Patent Assignment
Reel/Frame 066547/0677
Change of Address
Recorded: 2024-02-09
Pages: 26
Assignor
RESONAC CORPORATION
Executed: 2023-10-01
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Properties
(598)
Powder, Electrode and Battery Comprising Such a Powder
Radically Polymerizable Putty-Like Resin Composition, Sealing Agent and Crack Repairing Method
Liquid Resin Composition for Sealing and Electronic Component Device
Adhesive Film for Multilayer Printed-Wiring Board
SiC WAFER AND MANUFACTURING METHOD OF SiC WAFER
Application:
16/471,061 →
Publication:
US US20200020777A1
P-Type Sic Epitaxial Wafer and Production Method Therefor
SiC EPITAXIAL WAFER AND METHOD FOR PRODUCING SAME
Application:
16/476,412 →
Publication:
US US20190376206A1
Treatment Agent for Treating Particles, Water-Repellent Particles and Production Method Therefor, Water-Repellent Layer, and Penetration Preventing Structure
Treatment Agent for Treating Fibers, Fibers and Production Method Therefor, and Fiber Sheet and Production Method Therefor
Water-Repellent Agent, Water-Repellent Structure, and Production Method for Said Structure
Application:
16/482,898 →
Publication:
US US20200010725A1
Photosensitive Resin Composition, Dry Film Using Same, Printed Wiring Board, and Printed Wiring Board Manufacturing Method
Production Method for Aqueous Solution of Zinc Halide
Application:
16/612,480 →
Publication:
US US20200095132A1
Liquid Resin Composition for Compression Molding and Electronic Component Apparatus
Liquid Resin Composition for Sealing and Electronic Component Apparatus
Method for Producing Silica Carrier, and Silica Carrier
Susceptor, Cvd Apparatus, and Method for Manufacturing Epitaxial Wafer
Application:
16/644,250 →
Publication:
US US20210066113A1
Hexagonal Boron Nitride Powder and Method for Producing the Same, and Composition and Heat Dissipation Material Using the Same
Polishing Solution, Polishing Solution Set, and Polishing Method
Application:
16/650,691 →
Publication:
US US20210189176A1
Coating Solution, Method for Producing Coating Film, and Coating Film
Coating Liquid, Production Method for Coating Film, and Coating Film
SiC SINGLE CRYSTAL GROWTH CRUCIBLE, SiC SINGLE CRYSTAL MANUFACTURING METHOD, AND SiC SINGLE CRYSTAL MANUFACTURING APPARATUS
Fullerene-Containing Lubricating Oil Composition and Method for Producing Same
Cause-Effect Sentence Analysis Device, Cause-Effect Sentence Analysis System, Program, and Cause-Effect Sentence Analysis Method
Charge-Transport Polymer and Organic Electronic Element
Resin Composition, Cured Product, Molding and Method for Producing Same, and Film Capacitor and Method for Producing Same
Prepreg, Laminate, and Production Methods Therefor, as Well as Printed Circuit Board and Semiconductor Package
Magnetic Recording Medium and Magnetic Read/Write Apparatus
Adhesive Film
Polishing Liquid, Polishing Liquid Set, and Polishing Method
Application:
16/962,375 →
Publication:
US US20210062041A1
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Method of Producing Epoxy Resin Cured Product, Composite Material, Insulating Member, Electronic Appliance, Structural Material, and Vehicle
Compound Powder
Application:
16/971,796 →
Publication:
US US20200391287A1
Sintered Valve Guide and Method for Producing Same
Anisotropic Thermal Conductive Resin Fiber, Anisotropic Thermal Conductive Resin Member, and Manufacturing Method of These
Resin Composition, Polishing Pad, and Method for Producing Polishing Pad
Temporary Protective Film for Semiconductor Sealing Molding, Lead Frame with Temporary Protective Film, Sealed Molded Body with Temporary Protective Film, and Method for Producing Semiconductor Device
Polymer Physical Property Prediction Device, Recording Medium, and Polymer Physical Property Prediction Method
METHOD OF EVALUATING SiC SUBSTRATE, METHOD OF MANUFACTURING SiC EPITAXIAL WAFER, AND METHOD OF MANUFACTURING SiC DEVICE
Method for Manufacturing Negative Electrode Material for Lithium-Ion Secondary Battery, and Method for Manufacturing Lithium-Ion Secondary Battery
Application:
17/041,572 →
Publication:
US US20210091373A1
Negative Electrode Material for Lithium Ion Secondary Battery, Production Method for Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode Material Slurry for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode Material Slurry for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Application:
17/042,177 →
Publication:
US US20210028441A1
Thermosetting Resin Composition, Prepreg, Resin-Coated Metal Foil, Laminate, Printed Wiring Board, and Semiconductor Package
Resin Member, Method for Producing Resin Member and Heat Storage Body
Application:
17/044,328 →
Publication:
US US20210024803A1
Method for Suppressing Corrosion Under Heat-Insulating Material, and Paste for Suppressing Corrosion Under Heat-Insulating Material
Latex for Adhesive Composition and Adhesive Composition
Photosensitive Element, Resin Composition for Forming Barrier Layer, Method for Forming Resist Pattern, and Method for Manufacturing Printed Wiring Board
Resin Composition, Heat Storage Material, and Article
Application:
17/054,167 →
Publication:
US US20210246349A1
Method of Producing Boron Trichloride
Photosensitive Film and Method for Forming Permanent Mask Resist
Resin Composition, Resin Member, Resin Sheet, B-Stage Sheet, C-Stage Sheet, Metal Foil with Resin, Metal Substrate, and Power Semiconductor Device
Application:
17/059,253 →
Publication:
US US20210206906A1
Assisted Magnetic Recording Medium and Magnetic Storage Device
Application:
17/079,856 →
Publication:
US US20210134325A1
Aluminum Alloy Forging and Production Method Thereof
Application:
17/083,593 →
Publication:
US US20210123123A1
SiC SUBSTRATE AND SiC SINGLE CRYSTAL MANUFACTURING METHOD
Application:
17/113,220 →
Publication:
US US20210172085A1
Susceptor and Chemical Vapor Deposition Apparatus
Application:
17/211,634 →
Publication:
US US20210217648A1
Anisotropic Conductive Film and Method for Producing the Anisotropic Conductive Film Including a Base Material Having Recesses and Solder Particles Formed Inside the Recesses
Solder Particles
Solder Particles and Method for Producing Solder Particles
Application:
17/255,988 →
Publication:
US US20210229222A1
Aluminum Alloy Member for Forming Fluoride Film and Aluminum Alloy Member Having Fluoride Film
Negative Electrode Material for Lithium-Ion Secondary Battery, Negative Electrode for Lithium-Ion Secondary Battery, Lithium-Ion Secondary Battery and Method of Producing Negative Electrode for Lithium-Ion Secondary Battery
Copolymer for Binder for Non-Aqueous Battery Electrode, and Slurry for Producing Non-Aqueous Battery Electrode
Copper-Clad Laminate, Printed Wiring Board, Semiconductor Package and Method for Producing Copper-Clad Laminate
Resin Composition, Heat Storage Material, and Article
Application:
17/261,571 →
Publication:
US US20210261706A1
Acrylic Resin, Producing Method Thereof, Resin Composition Set, Heat Storage Material, and Article
Method for Decomposing Flavonoid Glycoside and Method for Producing Flavonoid
Slurry and Polishing Method
Slurry, Screening Method, and Polishing Method
Method for Decomposing Flavonoid Glycoside and Method for Producing Flavonoid
Anode for Electrolytic Synthesis and Method for Producing Fluorine Gas or Fluorine Containing Compound
Anode for Electrolytic Synthesis and Method for Producing Fluorine Gas
Application:
17/266,728 →
Publication:
US US20210310138A1
SiC SINGLE CRYSTAL, METHOD OF MANUFACTURING SiC INGOT, AND METHOD OF MANUFACTURING SiC WAFER
Packing Material for Ion Chromatography and Production Method Therefor
Composition, Production Method for Composition, and Production Method for Unsaturated Compound
Application:
17/269,059 →
Publication:
US US20210276943A1
Composition, Production Method for Composition, and Production Method for Unsaturated Compound
Composition, Method for Cleaning Adhesive Polymer, Method for Producing Device Wafer, and Method for Regenerating Support Wafer
