Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

1. A photosensitive adhesive comprising:

(A) a polymer having the ability to be developed by a solvent or a developer solution;

(B) a photo-polymerizable compound; and

(C) a photopolymerization initiator,

wherein the photosensitive adhesive has properties that, when a silicon chip is bonded to a glass substrate via the photosensitive adhesive, the photosensitive adhesive provides a shear adhesive strength of 5 MPa or more at 25° C., and the photosensitive adhesive has film forming properties.

2. The photosensitive adhesive according to claim 1 , further comprising (D) a thermosetting resin.

3. The photosensitive adhesive according to claim 1 , wherein said polymer having the ability to be developed by a solvent or a developer solution is a polyimide.

4. The photosensitive adhesive according to claim 1 wherein, when a silicon chip is bonded to a glass substrate via the photosensitive adhesive, the photosensitive adhesive provides a shear adhesive strength of 0.5 MPa or more at 260° C., and the photosensitive adhesive has film forming properties.

5. The photosensitive adhesive according to claim 1 , wherein, when a silicon chip is bonded to a glass substrate via the photosensitive adhesive, the photosensitive adhesive provides a shear adhesive strength of 0.5 MPa or more at 260° C., and the photosensitive adhesive has film forming properties.

6. An adhesive film comprising the photosensitive adhesive according to claim 1 .

7. An adhesive sheet comprising:

a substrate; and

the adhesive film according to claim 6 provided on one surface of the substrate.

8. An adhesive pattern formed by forming an adhesive layer comprising the photosensitive adhesive according to claim 1 on an adherend, exposing the adhesive layer to light, and developing the adhesive layer after exposure.

9. A semiconductor wafer with an adhesive layer, comprising:

a semiconductor wafer; and

an adhesive layer comprising the photosensitive adhesive according to claim 1 provided on one surface of said semiconductor wafer.

10. A semiconductor device comprising a semiconductor chip bonded to an adherend using the photosensitive adhesive according to claim 1 .

11. An electronic component comprising the semiconductor device according to claim 10 .

12. A method for producing a semiconductor device, comprising the steps of:

forming an adhesive pattern by forming an adhesive layer consisting of the photosensitive adhesive according to claim 1 on an adherend, light-exposing the adhesive layer; and developing the adhesive layer after exposure; and

bonding another adherend to the adherend via the adhesive pattern.

13. The photosensitive adhesive according to claim 1 , wherein said polymer having the ability to be developed by a solvent or a developer solution has an imido skeleton in its main chain.

14. The photosensitive adhesive according to claim 1 , wherein the photosensitive adhesive has a storage modulus at 100° C. after light exposure of 0.01 to 10 MPa.

15. The photosensitive adhesive according to claim 1 , wherein the photosensitive adhesive has a storage modulus at 260° C. after light exposure and heat curing of 1 MPa or more.

16. The photosensitive adhesive according to claim 1 , wherein a temperature at which a mass reduction of the photosensitive adhesive is 5% in a thermogravimetric analysis after heat curing is preferably 260° C. or more.

17. The photosensitive adhesive according to claim 1 , wherein a content of the photo-polymerizable compound is 20 to 80 weight parts relative to 100 weight parts of the polymer having the ability to be developed by a solvent or a developer solution.

18. The photosensitive adhesive according to claim 1 , wherein a content of the photo-polymerizable compound is 30 to 60 weight parts relative to 100 weight parts of the polymer having the ability to be developed by a solvent or a developer solution.

19. The photosensitive adhesive according to claim 3 , wherein a content of the photo-polymerizable compound is 20 to 80 weight parts relative to 100 weight parts of the polyimide.

20. The photosensitive adhesive according to claim 3 , wherein a content of the photo-polymerizable compound is 30 to 60 weight parts relative to 100 weight parts of the polyimide.

21. The photosensitive adhesive according to claim 1 , wherein a molecular weight of the photo-polymerizable compound is 2000 or less.