Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

1. A photosensitive resin composition comprising:

(A) an alkali-soluble resin having a phenolic hydroxyl group;

(B) a compound that generates an acid by light; and

(C) an acrylic resin having a group that crosslinks with the component (A),

wherein the component (C) is an acrylic resin comprising a structural unit represented by the following formula (1):

wherein R 1 represents a hydrogen atom or a methyl group, and R 2 represents an organic group having a group that crosslinks with the component (A),

wherein the group that cross links with the component (A) is epoxy group, and

wherein the photosensitive resin composition comprises 1-50 parts by mass of the component (C) with respect to 100 parts by mass of the component (A),

wherein the component (C) further comprises a structural unit represented by the following formula (2)

wherein R 3 represents a hydrogen atom or a methyl group, and R 4 represents a C4-20 alkyl group,

wherein the component (C) further comprises a structural unit represented by the following formula (3) or (4), and

wherein the component (A) comprises at least one selected from the group consisting of a poly(hydroxvstvrene)-based resin, a phenol resin, a polybenzooxazole precursor, a poly(hvdroxyphenylene)ether, a polynaphthol and a mixture thereof.

2. The photosensitive resin composition according to claim 1 , wherein the component (A) is a phenol resin.

3. The photosensitive resin composition according to claim 1 , wherein the component (B) is an o-quinone diazide compound.

4. The photosensitive resin composition according to claim 1 , further comprising (E) an acrylic resin that does not contain a group that crosslinks with the component (A).

5. The photosensitive resin composition according to claim 1 , further comprising (F) a heat acid generator.

6. The photosensitive resin composition according to claim 1 , wherein the compositional ratio of the structural unit represented by formula (1) in the acrylic resin of component (C) is 1 to 25 mol % with respect to the total amount of component (C).

7. A method for manufacturing a patterned cured film, the method comprising coating the photosensitive resin composition according to claim 1 onto a substrate and drying the coated photosensitive resin composition to form a resin film, exposing the resin film to light, developing the exposed resin film with an aqueous alkali solution to form a patterned resin film, and heating the patterned resin film.

8. The method for manufacturing a patterned cured film according to claim 7 , wherein a heating temperature in the heating of the patterned resin film is no higher than 250° C.

9. An electronic component having a patterned cured film produced by the method for manufacturing a patterned cured film according to claim 7 as an interlayer insulating layer or a surface protective layer.

10. The electronic component having a patterned cured film produced by the method for manufacturing a patterned cured film according to claim 7 as a cover coat layer, core, collar or underfill.