Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
View Patent ↗The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
1. A printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers, of said plurality of layers, wherein the adhesion assisting agent layer contains an epoxy resin as an indispensable component, and wherein the adhesion assisting agent layer containing an epoxy resin as an indispensable component contains (A) an epoxy resin, (B) rubber particles, and (C) an epoxy resin curing agent.
2. The printed wiring board according to claim 1 , wherein the thickness of the adhesion assisting agent layer is in a range of 0.1 to 10 μm.
3. The printed wiring board according to claim 1 , wherein the component (A) is a novolak epoxy resin or contains a novolak epoxy resin.
4. The printed wiring board according to claim 1 , wherein the component (A) has a biphenyl structure.
5. The printed wiring board according to claim 1 , wherein the component (B) is crosslinked rubber particles.
6. The printed wiring board according to claim 1 , wherein the component (B) is at least one substance selected from the group consisting of acrylonitrile-butadiene rubber particles, carboxylic acid-modified acrylonitrile-butadiene rubber particles, and butadiene rubber-acrylic resin core shell particles.
7. The printed wiring board according to claim 1 , wherein the component (B) is added in an amount of 0.5 to 20 parts by weight to the component (A) 100 parts by weight.
8. The printed wiring board according to claim 1 , wherein the component (C) is a novolak phenol resin.
9. The printed wiring board according to claim 1 , wherein the component (C) is a cresol novolak phenol resin having a triazine ring.
10. A printed wiring board comprising solder resist in the outermost layer and an adhesion assisting agent layer between an insulating layer of the printed wiring board and the solder resist, wherein the adhesion assisting agent layer contains an epoxy resin as an indispensable component, and wherein the adhesion assisting agent layer containing an epoxy resin as an indispensable component contains (A) an epoxy resin, (B) rubber particles, and (C) an epoxy resin curing agent.
11. The printed wiring board according to claim 10 , wherein the thickness of the adhesion assisting agent layer is in a range of 0.1 to 10 μm.
12. The printed wiring board according to claim 10 , wherein the component (A) is a novolak epoxy resin or contains a novolak epoxy resin.
13. The printed wiring board according to claim 10 , wherein the component (A) has a biphenyl structure.
14. The printed wiring board according to claim 10 , wherein the component (B) is crosslinked rubber particles.
15. The printed wiring board according to claim 10 , wherein the component (B) is at least one substance selected from the group consisting of acrylonitrile-butadiene rubber particles, carboxylic acid-modified acrylonitrile-butadiene rubber particles, and butadiene rubber-acrylic resin core shell particles.
16. The printed wiring board according to claim 10 , wherein the component (B) is added in an amount of 0.5 to 20 parts by weight to the component (A) 100 parts by weight.
17. The printed wiring board according to claim 10 , wherein the component (C) is a novolak phenol resin.
18. The printed wiring board according to claim 10 , wherein the component (C) is a cresol novolak phenol resin having a triazine ring.