IP Library Granted Patent US 12,077,666
Granted Patent B2
US 12,077,666 · App. 16/759,630 · Granted Sep 3, 2024

Resin composition, cured product, molding and method for producing same, and film capacitor and method for producing same

Inventors: Yasunori Kawabata (Tokyo, JP); Kasumi Nakamura (Tokyo, JP); Tatsuhito Fukuhara (Tokyo, JP); Takahide Iwaya (Tokyo, JP)
Assignee: RESONAC CORPORATION
C08L63/00H01G4/224C08K3/042C08K2003/2227C08K3/36C08K5/34922C08K7/22C08K2201/005C08L63/10
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Quick Facts
Patent No.
US 12,077,666
App. No.
16/759,630
Granted
Sep 3, 2024
Kind
B2
Abstract

A resin composition for casting, containing a curable component and expandable graphite. A molded body including an element and a sealing portion that seals the element, in which the sealing portion contains the resin composition or a cured product thereof.

Claims (31)

1. A resin composition for casting, comprising:

a curable component comprising a curable resin and a curing agent, wherein the curing agent includes an acid anhydride;

expandable graphite, wherein a major axis of the expandable graphite is 800 μm or less; and

a filler containing silica,

wherein a viscosity in a case in which the viscosity is measured using a B type viscometer under conditions of 40° C. and 60 rpm is 8.0 Pa·s or less,

wherein a content of silica is 30% by mass or more based on a total mass of the resin composition excluding the mass of solvent, and

wherein a content of the curing agent is 15% to 55% by mass based on the total mass of the resin composition excluding the mass of solvent.

2. The resin composition according to claim 1 , wherein the curable component includes an epoxy resin.

3. A cured product of the resin composition according to claim 1 .

4. A molded body comprising: an element and a sealing portion that seals the element,

wherein the sealing portion contains the resin composition according to claim 1 or a cured product thereof.

5. A method for producing a molded body, the method comprising casting the resin composition according to claim 1 to obtain a molded body.

6. A film capacitor comprising: a film capacitor element and a sealing portion that seals the film capacitor element,

wherein the sealing portion contains the resin composition according to claim 1 or a cured product thereof.

7. A method for producing a film capacitor, the method comprising casting the resin composition according to claim 1 to obtain a film capacitor comprising a sealing portion that seals a film capacitor element.

8. The resin composition according to claim 1 , wherein a major axis of the expandable graphite is more than 200 μm.

9. The resin composition according to claim 1 , wherein a content of the expandable graphite is less than 35% by mass.

10. The resin composition according to claim 1 , wherein the curable component includes a thermosetting resin.

11. The resin composition according to claim 1 , wherein the filler further contains aluminum hydroxide.

12. The resin composition according to claim 1 , wherein the filler further contains melamine cyanurate.

13. The resin composition according to claim 1 , wherein an average particle size of the filler is 2 to 30 μm.

14. The resin composition according to claim 1 , wherein a content of the filler is 30% to 80% by mass.

15. The resin composition according to claim 1 , wherein a major axis of the expandable graphite is 500 μm or less and the curable component includes a thermosetting resin.

16. The resin composition according to claim 1 , wherein a content of the expandable graphite is less than 35% by mass and the curable component includes a thermosetting resin.

17. A resin composition for casting, comprising:

a curable component, wherein the curable component includes a thermosetting resin and a curing agent, wherein the curing agent includes an acid anhydride;

expandable graphite; and

a filler containing silica,

wherein a viscosity in a case in which the viscosity is measured using a B type viscometer under conditions of 40° C. and 60 rpm is 8.0 Pa·s or less,

wherein a content of silica is 30% by mass or more based on a total mass of the resin composition excluding the mass of solvent, and

wherein a content of the curing agent is 15% to 55% by mass based on the total mass of the resin composition excluding the mass of solvent.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2020
From: KAWABATA, YASUNORI; NAKAMURA, KASUMI; FUKUHARA, TATSUHITO; IWAYA, TAKAHIDE
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 054006/0032 →