Method and Supply Equipment for Supplying Fluorine Gas-Containing Gas
Radical Polymerizable Resin Composition and Structure Repairing Material
Application:
17/274,527 →
Publication:
US US20220049039A1
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Electronic Component and Method for Manufacturing Electronic Component
Slurry and Polishing Method
Organic Electronic Material and Use Thereof
Organic Electronic Material and Organic Electronic Element
Fluorine Gas Production Device
Material Search Apparatus, Method, and Program
Application:
17/286,930 →
Publication:
US US20210357546A1
Thermodynamic Equilibrium State Prediction Device, Prediction Method and Prediction Program
Application:
17/288,185 →
Publication:
US US20210406433A1
Method for Producing Alcohol and Catalyst for Producing Alcohol
Temporary Protective Film for Producing Semiconductor Device, Reel Body, and Method for Producing Semiconductor Device
Oil-In-Water-Type Skin External Agent
Application:
17/288,983 →
Publication:
US US20210401681A1
Material Design Device, Material Design Method, and Material Design Program
Technical Knowledge Prediction Apparatus, Method, and Program
Negative Electrode Material for Lithium-Ion Secondary Cell, Method for Manufacturing Negative Electrode Material for Lithium-Ion Secondary Cell, Negative Electrode Material Slurry for Lithium-Ion Secondary Cell, Negative Electrode for Lithium-Ion Secondary Cell, and Lithium-Ion Secondary Cell
Semiconductor Device Production Method and Laminate Film for Temporary Fixation Material
Application:
17/296,547 →
Publication:
US US20220028722A1
Method for Producing Bonded Object and Semiconductor Device and Copper Bonding Paste
Friction Material Composition, Friction Material and Friction Member
Guard Column and Method for Producing Guard Column
Epoxy Resin B-Stage Film, Epoxy Resin Cured Film and Method of Producing Epoxy Resin Cured Film
Application:
17/312,401 →
Publication:
US US20220025107A1
Magnetic Sensor and Magnetic Sensor Manufacturing Method
Magnetic Sensor Circuit and Magnetic Field Detection Device
Etching Method Using Halogen Fluoride and Method for Producing Semiconductor
Laminate, Printed Wiring Board, Semiconductor Package, and Method for Manufacturing Laminate
Adhesion Removal Method and Film-Forming Method
Application:
17/414,376 →
Publication:
US US20220064777A1
Resin Composition for Temporary Fixing Use, Resin Film for Temporary Fixing Use, Sheet for Temporary Fixing Use, and Method for Manufacturing Semiconductor Device
Wiring Board and Method for Manufacturing the Same
Wiring Board and Production Method for Same
Composition for Producing N-Vinyl Carboxylic Acid Amide
Adhesion Removal Method and Film-Forming Method
Adhesion Removal Method and Film-Forming Method
Method for Producing Chloroprene Polymer Latex
Application:
17/418,529 →
Publication:
US US20220056246A1
Chloroprene Polymer Latex and Method for Producing Same
Application:
17/418,556 →
Publication:
US US20220162427A1
Cell recovery apparatus, cell recovery method, cell separation system, and cell separation method
Method for Manufacturing Cell Suspension and Method for Manufacturing Adherent Cells
Application:
17/419,985 →
Publication:
US US20220315898A1
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Negative Electrode Material for Lithium Ion Secondary Battery, Method of Producing Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Application:
17/420,143 →
Publication:
US US20220085370A1
Decomposing/Cleaning Composition, Method for Cleaning Adhesive Polymer, and Method for Producing Device Wafer
Method for Producing Chloroprene Graft Copolymer Latex, Adhesive Containing Same and Adhesion Method
Isoprene-Based Polymer Latex Composition
Anisotropic Heat-Conducting Resin Member and Heat-Transmitting Substrate
Application:
17/422,440 →
Publication:
US US20220089930A1
Catalyst for Olefin Polymerization and Method for Producing Polar Group-Containing Olefin Polymer
Composition for Adhesives, Outer Package Material for Electricity Storage Devices, and Method for Producing Same
Reactive Hot-Melt Adhesive Composition, and Bonded Body and Method for Producing Same
Titanium Oxide Production Method
Application:
17/431,343 →
Publication:
US US20220135422A1
Polishing Liquid and Polishing Method
Method for Producing Silicon-Containing Oxide-Coated Aluminum Nitride Particles and Method for Producing Exoergic Resin Composition
Inorganic Particle Dispersion Resin Composition and Manufacturing Method of Inorganic Particle Dispersion Resin Composition
Method for Producing Electronic Component Device and Laminated Film Used Therefor
Method for Manufacturing Electronic Component Device
Curable Composition, Heat Storage Material, and Article
Application:
17/437,412 →
Publication:
US US20220162491A1
1,3-Butanediol
Application:
17/438,117 →
Publication:
US US20220251011A1
Polishing Solution, Polishing Solution Set, Polishing Method, and Defect Suppressing Method
Polishing Solution and Polishing Method
Semiconductor Device Having Dolmen Structure and Method for Manufacturing Same
Polishing Solution, Dispersion, Polishing Solution Production Method, and Polishing Method
Semiconductor Device Having Dolmen Structure and Manufacturing Method Therefor, and Support Piece Formation Laminate Film and Manufacturing Method Therefor
Semiconductor Device Having Dolmen Structure and Manufacturing Method Therefor, and Support Piece Formation Laminate Film and Manufacturing Method Therefor
Method for Manufacturing Semiconductor Device Having Dolmen Structure, Method for Manufacturing Support Piece, and Laminated Film
Method for Producing Aqueous Solution of N-Vinyl Carboxylic Acid Amide Copolymer
Application:
17/439,449 →
Publication:
US US20220153897A1
Resin Formed Article and Method for Producing Resin Formed Article
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayer Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayer Printed Wiring Board
Application:
17/440,238 →
Publication:
US US20220179308A1
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayer Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayer Printed Wiring Board
Application:
17/440,269 →
Publication:
US US20220155681A1
Photosensitive Resin Composition, Photosensitive Resin Film, Printed Wiring Board, Semiconductor Package, and Method for Producing Printed Wiring Board
Cooling Structure
Application:
17/440,554 →
Publication:
US US20220149692A1
Resin Composition, Film and Cured Product
Application:
17/442,010 →
Publication:
US US20220177670A1
SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER
Magnetic Sensor
Semiconductor Wafer Evaluation Apparatus and Semiconductor Wafer Manufacturing Method
Method of Inspecting Lubricating Oil Composition and Method of Producing Lubricating Oil Composition
Aluminum Alloy Forging and Method of Producing the Same
Application:
17/548,769 →
Publication:
US US20220195573A1
Method for Manufacturing Laminate
Application:
17/587,196 →
Publication:
US US20230062863A1
Laminate, Released Laminate, and Method for Manufacturing Resonator
Application:
17/587,476 →
Publication:
US US20230053754A1
Piezoelectric Film and Resonator
Application:
17/587,499 →
Publication:
US US20230059734A1
Packing Material for Size Exclusion Chromatography and Method for Producing the Same
Application:
17/591,774 →
Publication:
US US20220176273A1
Etching Method for Silicon Nitride and Production Method for Semiconductor Element
Etching Method and Method for Manufacturing Semiconductor Element
Gas Treatment Method and Gas Treatment Device
Corrosion-Resistant Member
Application:
17/595,413 →
Publication:
US US20220195605A1
Etching Method
Laminate
Dry Etching Method, Production Method for Semiconductor Element, and Cleaning Method
Image Analysis Apparatus, Method, and Program
Sulfur Dioxide Mixture, and Method of Producing the Same, and Filling Container
Application:
17/595,708 →
Publication:
US US20220250908A1
Method for Producing Fluorine Gas and Device for Producing Fluorine Gas
Method for Producing Alcohol
Application:
17/595,722 →
Publication:
US US20220251009A1
Method for Producing Highly Polymerizable N-Vinyl Carboxylic Acid Amide Monomer
Method for Producing Highly Polymerizable N-Vinyl Carboxylic Acid Amide Monomer
Method for Producing Fluorine Gas
Highly Heat-Resistant Anatase-Type Titanium Oxide and Method for Producing the Same
Application:
17/595,895 →
Publication:
US US20220324719A1
Adhered Substance Removing Method and Film-Forming Method
Application:
17/595,955 →
Publication:
US US20220157599A1
Thermoplastic Resin Material with Primer, and Resin-Resin Conjugate
Application:
17/595,957 →
Publication:
US US20220154009A1
Method for Producing Fluorine Gas and Device for Producing Fluorine Gas
Application:
17/595,958 →
Publication:
US US20220154353A1
Method for Producing Fluorine Gas and Device for Producing Fluorine Gas
Application:
17/595,964 →
Publication:
US US20220228272A1
Magnetic Sensor
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Catalyst for Air Electrodes, Air Electrode and Metal Air Secondary Battery
Application:
17/598,877 →
Publication:
US US20220158201A1
Adhesive Agent Set and Method for Manufacturing Structural Body
Resin Composition, Prepreg, Laminate, Multilayer Printed Wiring Board, and Semiconductor Package
Coating Liquid, Composite Material, and Coating Film
Composite Material, Sheet, and Heat Insulator
Optically Softening Resin Composition, Method for Producing Softened Product of Optically Softening Resin Composition, Curable Resin Composition and Cured Product of Same, and Patterned Film and Method for Producing Same
Sound-Absorbing Material
Application:
17/602,276 →
Publication:
US US20220165244A1
Aluminum Alloy Member for Forming Fluoride Film Thereon and Aluminum Alloy Member Having Fluoride Film
Method for Producing Substrate Having Through-Silicon Vias, Substrate Having Through-Silicon Vias, and Copper Paste for Through-Silicon via Formation
Method for Producing Lubricating Oil Composition, and Lubricating Oil Composition
Moisture-Curable Hot-Melt Adhesive Composition, Bonded Object, and Garment
Metal Removal Method, Dry Etching Method, and Production Method for Semiconductor Element
Method for Measuring Concentration of Fluorine Gas in Halogen Fluoride-Containing Gas Using Mass Spectrometer
Method for Measuring Concentration of Fluorine Gas Contained in Halogen Fluoride-Containing Gas by Ultraviolet Spectroscopy
Method for Evaluating Pickup Performance, Integrated Dicing/Die-Bonding Film, Method for Evaluating and Selecting Integrated Dicing/Die-Bonding Film, and Method for Manufacturing Semiconductor Device
Adsorbent Particles, Method for Producing Adsorbent Particles, Base Material Particles, Filling Column and Method for Recovering Rare Earth Element
Magnetic Sensor
Application:
17/609,657 →
Publication:
US US20220236344A1
Method for Producing Bromine Pentafluoride
Cancer Cell Proliferation Suppression Agent and Composition for Suppressing Proliferation of Cancer Cells
Application:
17/610,190 →
Publication:
US US20220257621A1
Polyamideimide Resin Composition and Method for Producing Polyamideimide Resin
Electrically Conductive Polymer Composition and Method for Stably Storing Electrically Conductive Polymer Solution
Method for Removing Metal Compound
Ornament and Silver Mirror Film-Forming Liquid
Plasma Etching Method
Application:
17/611,754 →
Publication:
US US20220254607A1
Composition for Aqueous Coating Liquid
Electrically-Insulating Resin Composition and Electrical Insulator
Semiconductor Device Manufacturing Method
Method for Manufacturing Electronic Component Device, and Electronic Component Device
Method for Manufacturing Electronic Component Device and Electronic Component Device
Method for Producing Chloroprene-Based-Polymer Latex
Dry Etching Method, Method for Manufacturing Semiconductor Element, and Cleaning Method
Method of Manufacturing Passivation Film
Corrosion-Resistant Member
Compound, Molded Article, and Cured Product
Method for Producing Purified Chloroprene-Based-Polymer Latex
Method for Producing Fluorine Gas and Device for Producing Fluorine Gas
Method for Producing Fluorine Gas and Device for Producing Fluorine Gas
Application:
17/613,867 →
Publication:
US US20220275523A1
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame with Temporary Protective Film, Encapsulation Molded Body with Temporary Protective Film, and Method for Manufacturing Semiconductor Device
Method for Producing Highly Polymerizable N-Vinyl Carboxlyic Acid Amide Monomer
Method for Producing Highly Polymerizable N-Vinyl Carboxylic Acid Amide Monomer
Laminate and Method for Producing Same
Laminate and Method for Producing Same
Device for Producing Fluorine Gas and Light Scattering Detector
Chloroprene Copolymer Latex and Production Method Therefor
Chloroprene Copolymer Latex Composition and Molded Article of Same
Application:
17/615,286 →
Publication:
US US20220242987A1
Method for Removing Adhering Material and Film Forming Method
Application:
17/615,308 →
Publication:
US US20220220612A1
Primer-Equipped Thermoplastic Resin Member, and Resin-Resin Conjugate
Application:
17/615,320 →
Publication:
US US20220219403A1
Method for Producing Alcohol
Application:
17/615,436 →
Publication:
US US20220227691A1
Method for Recovering Olefin
Application:
17/615,466 →
Publication:
US US20220234024A1
Method for Producing Fluorine Gas and Device for Producing Fluorine Gas
Application:
17/615,485 →
Publication:
US US20220235471A1
Hot Melt Adhesive Composition
Adsorbent Particles, Base Particle, Packed Column, and Method for Recovering Rare-Earth Element
Adhesive Agent and Adhesion Method
Polypropylene-Based Resin Composition Containing Ultrahigh Molecular Weight Propylene (Co)Polymer
Plant Vitalizing Agent Containing Exogenous Elicitor and Endogenous Elicitor and Use Thereof
Plant Vitalizer Containing Cello-Oligosaccharide, and Use for Said Plant Vitalizer
Application:
17/619,801 →
Publication:
US US20220369568A1
Plant Activator Containing Amino Acid or Salt Thereof, and Oligosaccharide, and Use Thereof
Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film, Multilayer Printed Wiring Board, and Semiconductor Package
Cell Scaffold Material, Cell Culture Support, and Cell Culture Method
Application:
17/623,049 →
Publication:
US US20220228096A1
Photosensitive Resin Composition, Photosensitive Resin Film, Method for Producing Cured Product, Laminate, and Electronic Component
Application:
17/624,846 →
Publication:
US US20220267484A1
Material Design System, Material Design Method, and Material Design Program
Application:
17/628,292 →
Publication:
US US20220261510A1
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Application:
17/631,857 →
Publication:
US US20220285684A1
Water-In-Oil Emulsion Composition
Application:
17/632,725 →
Publication:
US US20220280396A1
Resin Composition, Heat Storage Material, and Article
Application:
17/633,211 →
Publication:
US US20220290025A1
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayer Printed Wiring Board, Semiconductor Package, and Production Method for Multilayer Printed Wiring Board
Application:
17/634,927 →
Publication:
US US20220276558A1
Lithium Ion-Conducting Oxide
Application:
17/635,422 →
Publication:
US US20220311001A1
Lead-Free Low-Melting Glass Composition and Low-Melting Glass Composite Material and Low-Melting Glass Paste Containing Lead-Free Low-Melting Glass Composition, and Sealing Structure, Electrical and Electronic Part and Coated Part Using Same
Lithium Ion-Conducting Oxide
Application:
17/638,529 →
Publication:
US US20220359907A1
Negative Electrode Material for Lithium Ion Secondary Battery, Method of Manufacturing Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode Material Slurry for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Method of Manufacturing Semiconductor Device and Collet
Heat Exchanger
Application:
17/640,318 →
Publication:
US US20220341671A1
Polyamideimide Resin, Resin Composition, and Semiconductor Device
