Phenolic resin composition
Provided is a phenolic resin composition containing: an epoxy resin curing agent that contains a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and an epoxy resin. In these Formulae, each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom or an alkyl group; at least two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups; each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); each of R 11 and R 14 independently represents a hydrogen atom or a hydroxy group; and each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group.
1. A phenolic resin composition, comprising:
an epoxy resin curing agent that comprises a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and
an epoxy resin:
wherein each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom, or an alkyl group having from 1 to 8 carbon atoms; and at least two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups;
wherein each of m and n independently represents a positive number; and each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); and
wherein R 11 represents a hydrogen atom or a hydroxy group; each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group having from 1 to 8 carbon atoms; and R 14 represents a hydrogen atom or a hydroxy group,
wherein a content of the hydroxybenzene derivative is from 30% by mass to 80% by mass with respect to a total mass of the epoxy resin curing agent.
2. The phenolic resin composition according to claim 1 , wherein a mass ratio of a content of the phenol resin with respect to a content of the hydroxybenzene derivative (phenol resin/hydroxybenzene derivative) is from 50/50 to 70/30.
3. The phenolic resin composition according to claim 1 , wherein the epoxy resin has an epoxy equivalent weight of from 100 to 300.
4. The phenolic resin composition according to claim 1 , wherein the epoxy resin has a partial structure represented by the following Formula (IV):
wherein each of R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 and R 48 independently represents a hydrogen atom, a hydrocarbon group having from 1 to 10 carbon atoms, or an alkoxy group having from 1 to 10 carbon atoms.
5. The phenolic resin composition according to claim 4 , wherein the epoxy resin having the partial structure represented by Formula (IV) is a compound represented by the following Formula (V):
wherein each of R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 and R 48 independently represents a hydrogen atom or a hydrocarbon group having from 1 to 10 carbon atoms; and n represents an integer from 0 to 3.
6. The phenolic resin composition according to claim 1 , further comprising an inorganic filler.
7. A phenolic resin composition, comprising:
an epoxy resin curing agent that comprises a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and
an epoxy resin:
wherein each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom, or an alkyl group having from 1 to 8 carbon atoms; and two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups;
wherein each of m and n independently represents a positive number; and each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); and
wherein R 11 represents a hydrogen atom or a hydroxy group; each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group having from 1 to 8 carbon atoms; and R 14 represents a hydrogen atom or a hydroxy group, and
a content of the hydroxybenzene derivative is from 30% by mass to 80% by mass with respect to a total mass of the epoxy resin curing agent.
8. The phenolic resin composition according to claim 7 , wherein R 2 and R 4 in Formula (I) are hydroxy groups.
9. The phenolic resin composition according to claim 7 , wherein R 1 and R 3 in Formula (I) are hydroxy groups.
10. The phenolic resin composition according to claim 7 , wherein a mass ratio of a content of the phenol resin with respect to a content of the hydroxybenzene derivative (phenol resin/hydroxybenzene derivative) is from 50/50 to 70/30.
11. The phenolic resin composition according to claim 7 , wherein the epoxy resin has an epoxy equivalent weight of from 100 to 300.
12. The phenolic resin composition according to claim 7 , wherein the epoxy resin has a partial structure represented by the following Formula (IV):
wherein each of R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 and R 48 independently represents a hydrogen atom, a hydrocarbon group having from 1 to 10 carbon atoms, or an alkoxy group having from 1 to 10 carbon atoms.
13. The phenolic resin composition according to claim 12 , wherein the epoxy resin having the partial structure represented by Formula (IV) is a compound represented by the following Formula (V):
wherein each of R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 and R 48 independently represents a hydrogen atom or a hydrocarbon group having from 1 to 10 carbon atoms; and n represents an integer from 0 to 3.
14. The phenolic resin composition according to claim 7 , further comprising an inorganic filler.
15. A heat conductive material for an electric component, the heat conductive material comprising:
a phenolic resin composition, containing:
an epoxy resin curing agent that comprises a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and
an epoxy resin:
wherein each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom, or an alkyl group having from 1 to 8 carbon atoms; and at least two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups;
wherein each of m and n independently represents a positive number; and each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); and
wherein R 11 represents a hydrogen atom or a hydroxy group; each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group having from 1 to 8 carbon atoms; and R 14 represents a hydrogen atom or a hydroxy group,
wherein a content of the hydroxybenzene derivative is from 30% by mass to 80% by mass with respect to a total mass of the epoxy resin curing agent.
16. An electric component comprising a heat conductive material, the heat conductive material comprising:
a phenolic resin composition, containing:
an epoxy resin curing agent that comprises a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and
an epoxy resin:
wherein each of R 1 , R 2 , R 3 , R 4 and R 5 independently represents a hydroxy group, a hydrogen atom, or an alkyl group having from 1 to 8 carbon atoms; and at least two of R 1 , R 2 , R 3 , R 4 and R 5 are hydroxy groups;
wherein each of m and n independently represents a positive number; and each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); and
wherein R 11 represents a hydrogen atom or a hydroxy group; each of R 12 and R 13 independently represents a hydrogen atom or an alkyl group having from 1 to 8 carbon atoms; and R 14 represents a hydrogen atom or a hydroxy group,
wherein a content of the hydroxybenzene derivative is from 30% by mass to 80% by mass with respect to a total mass of the epoxy resin curing agent.