Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same
View Patent ↗Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).
1. A thermosetting resin composition comprising a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a polybutadiene (B) modified with maleic anhydride; and an inorganic filler (C), a total content of the polyimide compound (A) and the polybutadiene (B) being 80% by mass or more based on a total mass of all resin components contained in the thermosetting resin composition.
2. The thermosetting resin composition according to claim 1 , wherein a weight average molecular weight of the polybutadiene (B) is from 500 to 25,000.
3. The thermosetting resin composition according to claim 1 , wherein the number of a maleic anhydride-derived group included in the polybutadiene (B) is from 1 to 10 in one molecule.
4. The thermosetting resin composition according to claim 1 , wherein a weight average molecular weight of the polyimide compound (A) is from 800 to 1,500.
5. The thermosetting resin composition according to claim 1 , wherein the inorganic filler (C) is silica.
6. A resin film for interlayer insulation, comprising the thermosetting resin composition according to claim 1 .
7. A composite film comprising a first resin layer comprising the thermosetting resin composition according to claim 1 ; and a second resin layer.
8. The composite film according to claim 7 , wherein the second resin layer comprises a second thermosetting resin composition containing a polyfunctional epoxy resin (D), an active ester curing agent (E), and a phenolic hydroxyl group-containing polybutadiene-modified polyimide resin (F).
9. The composite film according to claim 8 , wherein an equivalent ratio ((ester group)/(epoxy group)) of an ester group of the active ester curing agent (E) to an epoxy group of the polyfunctional epoxy resin (D) in the second thermosetting resin composition is from 0.3 to 1.5.
10. The composite film according to claim 8 , wherein the second thermosetting resin composition further comprises a phosphorus-based curing accelerator (G).
11. The composite film according to claim 7 , wherein a dielectric tangent of a cured material at 5 GHz is 0.005 or less.
12. A printed wiring board comprising a cured material of the resin film for interlayer insulation according to claim 6 .
13. A method for producing a printed wiring board, comprising a step of laminating the resin film for interlayer insulation according to claim 6 .
14. A printed wiring board comprising a cured material of the composite film according to claim 7 .
15. A method for producing a printed wiring board, comprising a step of laminating the composite film according to claim 7 .
16. The thermosetting resin composition according to claim 1 , wherein the number of a maleic anhydride-derived group included in the polybutadiene (B) is from 1 to 5 in one molecule.
17. The thermosetting resin composition according to claim 1 , wherein the number of a maleic anhydride-derived group included in the polybutadiene (B) is from 1 to 6 in one molecule.