Temporary Protective Film, Reel Body, Packaging Body, Package Body, Temporary Protective Body, and Method for Producing Semiconductor Device
Application:
17/641,101 →
Publication:
US US20220285200A1
Encapsulating Material for Compression Molding and Electronic Part Device
Magnetic Recording Medium, Magnetic Storage Apparatus, and Method for Manufacturing Magnetic Recording Medium
Application:
17/656,964 →
Publication:
US US20220319546A1
Powder, Electrode and Battery Comprising Such a Powder
Application:
17/672,785 →
Publication:
US US20220209223A1
SiC EPITAXIAL WAFER, PRODUCTION METHOD THEREFOR, AND DEFECT IDENTIFICATION METHOD
Magnetic Sensor
Application:
17/688,363 →
Publication:
US US20220308126A1
EVALUATION METHOD AND MANUFACTURING METHOD OF SiC EPITAXIAL WAFER
Application:
17/707,743 →
Publication:
US US20220223482A1
Water-Repellent Agent, Water-Repellent Structure, and Production Method for Said Structure
Application:
17/712,205 →
Publication:
US US20220228029A1
Mixture of Inositol Derivatives
Application:
17/714,240 →
Publication:
US US20220226358A1
Gas Supply Apparatus and Gas Supply Method
Application:
17/725,655 →
Publication:
US US20220251703A1
Material Design Apparatus, Material Design Method, and Material Design Program
Magnetic Sensor
Machine Learning Device, Method, Program, and System
Information Processing Device, Reading Comprehension Support Method, and Program
Polishing Method, Machine Device Manufacturing Method, and Machine Device
Conductive Adhesive Composition, and Method for Producing Connection Structure
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Adhesive for Semiconductor, Production Method Therefor, and Semiconductor Device and Production Method Therefor
Copper Paste for Joining, Method for Manufacturing Joined Body, and Joined Body
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Resin Molded Article
Application:
17/766,011 →
Publication:
US US20220339833A1
Foam-Molded Product, Method for Manufacturing Foam-Molded Product, and Method for Suppressing Appearance Defect of Foam-Molded Product
Injection Molded Product
Photosensitive Resin Film, Resist Pattern Forming Method, and Wiring Pattern Forming Method
Application:
17/767,655 →
Publication:
US US20240111211A1
Method for Manufacturing Electronic Component Device and Electronic Component Device
Application:
17/768,746 →
Publication:
US US20240112941A1
Resin Composition for Temporary Fixation, Substrate-Conveying Support Tape, and Electronic Equipment Device Manufacturing Method
Substrate-Conveying Support Tape and Electronic Apparatus/Device Production Method
Resin Composition for Provisional Fixation, Support Tape for Substrate Conveyance and Method for Producing Electronic Device
Film-Like Adhesive and Method for Evaluating Ease of Splitting, Dicing/Die-Bonding Integrated Film and Method for Manufacturing, and Semiconductor Device
Application:
17/771,020 →
Publication:
US US20230005782A1
Polishing Liquid, Polishing Liquid Set, and Polishing Method
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Method for Producing Decomposing/Cleaning Composition
Information Processing System, Information Processing Method, and Storage Medium
Application:
17/774,883 →
Publication:
US US20220392584A1
Information Processing System, Information Processing Method, and Storage Medium
Input Data Generation System, Input Data Generation Method, and Storage Medium
Molded Body, and Method for Producing Molded Body
Application:
17/775,037 →
Publication:
US US20220402445A1
Composite Material, Manufacturing Method Therefor, Negative Electrode Material for Lithium-Ion Secondary Battery, and the Like
Application:
17/775,477 →
Publication:
US US20220399538A1
Method for Dispersing Conductive Particles, and Electrostatic Adsorption Device
Electrode Binder for a Nonaqueous Secondary Battery and Nonaqueous Secondary Battery Electrode
Nonaqueous Secondary Battery Electrode, Electrode Slurry, and Nonaqueous Secondary Battery
Application:
17/777,530 →
Publication:
US US20230335737A1
Curable Composition and Article
Application:
17/779,129 →
Publication:
US US20230002661A1
Curable Composition Set and Article
Application:
17/779,130 →
Publication:
US US20230016868A1
Composition Containing Compound Having Polyoxyalkylene Chain
Composition Set Containing Compound Having Polyoxyalkylene Chain
Connector Production Method and Adhesive Film
Method for Producing N-Vinylacetamide and Pyrolysis Device
Magnetic Sensor and Method for Manufacturing Magnetic Sensor
Lithium-Ion-Conductive Oxide Sintered Body and Use Thereof
Application:
17/785,354 →
Publication:
US US20230017483A1
Method for Evaluating Orientation of Nanowire in Transparent Material, Method for Managing Steps in Which Said Method Is Used, and Method for Producing Resin Cured Article
Application:
17/785,527 →
Publication:
US US20230025211A1
Production Method for Polymer Composition
Application:
17/785,610 →
Publication:
US US20230027915A1
Lithium Ion-Conductive Oxide and Use for Same
Application:
17/785,619 →
Publication:
US US20230026839A1
Gasification Furnace Operating Method and Gasification Furnace
Acceleration Sensor, Acceleration Evaluation Method Using Same, and Load Provided with Acceleration Sensor
High-Molecular-Weight Polymer Sheet and Method for Producing Same
Application:
17/785,735 →
Publication:
US US20230046460A1
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Radically Polymerizable Resin Composition and Cured Product Thereof
Application:
17/788,455 →
Publication:
US US20230058675A1
Connection Structure and Manufacturing Method Therefor
Solder Bump Forming Member, Method for Manufacturing Solder Bump Forming Member, and Method for Manufacturing Electrode Substrate Provided with Solder Bump
Composition Including Chloroprene Polymer, Molded Body, and Method for Producing Molded Body
(Meth)Acrylic Acid Ester Compound Having Isocyanate Group and Method for Producing Same
Latex Composition, Molded Body, and Method for Producing Molded Body
Application:
17/790,643 →
Publication:
US US20230059522A1
Composition, and Method for Cleaning Adhesive Polymer
Resin Composition for Molding and Electronic Component Apparatus
Application:
17/791,534 →
Publication:
US US20230092703A1
Adhesive Film Production Apparatus and Adhesive Film Production Method
Adhesive Film Production Apparatus and Reel Bodies
Reel Body, Method for Manufacturing Reel Body, and Method for Manufacturing Article
Polishing Agent, Stock Solution for Polishing Agent, and Polishing Method
Application:
17/792,227 →
Publication:
US US20230094224A1
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayered Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayered Printed Wiring Board
Manufacturing Method for Coating Liquid and Manufacturing Method for Thermal Insulating Material
Application:
17/795,874 →
Publication:
US US20230114711A1
Manufacturing Method for Thermal Insulating Material
Negative Electrode Material for Lithium-Ion Secondary Battery and Method of Producing Same, Negative Electrode for Lithium-Ion Secondary Battery, and Lithium-Ion Secondary Battery
Application:
17/796,253 →
Publication:
US US20230084916A1
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Cmp Polishing Liquid and Polishing Method
Application:
17/797,333 →
Publication:
US US20230054199A1
Negative Electrode for Secondary Cell, Secondary Cell, and Negative Electrode Material for Secondary Cell
Application:
17/798,470 →
Publication:
US US20230071493A1
Photosensitive Resin Composition, Method for Selecting Photosensitive Resin Composition, Method for Producing Patterned Cured Film, and Method for Producing Semiconductor Device
Thermally Conductive Sheet and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Thermally Conductive Sheet, and Method of Manufacturing Thermally Conductive Sheet
Photosensitive Resin Composition, Method of Producing Patterned Cured Product Using the Same, and Cured Product of Photosensitive Resin Composition
Application:
17/823,426 →
Publication:
US US20230259026A1
Silicon-Containing Oxide-Coated Aluminum Nitride Particle and Method of Manufacturing the Same
SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SiC EPITAXIAL WAFER
Application:
17/862,933 →
Publication:
US US20230026927A1
Connected Electronic Members
SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SiC EPITAXIAL WAFER
Application:
17/879,118 →
Publication:
US US20230039660A1
Information Processing System, Information Processing Method, and Storage Medium
Application:
17/904,295 →
Publication:
US US20230060812A1
Adhesive Film and Reel Body
Application:
17/905,415 →
Publication:
US US20230163489A1
Polyimide Precursor, Resin Composition, Insulated Electric Wire, and Flexible Substrate
Bonded Body of Metal and Resin, and Method for Bonding Metal and Resin
Application:
17/912,370 →
Publication:
US US20230132089A1
Photosensitive Resin Composition, Photosensitive Element, and Method for Producing Wiring Board
Application:
17/913,016 →
Publication:
US US20230145264A1
Electrode Body, Method for Manufacturing Electrode Body, and Electrochemical Element
Application:
17/913,546 →
Publication:
US US20230104309A1
Production Method for Semiconductor Packages
Method for Evaluating Sample Containing Cell Support-Derived Components
Application:
17/914,309 →
Publication:
US US20230104790A1
Method for Manufacturing Fertilizer
Polishing Liquid and Polishing Method
Polishing Liquid and Polishing Method
Application:
17/918,203 →
Publication:
US US20230128096A1
Photosensitive Film, Photosensitive Element, and Method for Producing Laminate
Application:
17/922,867 →
Publication:
US US20230161248A1
Primer, Substrate Equipped with Primer Layer, Method for Producing Substrate Equipped with Primer Layer, Semiconductor Device, and Method for Producing Semiconductor Device
Application:
17/925,014 →
Publication:
US US20230183415A1
Cmp Polishing Liquid and Polishing Method
Application:
17/925,175 →
Publication:
US US20230174822A1
Dust Core Compound, Molded Body, and Dust Core
Adhesive Film for Circuit Connection, and Circuit Connection Structure and Manufacturing Method Therefor
Adhesive Set, Film, Bonded Body, and Method for Separating Adherend
Application:
17/926,385 →
Publication:
US US20230235205A1
Photocurable Composition, Cured Product of Same, Photofusible Resin Composition and Adhesive Set
Wiring Structure, Method for Manufacturing Same, and Semiconductor Package
Method of Measuring Physical Properties, Method of Evaluating Member, Method of Manufacturing Electronic Component Device, Method of Manufacturing Material for Electronic Component Device, and Physical Property Measurement System
Negative Electrode Material for Lithium-Ion Secondary Battery and Use Thereof
Composite Particles, Method for Producing the Same, and Uses Thereof
Application:
17/927,644 →
Publication:
US US20230234852A1
Composite Carbon Particles and Use Thereof
Composite Particles, Negative Electrode Material, and Lithium-Ion Secondary Battery
Composite Particles, Negative Electrode Active Material, and Lithium-Ion Secondary Battery
Polishing Liquid and Polishing Method
Culture Manufacturing Method and Cell Harvest Method
Application:
17/928,916 →
Publication:
US US20230227773A1
SiC INGOT AND SiC WAFER
Polyamideimide Resin Composition and Fluorine-Containing Coating Material
Application:
17/981,060 →
Publication:
US US20230066239A1
SiC EPITAXIAL WAFER, AND METHOD OF MANUFACTURING THE SAME
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame Provided with Temporary Protective Film, Encapsulation Molded Body, and Method for Manufacturing Semiconductor Package
Temporary Protection Film for Semiconductor Encapsulation, Production Method Therefor, Lead Frame with Temporary Protection Film, Temporarily Protected Encapsulation Object, and Method for Producing Semiconductor Package
Application:
17/995,408 →
Publication:
US US20230178385A1
Temporary Fixation Layered Film and Production Method Therefor, Temporary Fixation Layered Body, and Semiconductor Device Production Method
Adhesive Set, Adhesive Body, and Manufacturing Method Therefor
Adhesive Set, Adhesive Body, and Method for Producing Same
Method for Manufacturing Electronic Component, Resin Composition for Temporary Protection, and Resin Film for Temporary Protection
Document Search Device, Document Search System, Document Search Program, and Document Search Method
Semiconductor Device and Method for Producing Same
Solid Electrolyte Material, Solid Electrolyte, Method for Producing Solid Electrolyte, and All-Solid-State Battery
Application:
18/008,764 →
Publication:
US US20230223589A1
Solid Electrolyte Material, Solid Electrolyte, Method for Producing Solid Electrolyte, and All-Solid-State Battery
Application:
18/008,774 →
Publication:
US US20230223590A1
Lithium Ion Conductive Solid Electrolyte and All-Solid-State Battery
Application:
18/008,779 →
Publication:
US US20230178796A1
Method of Manufacturing Anode Material for Lithium-Ion Secondary Battery, and Method of Manufacturing Lithium-Ion Secondary Battery
Application:
18/008,971 →
Publication:
US US20230246162A1
Anode Material for Lithium-Ion Secondary Battery, Anode for Lithium-Ion Secondary Battery, and Lithium-Ion Secondary Battery
Application:
18/008,976 →
Publication:
US US20230275227A1
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Solid Electrolyte Material, Solid Electrolyte, Method for Producing Solid Electrolyte, and All-Solid-State Battery
Application:
18/009,216 →
Publication:
US US20230216085A1
Photosensitive Resin Composition, Dry Film, Printed Wiring Board, and Method for Producing Printed Wiring Board
Photosensitive Resin Composition, Method for Producing Patterned Cured Film, Patterned Cured Film and Semiconductor Element
Surface Analysis Method, Surface Analysis System, and Surface Analysis Program
Resin Composition, Film, and Cured Product
Application:
18/012,980 →
Publication:
US US20230250256A1
Thermally Conductive Sheet and Device Provided with Thermally Conductive Sheet
Application:
18/013,754 →
Publication:
US US20230295398A1
Method for Manufacturing Laminate
Method for Producing Circuit Board
Application:
18/017,954 →
Publication:
US US20230253215A1
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayered Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayered Printed Wiring Board
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern, and Method for Producing Printed Wiring Board
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern, and Method for Producing Printed Wiring Board
Application:
18/019,201 →
Publication:
US US20230288802A1
Member for Forming Wiring, Method for Forming Wiring Layer Using Member for Forming Wiring, and Wiring Forming Member
Application:
18/019,614 →
Publication:
US US20230328897A1
Method for Manufacturing Substrate with Built-in Components, and Substrate with Built-in Components
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Photosensitive Element and Method for Producing Photosensitive Element
Curable Composition, Heat Storage Material, and Article
Application:
18/023,151 →
Publication:
US US20230312824A1
Method for Producing Pitch
Application:
18/023,480 →
Publication:
US US20230303933A1
Photosensitive Resin Composition, Permanent Resist, Method for Forming Permanent Resist, and Method for Inspecting Permanent Resist Cured Film
Application:
18/023,952 →
Publication:
US US20230324789A1
Method for Producing Ethyl Acetate Production Catalyst
Application:
18/024,429 →
Publication:
US US20230330636A1
Laminated Structure and Object Detection Structure
Application:
18/024,894 →
Publication:
US US20230330968A1
Method for Producing Frp Precursor
Coating Liquid Composition, Substrate with Coating Film, Separator, Secondary Battery, and Electrode Material
Coating Liquid Composition, Substrate with Coating Film, Separator, Secondary Battery, and Electrode Material
Application:
18/025,737 →
Publication:
US US20230352798A1
Autophagy Activator
Application:
18/026,009 →
Publication:
US US20230364119A1
Autophagy Activator
Application:
18/026,057 →
Publication:
US US20230355646A1
