IP Library Granted Patent US 9,639,189
Granted Patent B2
US 9,639,189 · App. 14/732,817 · Granted May 2, 2017

Conductive pattern formation method, conductive pattern-bearing substrate, and touch panel sensor

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Quick Facts
Patent No.
US 9,639,189
App. No.
14/732,817
Granted
May 2, 2017
Kind
B2
Abstract

A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Claims (32)

1. A conductive film substrate comprising:

a. a substrate; and

b. a cured resin layer on the substrate, the cured resin layer comprising a first surface opposite the substrate, the first surface having a portion including a conductive film and a portion without a conductive film, wherein the portion of the cured resin layer including the conductive film comprises a cured portion projecting from the cured resin layer, the cured portion projecting the from the cured resin layer abutting the conductive film.

2. The conductive film substrate according to claim 1 , wherein a step difference Ha between the portion including the conductive film and the portion without the conductive film is 1 μm or less.

3. The conductive film substrate according to claim 1 , wherein a step difference Ha between the portion including the conductive film and the portion without the conductive film is 0.7 μm or less.

4. The conductive film substrate according to claim 1 , wherein a step difference Ha between the portion including the conductive film and the portion without the conductive film is 0.5 μm or less.

5. The conductive film substrate according to claim 1 , wherein the conductive film comprises an organic conductive material.

6. The conductive film substrate according to claim 1 , wherein the conductive film comprises conductive fiber.

7. The conductive film substrate according to claim 1 , wherein the conductive film comprises silver fiber.

8. The conductive film substrate according to claim 1 , wherein a minimum optical transmittance of the conductive film substrate in a wavelength band of 450 to 650 nm is 80% or higher.

9. A conductive film substrate comprising:

a. a photosensitive resin layer comprising:

i. a photopolymerization initiator the activity of which is decreased by oxygen;

ii. a first surface; and

iii. a second surface opposite the first surface; and

b. a conductive film comprising:

i. a first surface; and

ii. a second surface opposite the first surface, the second surface abutting the first surface of the photosensitive resin layer.

10. The conductive film substrate according to claim 9 , further comprising a support film on the first surface of the conductive film.

11. The conductive film substrate according to claim 10 , wherein the support film includes a gas barrier layer.

12. The conductive film substrate according to claim 9 , further comprising a protective film on the second surface of the photosensitive resin layer.

13. The conductive film substrate according to claim 9 , further comprising a substrate abutting the second surface of the photosensitive resin layer.

14. The conductive film substrate according to claim 9 , wherein the conductive film includes metal fiber.

15. The conductive film substrate according to claim 9 , wherein the conductive film includes a conductive polymer.

16. The conductive film substrate according to claim 9 , wherein the photosensitive resin layer comprises:

a. a portion cured in a first exposure;

b. a portion cured in a second exposure; and

c. lacks a boundary between the portion cured in the first exposure and the portion cured in the second exposure.

17. The conductive film substrate according to claim 9 , wherein the first surface of the photosensitive resin layer abutting the second surface of the conductive film comprises:

a. a cured region; and

b. an insufficiently cured region.

18. The conductive film substrate according to claim 17 , wherein the photosensitive resin layer further comprises a resin cured layer abutting the insufficiently cured region and opposite the conductive film.

Assignments (3)
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2017
From: YAMAZAKI, HIROSHI; IGARASHI, YOSHIMI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 041330/0897 →