IP Library Granted Patent US 8,461,332
Granted Patent B2
US 8,461,332 · App. 13/527,995 · Granted Jun 11, 2013

Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate

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Quick Facts
Patent No.
US 8,461,332
App. No.
13/527,995
Granted
Jun 11, 2013
Kind
B2
Abstract

A method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I) below); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices.

Claims (13)

1. A thermosetting resin composition characterized by comprising a curing agent (A) having an acidic substituent and an unsaturated maleimido group, and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher,

wherein the curing agent (A) is produced through a method characterized by comprising reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent represented by the following formula I:

(wherein R 1 , which is an acidic substituent, represents a hydroxyl group, a carboxyl group, or a sulfonic acid group; R 2 represents a hydrogen atom, a C1-C5 aliphatic hydrocarbon group, or a halogen atom; x is an integer from 1 to 5; y is an integer from 0 to 4; and the sum of x and y is 5),

wherein the compound (B) which is cured with the curing agent is an amine compound having at least two primary amino groups in a molecule thereof which is a 6-substituted guanamine compound represented by the following formula (V):

(wherein R 6 represents a phenyl group, a methyl group, an allyl group, a butyl group, a methoxy group, or a benzyloxy group), and

wherein the composition further contains a carboxyl-group-containing acidic compound (C) having an acid dissociation constant (pKa) of 4.05 or more in an infinitely diluted aqueous solution at 25° C.

2. A thermosetting resin composition as described in claim 1 , wherein the curing agent (A) having an acidic substituent and an unsaturated maleimido group is represented by the following formula (II):

(wherein R 1 , R 2 , x, and y have the same meanings as defined above in formula (I), and R 3 represents a hydrogen atom, a C1-C5 aliphatic hydrocarbon group, or a halogen atom); or (III):

(wherein R 1 , R 2 , x, and y have the same meanings as defined above in formula (I); each of R 4 and R 5 represents a hydrogen atom, a C1-C5 aliphatic hydrocarbon group, or a halogen atom; A represents an alkylene group, an alkylidene group, an ether group, a sulfonyl group, or a group represented by the following formula (IV)):

3. A thermosetting resin composition as described in claim 1 , which further contains an epoxy resin (D) having at least two epoxy groups in a molecule thereof.

4. A thermosetting resin composition as described in claim 1 , which further contains an inorganic filler (E).

5. A prepreg produced by impregnating or coating a base with a thermosetting resin composition as recited in claim 1 and B-staging the composition.

6. A laminated sheet produced through laminate molding of a prepreg as recited in claim 5 .

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
CHANGE OF ADDRESS OF ASSIGNEE Recorded May 3, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 030343/0150 →