Copper Paste, Wick Formation Method, and Heat Pipe
Cell Culture Apparatus and Method for Producing Cell Groups
Application:
18/028,285 →
Publication:
US US20230374439A1
Resin Composition, Method for Producing Semiconductor Device, Cured Product, Semiconductor Device, and Method for Synthesizing Polyimide Precursor
Application:
18/029,102 →
Publication:
US US20240018306A1
Method for Removing Oxygen Molecule and Method for Purifying Carbon Monoxide
Application:
18/030,316 →
Publication:
US US20230382741A1
Aluminum Alloy for Sliding Components, and Sliding Component
Coating Composition, Base Material with Coating Film, Separator, Secondary Battery, Lithium-Ion Secondary Battery, and Electrode Material
Application:
18/031,057 →
Publication:
US US20230374333A1
Coating Composition and Base Material with Coating Film
Application:
18/031,274 →
Publication:
US US20230374334A1
Gas-Filled Container and Method of Storing (E)-1,1,1,4,4,4,-Hexafluoro-2-Butene
Application:
18/031,382 →
Publication:
US US20250122977A1
Method for Storing Fluorobutene
Application:
18/031,412 →
Publication:
US US20230373887A1
Method for Storing Fluoro-2-Butene
Application:
18/031,425 →
Publication:
US US20230373888A1
Method for Storing Fluorobutene
Application:
18/031,460 →
Publication:
US US20240018075A1
Etching Gas, Method for Producing Same, Etching Method, and Method for Producing Semiconductor Device
Application:
18/031,471 →
Publication:
US US20230374381A1
Composition
Application:
18/031,496 →
Publication:
US US20230374276A1
Method for Storing Fluoro-2-Butene
Application:
18/031,514 →
Publication:
US US20230303469A1
Method for Storing Fluoro-2-Butene
Thermal Conduction Sheet Holder and Method of Manufacturing Heat Dissipating Device
Etching Gas, Method for Producing Same, Etching Method, and Method for Producing Semiconductor Device
Application:
18/031,801 →
Publication:
US US20230386853A1
Etching Gas, Etching Method, and Method for Producing Semiconductor Device
Etching Gas, Etching Method, and Method for Producing Semiconductor Device
Etching Method and Method for Producing Semiconductor Device
Application:
18/032,486 →
Publication:
US US20230395389A1
Aluminum Alloy for Sliding Component, and Sliding Component
Application:
18/033,138 →
Publication:
US US20230399723A1
Aluminum Alloy for Automobile Wheels, and Automobile Wheel
Application:
18/033,880 →
Publication:
US US20230416878A1
Chloroprene Copolymer Latex and Method for Producing Same
Application:
18/034,820 →
Publication:
US US20230407060A1
Bumper Reinforcement, Method for Manufacturing Same, and Resin Reinforcement Member for Bumper Reinforcement
Application:
18/035,001 →
Publication:
US US20240010147A1
Polyimide Precursor, Polyimide, and Flexible Printed Circuit Board
Application:
18/035,607 →
Publication:
US US20230391955A1
Method for Manufacturing Catalyst for Manufacture of Vinyl Acetate and Method for Manufacturing Vinyl Acetate
Application:
18/035,824 →
Publication:
US US20230398523A1
Maleimide Resin Composition, Prepreg, Laminate, Resin Film, Printed Wiring Board, and Semiconductor Package
Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film, Printed Wiring Board, and Semiconductor Package
Maleimide Resin Composition, Prepreg, Resin Film, Laminated Board, Printed Wiring Board, and Semiconductor Package
Gas Analyzing Method
Water Film Evaluation Method, and Antifogging Agent Evaluation Method
Application:
18/037,441 →
Publication:
US US20230393055A1
Antifogging Agent, Hydrophilizing Agent, and Antifogging Method for Vehicular Lamp Structure
Application:
18/037,459 →
Publication:
US US20230407134A1
Fixed Bed Multi-Tubular Reactor for Producing Alkenyl Acetate
Application:
18/037,594 →
Publication:
US US20240342676A1
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
Application:
18/038,755 →
Publication:
US US20240043612A1
Fullerene Derivative and Production Method Therefor
Resin Composition for Molding and Electronic Component Device
Application:
18/039,957 →
Publication:
US US20240034833A1
Method for Manufacturing Electronic Component Device and Electronic Component Device
Adhesive for Semiconductors, and Semiconductor Device and Method for Producing Same
Application:
18/043,730 →
Publication:
US US20230352436A1
Adhesive Agent for Semiconductors, and Semiconductor Device and Method for Manufacturing Same
Method for Producing Wiring Board, and Wiring Board
Electrode Filament Connection Member, Chemical Vapor Deposition Apparatus, and Method for Manufacturing Recording Medium Substrate
Method for Using a Buffer Sheet
SiC SUBSTRATE AND SiC EPITAXIAL WAFER
SiC SUBSTRATE AND SiC INGOT
Thermally Conductive Composition
Application:
18/127,720 →
Publication:
US US20230313017A1
SiC SUBSTRATE AND SiC EPITAXIAL WAFER
Iron-Based Sintered Alloy Material and Production Method Therefor
Application:
18/173,929 →
Publication:
US US20230211413A1
SiC SUBSTRATE AND SiC INGOT
SiC SUBSTRATE AND SiC INGOT
8-INCH N-TYPE SiC SINGLE CRYSTAL SUBSTRATE
Mold for Continuous Casting and Method of Manufacturing Continuous Casting Rod
Photosensitive Resin Composition, Dry Film Using Same, Printed Wiring Board, and Printed Wiring Board Manufacturing Method
Surface-Treated Filler, Method for Producing Surface-Treated Filler, and Heat Conducting Composition
Application:
18/224,159 →
Publication:
US US20240026055A1
Recording and Reproducing Device
Application:
18/241,463 →
Publication:
US US20240079033A1
Document Retrieval Device
Method for Manufacturing Substrate Material for Semiconductor Package, Prepreg, and Substrate Material for Semiconductor Package
Application:
18/245,347 →
Publication:
US US20230331946A1
Organic Core Material, Production Method for Same, Laminate Including Organic Core Material, and Circuit Board
Application:
18/245,348 →
Publication:
US US20230356498A1
Octafluorocyclobutane Purification Method
Application:
18/245,686 →
Publication:
US US20230348346A1
Slurry, Polishing Method, and Method for Manufacturing Semiconductor Component
Slurry, Polishing Method, and Method for Producing Semiconductor Component
Method for Manufacturing Semiconductor Device, Method for Manufacturing Film Material for Temporary Fixing, and Film Material for Temporary Fixing
Film for Temporary Fixation, Layered Product for Temporary Fixation, and Method for Producing Semiconductor Device
Method for Manufacturing Wiring Board, Method for Manufacturing Semiconductor Device, and Resin Sheet
Application:
18/247,077 →
Publication:
US US20240030044A1
Lithium Ion Battery Lifetime Prediction Method, Discharge Capacity Retention Rate Prediction Method, Lifetime Prediction Program, Discharge Capacity Retention Rate Prediction Program, and Information Processing Device
Method for Evaluating Performance of Lubricating Layer
Application:
18/248,591 →
Publication:
US US20230386613A1
Adsorbent Particles, Method for Producing Adsorbent Particles, Base Material Particles, Filling Column, and Method for Recovering Rare Earth Element
Information Processing System, Information Processing Method, and Storage Medium
Paste
Application:
18/255,237 →
Publication:
US US20230391983A1
Curable Resin Film, Film Material for Semiconductor Device Production, Curable Resin Composition for Semiconductor Device Production, and Method for Producing Semiconductor Device
Method for Manufacturing Semiconductor Device
Method for Manufacturing Semiconductor Device
Method for Manufacturing Semiconductor Device by Removing Carrier After Forming Re-Distribution Layer
Packaged Negative Electrode Material, Method for Transporting Negative Electrode Material, Container for Storing Negative Electrode Material, Method for Storing Negative Electrode Material, and Method for Manufacturing Negative Electrode
Design Assitance Device, Design Assitance Method, and Design Assitance Program
Application:
18/256,450 →
Publication:
US US20240028795A1
Design Assistance Device, Design Assistance Method, and Design Assistance Program
Application:
18/256,452 →
Publication:
US US20240028796A1
