Patent Assignment
Reel/Frame 043004/0392
Assignment of Assignor's Interest
Recorded: 2017-07-14
Pages: 7
Assignors
KASAHARA, AYA
Executed: 2017-06-08
IRINO, TETSUROU
Executed: 2017-06-08
MURAI, HIKARI
Executed: 2017-06-08
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, Resin Film for Interlayer Insulation, Composite Film, Printed Wiring Board, and Method for Producing Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →