IP Library Granted Patent US 9,228,100
Granted Patent B2
US 9,228,100 · App. 13/814,293 · Granted Jan 5, 2016

Liquid composition, and resistor film, resistor element and circuit board using same

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Quick Facts
Patent No.
US 9,228,100
App. No.
13/814,293
Granted
Jan 5, 2016
Kind
B2
Abstract

There is provided a liquid composition that can form a resistor exhibiting a stable resistance value. One mode of the liquid composition of the invention is a liquid composition comprising (a) an epoxy resin, (b) carbon black particles, (c) carbon nanotubes and (d) a solvent with a vapor pressure of less than 1.34×10 3 Pa at 25° C.

Claims (18)

1. A liquid composition comprising

(a) an epoxy resin,

(b) carbon black particles,

(c) carbon nanotubes, the carbon nanotubes having an outer diameter of 3 nm or greater and a length greater than or equal to 100 nm and less than or equal to 15 μm,

(d) a solvent with a vapor pressure of less than 1.34×10 3 Pa at 25° C., and

(e) having a viscosity allowing for discharge from an ink-jet apparatus,

wherein the content of the (c) carbon nanotubes is 0.1 to 10 parts by mass with respect to 100 parts by solid mass of the (b) carbon black particles.

2. The liquid composition according to claim 1 , wherein the mean dispersion particle size of the (b) carbon black particles is no greater than 500 nm, and the maximum dispersion particle size is no greater than 2 μm.

3. The liquid composition according to claim 1 , wherein the content of the (b) carbon black particles is 10 to 80 vol %, based on the total solid volume of the liquid composition.

4. The liquid composition according to claim 1 , wherein the viscosity is no greater than 50 mPa·s at 25° C.

5. The liquid composition according to claim 1 , wherein the (a) epoxy resin is a glycidyl etherified condensation product of a phenol and an aldehyde.

6. The liquid composition according to claim 1 , which further comprises (e) a curing agent, the (e) curing agent comprising the condensation product of a phenol and an aldehyde.

7. A resistor film formed by removing the solvent from the liquid composition according to claim 1 by heating.

8. A resistor element having the resistor film according to claim 7 .

9. A circuit board having the resistor element according to claim 8 formed on a substrate.

10. A resistor film formed by printing or coating the liquid composition according to claim 1 on a substrate to form a film of the liquid composition, and removing the solvent from the film of the liquid composition by heating.

11. A resistor element having the resistor film according to claim 10 .

12. A circuit board having the resistor element according to claim 11 formed on a substrate.

Assignments (3)
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2013
From: KUMASHIRO, YASUSHI; MARUYAMA, NAOKI; INADA, MAKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 029937/0464 →