Method for Evaluating Compatibility of Thermosetting Resin Composition, Thermosetting Resin Composition, Prepreg, Resin Film, Laminated Plate, Multilayer Printed Wiring Board, and Semiconductor Package
Application:
18/257,146 →
Publication:
US US20230392002A1
Lithium-Ion Secondary-Battery Negative Electrode Material and Method for Manufacturing Same, Lithium-Ion Secondary-Battery Negative Electrode, and Lithium Ion Secondary Battery
Application:
18/257,589 →
Publication:
US US20240113296A1
Inspection Condition Presentation Apparatus, Surface Inspection Apparatus, Inspection Condition Presentation Method and Program
Method for Manufacturing Semiconductor Device Including Disposing an Adhesive Thermal Insulation Material on the Semiconductor Device
Composition and Sheet
Application:
18/258,467 →
Publication:
US US20240043597A1
Composition and Sheet Containing Cured Product of Same
Application:
18/258,492 →
Publication:
US US20240043648A1
Layered Plate and Wiring Base Board Production Method
Film Adhesive and Method for Making Same; Dicing/Die Bonding Integrated Film and Method for Making Same; and Semiconductor Device and Method for Making Same
Application:
18/258,846 →
Publication:
US US20230395420A1
Film-Like Adhesive Agent, Dicing/Die-Bonding All-in-One Film, Semiconductor Device, and Method for Manufacturing Same
Application:
18/258,891 →
Publication:
US US20240043722A1
Negative Electrode for All-Solid-State Battery, All-Solid-State Battery, and Negative-Electrode Active Material for All-Solid-State Battery
Application:
18/259,079 →
Publication:
US US20240055602A1
Resin Composition, Prepreg, Laminated Plate, Resin Film, Printed Wiring Board, and Semiconductor Package
Application:
18/259,444 →
Publication:
US US20230391939A1
Thermosetting Resin Composition, Prepreg, Laminate, Metal-Clad Laminate, Printed Wiring Board, and High-Speed Communication Compatible Module
Method for Producing Wiring Board, Laminate and Method for Producing Same
Application:
18/260,468 →
Publication:
US US20240057263A1
Method for Producing Semiconductor Device, Wiring Board, and Semiconductor Device
Application:
18/261,114 →
Publication:
US US20240088051A1
Electroconductive Member, Method for Manufacturing Electronic Device, Connection Structure, and Electronic Device
Application:
18/261,713 →
Publication:
US US20240079345A1
Photosensitive Resin Composition, Photosensitive Element, Printed Wiring Board, and Method for Manufacturing Printed Wiring Board
Application:
18/262,276 →
Publication:
US US20240134277A1
Cooling Structure
Solder Paste, Method for Forming Solder Bumps, and Method for Producing Member with Solder Bumps
Application:
18/263,711 →
Publication:
US US20240105653A1
Solder Paste, Method for Forming Solder Bumps, and Method for Manufacturing Member Provided with Solder Bumps
Negative Electrode Material for Lithium-Ion Secondary Battery, Method of Evaluating Same, and Method of Producing Same, Negative Electrode for Lithium-Ion Secondary Battery, and Lithium-Ion Secondary Battery
Application:
18/263,714 →
Publication:
US US20240120482A1
Negative Electrode Material for Lithium-Ion Secondary Battery, Negative Electrode Material Composition for Lithium-Ion Secondary Battery, Negative Electrode for Lithium-Ion Secondary Battery, and Lithium-Ion Secondary Battery
Application:
18/263,718 →
Publication:
US US20240105940A1
Polishing Liquid, Polishing Liquid Set and Polishing Method
Application:
18/264,534 →
Publication:
US US20240052222A1
Program, Proposal Device, and Proposal Method
Application:
18/264,833 →
Publication:
US US20240095421A1
Molding Resin Composition and Electronic Component Device
Application:
18/265,971 →
Publication:
US US20240026118A1
Fullerene Production Device and Production Method
Application:
18/266,752 →
Publication:
US US20240043277A1
Polychloroprene Latex Composition
Application:
18/266,880 →
Publication:
US US20240052143A1
Thermally Conductive Resin Composition, Cured Product, Heat Transfer Member and Electronic Device
Method for Measuring Orientation of Silver Nanowire, Polyvinyl Alcohol Film, Method for Processing Polyvinyl Alcohol Film, and Method for Producing Polyvinyl Alcohol Film
Application:
18/266,978 →
Publication:
US US20240060888A1
Optical Cell for Sedimentation Analysis, Centrifugal Sedimentation Analysis Device, and Centrifugal Sedimentation Analysis Method
Application:
18/267,145 →
Publication:
US US20240102908A1
Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium and Magnetic Recording Medium
Method for Manufacturing Metallic Member-Resin Member Bonded Body, and Film
Application:
18/268,036 →
Publication:
US US20240051237A1
Lithium Ion Conductive Solid Electrolyte and All-Solid-State Battery
Application:
18/269,364 →
Publication:
US US20240088431A1
Chlorine Gas Decomposition Catalyst, Exhaust Gas Treatment Device, and Method for Decomposing Chlorine Gas
Application:
18/269,373 →
Publication:
US US20240066502A1
Aluminum Alloy Forging and Manufacturing Method Thereof
Molded Body, Automobile Part, and Method for Manufacturing Molded Body
Application:
18/269,679 →
Publication:
US US20240059047A1
Heat Conducting Composition and Cured Product Thereof
Application:
18/272,669 →
Publication:
US US20240101885A1
Method for Forming Pattern of Metal Oxide and Method for Producing Semiconductor Element
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Publication:
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Resin Molded Product
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Publication:
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Layered Structure and Object Detection Structure
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Publication:
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Layered Structure for Automobile Emblem and Object Detection Structure
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Publication:
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Welding Film and Joined Body
Hydrogen Fluoride Gas Removal Device and Method for Removing Hydrogen Fluoride Gas
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Hydrogen Fluoride Gas Removal Device and Method for Removing Hydrogen Fluoride Gas
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18/280,050 →
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Etching Gas and Etching Method
Application:
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Packing Material and Method for Producing the Same, and Column for Size Exclusion Chromatography
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Spreading Agent, Fertilizer Composition and Agricultural Chemical Composition
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Fluorine-Containing Ether Compound, Lubricant for Magnetic Recording Medium, and Magnetic Recording Medium
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Recess Filling Material Kit, Cured Product Thereof, and Recess Filling Method
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Lithium Ion-Conductive Oxide and All-Solid-State Battery
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Titanium Oxide Particles and Method for Producing Same
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Composite Particles, Negative Electrode Mixture Layer and Lithium-Ion Secondary Battery
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SiC SINGLE CRYSTAL SUBSTRATE
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Document Search Device, Document Search Program, and Document Search Method
Magnetic Sensor, Method of Manufacturing Magnetic Sensor, and Sensitive Element Assembly
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Application:
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Publication:
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Sic Epitaxial Wafer and Method for Manufacturing Sic Epitaxial Wafer
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Semiconductor Device Manufacturing Method, Curable Resin Composition for Temporary Fixation Material, Film for Temporary Fixation Material, and Laminated Film for Temporary Fixation Material
