Patent Assignment
Reel/Frame 020695/0279
Assignment of Assignor's Interest
Recorded: 2008-03-25
Pages: 3
Assignors
KAWAMORI, TAKASHI
Executed: 2008-01-11
MASUKO, TAKASHI
Executed: 2008-01-11
KATOGI, SHIGEKI
Executed: 2008-01-11
YASUDA, MASAKI
Executed: 2008-01-11
Assignee
HITACHI CHEMICAL COMPANY, LTD
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Photosensitive Adhesive Composition, and Obtained Using the Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer with Adhesive Layer, Semiconductor Device and Electronic Part
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →