Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition

1. An epoxy resin composition containing (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has at least one structure selected from structures represented by the following Chemical Formulas (2), (3) and (4) and has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more, wherein in Chemical Formulas (2), (3) and (4) * shows a part bonded directly to a phosphorus atom in Chemical Formula (1):

2. A prepreg comprising a base material impregnated with the epoxy resin composition according to claim 1 .

3. A support-provided resin film comprising a laminate of the epoxy resin composition according to claim 1 on a support.

4. A support-provided resin film according claim 3 , wherein the support consists of a copper foil or an aluminum foil.

5. A metal foil clad laminated plate comprising metal foil laminate on the prepreg according to claim 2 .

6. A metal foil laminated plate comprising a metal foil laminate on the support-provided resin film according to claim 3 .

7. A multilayer printed circuit board comprising at least one layer of a layer comprising the prepreg according to claim 2 .

8. A multilayer printed circuit board comprising at least one layer of a layer comprising the support-provided resin film according to claim 3 .

9. A multilayer printed circuit board comprising at least one layer of a layer comprising the metal foil clad laminated plate according to claim 6 .