Heat Treatment Chamber, Film Forming Apparatus, and Substrate Heating Method
Application:
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Publication:
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Recording and Reproducing Device with Medium Regulating Portion
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Application:
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Magnetic Sensor
Support Unit, Film Forming Apparatus, and Carrier Support Method
Application:
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Application:
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Publication:
US US20240212711A1
Substrate Holder, Substrate Holding Method, and Film Formation Apparatus
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Application:
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Publication:
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Aluminum Alloy Forging Material, Aluminum Alloy Forged Product and Method of Producing Same
Application:
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Publication:
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Positive Electrode Mixture Layer, Conductive Additive, Positive Electrode Mixture, and Lithium-Ion Secondary Battery
Aluminum Alloy Forging Material, Aluminum Alloy Forged Product and Method of Producing Same
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Resin Composition, Cured Product, Laminate, Transparent Antenna and Manufacturing Method Therefor, and Image Display Device
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Method for Manufacturing Semiconductor Device
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Method for Producing Coating Liquid and Method for Producing Thermal Insulation Material
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Method for Manufacturing Semiconductor Device, Cleaning Device, Cleaning Method, and Semiconductor Device
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Copper Paste for Forming Sintered Copper Pillars and Method for Producing Bonded Body
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US US20240181575A1
Photosensitive Resin Composition, Photosensitive Element, Printed Wiring Board, and Method for Manufacturing Printed Wiring Board
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Magnetic Powder, Compound, Molded Body, Bonded Magnet, and Powder Magnetic Core
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Semiconductor Device Manufacturing Method, Semiconductor Device, Integrated Circuit Element, and Integrated Circuit Element Manufacturing Method
Application:
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Method for Manufacturing Semiconductor Device, Semiconductor Device, Integrated Circuit Element, and Method for Manufacturing Integrated Circuit Element
Application:
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Monomer Composition, Molded Body, Bonded Magnet, Dust Core
Application:
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Analyzing Device, Predicting Device, Analyzing Method, Predicting Method, and Program
Sound Absorbing Material, and Vehicle Member
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Hardener, Adhesive Composition, Adhesive Film for Circuit Connection, Connected Structure, and Method for Producing Connected Structure
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Wiring Substrate
Application:
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Property Prediction System, Property Prediction Method, and Property Prediction Program
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Information Processing System, Material Composition Searching Method, Material Composition Searching Device, and Program
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Method for Manufacturing Wiring Board and Layered Plate
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Metal Paste for Bonding, and Bonded Body and Method for Producing Same
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Method for Producing Semiconductor Device, and Semiconductor Device
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Radically Polymerizable Resin Composition
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Evaluation Apparatus, Evaluation Method, and Evaluation Program
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Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 25, 2018
From: PUT, STIJN; VAN GENECHTEN, DIRK; GILLEIR, JAN; MARX, NICOLAS
To: UMICORE; SHOWA DENKO K.K.
Reel/Frame 044726/0326 →
Assignment of Assignor's Interest
Jan 14, 2019
From: TAKEUCHI, YUMA; TAKAHASHI, HISATO; DEGUCHI, HIROYOSHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 047988/0230 →
Assignment of Assignor's Interest
Mar 27, 2019
From: KASAHARA, AYA; MIZUNO, YASUYUKI; MURAI, HIKARI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 048716/0947 →
Assignment of Assignor's Interest
Jun 19, 2019
From: FUJIKAWA, YOHEI; TAKABA, HIDETAKA
To: SHOWA DENKO K.K.; DENSO CORPORATION
Reel/Frame 049518/0248 →
Assignment of Assignor's Interest
Jun 20, 2019
From: ISHIBASHI, NAOTO; FUKADA, KEISUKE; BANDOH, AKIRA
To: SHOWA DENKO K.K.
Reel/Frame 049540/0083 →
Assignment of Assignor's Interest
Jul 8, 2019
From: FUKADA, KEISUKE; ISHIBASHI, NAOTO; BANDO, AKIRA; ITO, MASAHIKO
To: SHOWA DENKO K.K.; CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY; DENSO CORPORATION
Reel/Frame 049690/0600 →
Assignment of Assignor's Interest
Oct 24, 2019
From: KOTAKE, TOMOHIKO; MAKINO, TATSUYA; IWANAGA, KOUTA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050820/0700 →
Assignment of Assignor's Interest
Oct 25, 2019
From: KOTAKE, TOMOHIKO; MAKINO, TATSUYA; IWANAGA, KOUTA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050831/0041 →
Assignment of Assignor's Interest
Oct 28, 2019
From: KOTAKE, TOMOHIKO; MAKINO, TATSUYA; IWANAGA, KOUTA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050842/0123 →
Assignment of Assignor's Interest
Nov 11, 2019
From: FUKUCHI, YOHSUKE; NAKAMURA, ATSUSHI; INOUE, NOZOMI; HINO, MITSUHIRO
To: SHOWA DENKO K.K.
Reel/Frame 050971/0906 →
Assignment of Assignor's Interest
Dec 2, 2019
From: INOUE, HIDETOSHI; MATSUZAKI, TAKAYUKI; TAKAHASHI, HISATO; KAMIMURA, TSUYOSHI
To: HITACHI CHEMICAL COMPANY, LTD.; NAMICS CORPORATION
Reel/Frame 051152/0904 →
Assignment of Assignor's Interest
Dec 2, 2019
From: INOUE, HIDETOSHI; MATSUZAKI, TAKAYUKI; TAKAHASHI, HISATO; KAMIMURA, TSUYOSHI
To: HITACHI CHEMICAL COMPANY, LTD.; NAMICS CORPORATION
Reel/Frame 051152/0234 →
Assignment of Assignor's Interest
Feb 10, 2020
From: KOMURO, NOBUHITO; DAIJIMA, YUTA; MARUYAMA, TETSUYA; IRIZAWA, SHINJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 051768/0106 →
Assignment of Assignor's Interest
Feb 18, 2020
From: OGUCHI, WATARU; YAMASHITA, KATSUHIKO; KIMURA, TOSHIHIRO; SHIMONO, DAIKI
To: SHOWA DENKO K.K.
Reel/Frame 051849/0292 →
Assignment of Assignor's Interest
Mar 4, 2020
From: UMETA, YOSHIKAZU; FUKADA, KEISUKE; ISHIBASHI, NAOTO; ATSUMI, HIRONORI
To: SHOWA DENKO K.K.
Reel/Frame 052010/0394 →
Assignment of Assignor's Interest
Mar 18, 2020
From: FUKASAWA, MASARU; OTSUKA, YUKI
To: SHOWA DENKO K.K.
Reel/Frame 052187/0979 →
Assignment of Assignor's Interest
Jun 19, 2020
From: IZUMI, HIROYUKI; MAKINO, TATSUYA; KOTAKE, TOMOHIKO; TAKAYASU, SATOSHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052986/0769 →
Assignment of Assignor's Interest
Jul 14, 2020
From: IWANO, MAMIKO; YAMAMURA, NAO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053204/0558 →
Assignment of Assignor's Interest
Dec 1, 2020
From: NIIBAYASHI, RYOTA
To: SHOWA DENKO K.K.
Reel/Frame 054508/0074 →
Change of Name
Nov 18, 2022
From: HITACHI CHEMICAL CO., LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061967/0116 →
Change of Name
Nov 18, 2022
From: HITACHI CHEMICAL CO., LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061967/0148 →
Change of Name
Feb 7, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062668/0794 →
Change of Name
Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →