IP Library Granted Patent US 7,772,317
Granted Patent B2
US 7,772,317 · App. 12/092,838 · Granted Aug 10, 2010

Resin molding material

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Quick Facts
Patent No.
US 7,772,317
App. No.
12/092,838
Granted
Aug 10, 2010
Kind
B2
Abstract

Provided is a resin molding material having a remarkably excellent abrasion resistance while maintaining a favorable mechanical strength. The resin molding material is improved in deterioration of the abrasion resistance caused by an abrasive powder generated from an inorganic substance, particularly from a glass fiber or the like. The resin molding material contains a resin, a carbon substance and an inorganic substance. The carbon substance contains an adhesive carbon substance.

Claims (22)

1. A resin molding material, comprising: a resin; a carbon substance; and an inorganic substance, wherein

(i) the carbon substance is in a form of a fiber,

(ii) the carbon substance includes an adhesive carbon substance,

(iii) the carbon substance has a true specific gravity of 1.8 or more, and

(iv) the carbon substance has a half-power band width ratio (T1/T2) of 17 or lower, wherein T1 is a half-power band width of a diffraction peak of a surface (002) observed by an X-ray diffraction and T2 is a half-power band width of a diffraction peak of a standard silicon surface (111) observed under the same conditions.

2. A resin molding material according to claim 1 , wherein a content of the inorganic substance is 33 to 350 parts by mass based on 100 parts by mass of the resin.

3. A resin molding material according to claim 1 , wherein the resin comprises a phenolic resin.

4. A resin molding material according to claim 1 , wherein the inorganic substance is at least one kind selected from silica, glass, and wollastonite.

5. A resin molding material according to claim 4 , wherein the silica comprises a spherical silica.

6. A resin molding material according to claim 4 , wherein the glass comprises a glass fiber.

7. A resin molding material according to claim 4 , wherein a content of wollastonite is 80 to 200 parts by mass based on 100 parts by mass of the resin.

8. A resin molding material according to claim 1 , wherein the carbon substance in the form of fiber comprises a pitch-based carbon fiber.

9. A resin molding material according to claim 1 , wherein an average fiber length of the carbon substance in the form of fiber is 10 to 250 μm in a stage after the carbon substance is kneaded with a resin.

10. A resin molding material according to claim 1 , further comprising a lubricative substance.

11. A resin molding material according to claim 10 , wherein the lubricative substance is at least one kind selected from a polyethylene resin, a nylon resin, a fluororesin, and a polypropylene-based resin.

12. A resin molding material according to claim 11 , wherein the lubricative substance comprises a fluororesin.

13. A resin molding material according to claim 12 , wherein the fluororesin comprises polytetrafluoroethylene.

14. A resin molding material according to claim 10 , wherein an average particle diameter of the lubricative substance is 2 to 110 μm.

15. A resin molding material according to claim 10 , wherein a content of the lubricative substance is 0.2 to 35 parts by mass based on 100 parts by mass of the resin.

16. A resin molding material according to claim 1 , wherein a content of the adhesive carbon substance is 1.5 to 180 parts by mass based on 100 parts by mass of the resin.

17. A resin molding material according to claim 1 , wherein said true specific gravity of the carbon substance is 1.8 to 2.5.

18. A resin molding material according to claim 1 , wherein a blending proportion of the inorganic substance and the adhesive carbon substance is in a range of 0.19≦α≦233, where α is a value obtained by dividing parts by mass of the inorganic substance, based on 100 parts by mass of the resin, by parts by mass of the adhesive carbon substance based on 100 parts by mass of the resin.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2008
From: KAYA, MICHIKO; ODA, HIROTO; INADA, TEIICHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 020911/0132 →