Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

1. A photosensitive adhesive composition comprising:

(A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH;

(B) a photo-polymerizable compound; and

(C) a photopolymerization initiator,

wherein said polyimide is a polyimide obtainable by reacting a tetra carboxylic acid dianhydride and diamine, and

wherein said diamine includes an aliphatic ether diamine expressed by the following general formula (III) to the extent of 10 to 90 mol % of the total diamine:

wherein Q 1 , Q 2 and Q 3 are independently alkylene groups having 1 to 10 carbon atoms and n 1 is an integer from 1 to 80.

2. A photosensitive adhesive composition according to claim 1 ,

wherein the acid value of said polyimide is 80 to 150 mg/KOH.

3. A photosensitive adhesive composition according to claim 1 , further comprising (D) a thermosetting resin.

4. A photosensitive adhesive composition according to claim 3 ,

wherein said thermosetting resin is an epoxy resin.

5. A photosensitive adhesive composition according to claim 1 ,

wherein said diamine further includes an aromatic diamine expressed by the following general formulae (I) or (II):

6. A photosensitive adhesive composition according to claim 5 ,

wherein the glass transition temperature of the polyimide is 150° C. or less.

7. A photosensitive adhesive composition according to claim 5 ,

wherein said diamine further includes a siloxane diamine expressed by the following general formula (IV) to the extent of 1 to 20 mol % of the total diamine:

wherein R 1 and R 2 are both alkylene groups having 1 to 5 carbon atoms or a phenylene group which may be substituted, R 3 , R 4 , R 5 and R 6 are independently an alkyl group having 1 to 5 carbon atoms, phenyl group or phenoxy group, and n 2 is an integer from 1 to 5, and

wherein the glass transition temperature of the polyimide is 150° C. or less.

8. A photosensitive adhesive composition according to claim 1 ,

wherein the weight average molecular weight of said polyimide is 5000 to 150000.

9. A photosensitive adhesive composition according to claim 1 ,

wherein the glass transition temperature of said polyimide is 150° C. or less.

10. A photosensitive adhesive composition according to claim 1 ,

wherein the molecular weight of said photo-polymerizable compound is 2000 or less, and said photo-polymerizable compound is contained to the extent of 20 weight parts or more relative to 100 weight parts of polyimide.

11. A photosensitive adhesive composition according to claim 1 ,

wherein, when a silicon chip is bonded to a glass substrate via the photosensitive adhesive composition, a shear adhesive strength at 25° C. of 5 MPa or more is obtained.

12. A photosensitive adhesive composition according to claim 1 ,

wherein, when a silicon chip is bonded to a glass substrate via the photosensitive adhesive composition, a shear adhesive strength at 260° C. of 0.5 MPa or more is obtained.

13. A photosensitive adhesive composition according to claim 1 ,

wherein the storage modulus at 100° C. after light exposure is 0.01 to 10 MPa.

14. A photosensitive adhesive composition according to claim 1 ,

wherein, after exposure, the storage modulus at 260° C. after heat curing is 1 MPa or more.

15. A photosensitive adhesive composition according to claim 1 ,

wherein, after exposure, the temperature at which there is a mass reduction of 5% in a thermogravimetric analysis after heat curing, is 260° C. or more.

16. An adhesive film comprising a photosensitive adhesive composition according to claim 1 .

17. An adhesive sheet comprising:

a substrate; and

an adhesive film according to claim 16 provided on one surface thereof.

18. An adhesive pattern formed by forming an adhesive layer comprising a photosensitive adhesive composition according to claim 1 on an adherend, exposing this adhesive layer to light via a photomask, and developing the adhesive layer after exposure with an alkaline aqueous solution.

19. A semiconductor wafer with an adhesive layer, comprising:

a semiconductor wafer; and

an adhesive layer comprising a photosensitive adhesive composition according to claim 1 provided on one surface thereof.

20. A semiconductor device comprising a semiconductor chip bonded to an adherend using a photosensitive adhesive composition according to claim 1 .

21. An electronic component comprising a semiconductor device according to claim 20 .