IP Library Granted Patent US 9,067,906
Granted Patent B2
US 9,067,906 · App. 14/056,771 · Granted Jun 30, 2015

Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate

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Quick Facts
Patent No.
US 9,067,906
App. No.
14/056,771
Granted
Jun 30, 2015
Kind
B2
Abstract

The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.

Claims (3)

1. A polyvalent carboxylic acid condensate comprising a component represented by the following formula (X):

(In formula (X), R x represents a divalent group with an aliphatic hydrocarbon ring, wherein the aliphatic hydrocarbon ring is optionally substituted with a halogen atom or a straight-chain or branched hydrocarbon group, multiple R x groups in the same molecule can be the same or different, and n represents an integer of 1 or greater.)

2. A polyvalent carboxylic acid condensate according to claim 1 , wherein R x represents a divalent organic group derived from hydrogenated terephthalic acid.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →