitive resin composition, photosensitive film, and method for forming resist pattern
View Patent ↗Provided is a photosensitive resin composition comprising (A) a resin having a phenolic hydroxyl group; (B) an aliphatic or alicyclic epoxy compound having two or more oxirane rings; (C) a photosensitive acid generator; and (D) a solvent; wherein the photosensitive resin composition comprises 20 to 70 parts by mass of the component (B) relative to 100 parts by mass of the component (A).
1. A photosensitive resin composition comprising:
a component (A): a novolac resin that is a condensation product of phenol and aldehyde, wherein the phenol is at least one selected from the group consisting of phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, p-butylphenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethylphenol, 3,4,5-trimethylphenol, catechol, resorcinol, pyrogallol, α-naphthol, and β-naphthol, and wherein the aldehyde is at least one selected from the group consisting of formaldehyde, paraformaldehyde, acetaldehyde, and benzaldehyde;
a component (B): an aliphatic or alicyclic epoxy compound having two or more oxirane rings, wherein the component (B) has two or more glycidyl ether groups;
a component (C): a photosensitive acid generator selected from the group consisting of an iodonium salt, a triarylsulfonium salt, a phosphonium salt, a diazonium salt, a pyridinium salt, a diazoketone compound, a sulfone compound, a sulfonimide compound, and a diazomethane compound; and
a component (D): a solvent;
wherein the photosensitive resin composition comprises 25 to 65 parts by mass of the component (B) relative to 100 parts by mass of the component (A).
2. The photosensitive resin composition according to claim 1 , wherein the component (B) has three or more glycidyl ether groups.
3. A photosensitive film comprising:
a substrate; and
a photosensitive layer of the photosensitive resin composition according to claim 2 formed on the substrate.
4. A cured product of the photosensitive resin composition according to claim 2 .
5. A solder resist comprising a cured product of the photosensitive resin composition according to claim 2 .
6. An interlayer insulating film comprising a cured product of the photosensitive resin composition according to claim 2 .
7. A photosensitive film comprising:
a substrate; and
a photosensitive layer of the photosensitive resin composition according to claim 1 formed on the substrate.
8. A method for forming a resist pattern, comprising:
a step of forming the photosensitive layer of the photosensitive film according to claim 7 on a substrate;
a step of exposing the photosensitive layer to an active ray in order to form a predetermined pattern and performing a post-exposure heat-treatment; and
a step of developing the photosensitive layer after heat-treatment and heat-treating the obtained resin pattern.
9. A cured product of the photosensitive resin composition according to claim 1 .
10. A solder resist comprising a cured product of the photosensitive resin composition according to claim 1 .
11. An interlayer insulating film comprising a cured product of the photosensitive resin composition according to claim 1 .
12. A method for forming a resist pattern, comprising:
a step of applying the photosensitive resin composition according to claim 1 onto a substrate and drying the applied photosensitive resin composition so as to form a photosensitive layer;
a step of exposing the photosensitive layer to an active ray in order to form a predetermined pattern and performing a heat-treatment after exposure; and
a step of developing the photosensitive layer after heat-treatment and heat-treating the obtained resin pattern.