Patent Assignment
Reel/Frame 020911/0132
Assignment of Assignor's Interest
Recorded: 2008-05-07
Pages: 2
Assignors
KAYA, MICHIKO
Executed: 2008-04-21
ODA, HIROTO
Executed: 2008-04-21
INADA, TEIICHI
Executed: 2008-04-21
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, JAPAN
Covered Property
(1)
Resin Molding Material
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →