IP Library Granted Patent US 9,446,576
Granted Patent B2
US 9,446,576 · App. 13/445,344 · Granted Sep 20, 2016

Adhesive agent, adhesive material using the same, and method of use thereof

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Quick Facts
Patent No.
US 9,446,576
App. No.
13/445,344
Granted
Sep 20, 2016
Kind
B2
Abstract

An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A). and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the monomer (A) contains an isophthalic acid.

Claims (25)

1. A method of using an adhesive agent comprising:

an application step of applying a second adherend to a first adherend via an adhesive layer containing the adhesive agent;

a heating step of heating the first adherend and the second adherend under a condition such that a temperature of the adhesive layer is 200° C. or higher; and

a peeling step of peeling the adhesive layer and the second adherend from the first adherend subjected to the heating step;

wherein the adhesive agent comprises a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting the following (1), (2), and (3), or the following (2) and (3):

(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.;

(2) the condensation resin has a polyoxyalkanediyl group; and

(3) the monomer (A) contains an isophthalic acid; and

wherein a structure derived from the monomer (B) in the structural unit has a polyoxyalkanediyl group.

2. The method according to claim 1 , wherein the first adherend and the second adherend are applied at 0 to 50° C. in the application step.

3. The method according to claim 1 , wherein the adhesive layer and the second adherend are peeled from the first adherend at 0 to 50° C. in the peeling step.

4. The method according to claim 1 , wherein the adhesive layer peeled in the peeling step is reused in another application step.

5. A method of using an adhesive material comprising:

an application step of applying the adhesive material to an adherend such that the adhesive layer is disposed on a side of the adherend;

a heating step of heating the adherend under a condition such that the temperature of the adhesive material is 200° C. or higher; and

a peeling step of peeling the adhesive material from the adherend subjected to the heating step;

wherein the adhesive material comprises a substrate and an adhesive layer containing an adhesive agent formed on the substrate;

wherein the adhesive agent comprises a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting the following (1), (2), and (3), or the following (2) and (3):

(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.;

(2) the condensation resin has a polyoxyalkanediyl group; and

(3) the monomer (A) contains an isophthalic acid; and

wherein a structure derived from the monomer (B) in the structural unit has a polyoxyalkanediyl group.

6. The method according to claim 5 , wherein the adhesive material is applied to the adherend at 0 to 50° C. in the application step.

7. The method according to claim 5 , wherein the adhesive material is peeled from the adherend at 0 to 50° C. in the peeling step.

8. The method according to claim 5 , wherein the adhesive material peeled in the peeling step is reused in another application step.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2012
From: MASUDA, KATSUYUKI; YAMAGUCHI, MASATOSHI; SHINADA, EIICHI; FUKUYAMA, TAKEHIRO; SAKAIRI, YOSHIHIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 029037/0366 →