Granted Patent B2

US 12,482,707 · App. 17/639,914 · Granted Nov 25, 2025

Inventors: Tsuyoshi Tazawa (Tokyo, JP); Kei Itagaki (Tokyo, JP); Yoshinobu Ozaki (Tokyo, JP); Ayako Taira (Tokyo, JP)

H01L21/78H01L21/6836H01L24/75H01L24/83H01L24/48H01L24/73H01L2224/48227H01L2224/73265H01L2224/75983H01L2224/83201H01L2224/8385

Abstract

Claims (35)

1 . A method of manufacturing a semiconductor device, the method comprising:

mounting a first chip on a substrate;

attaching a wafer to an adhesive layer of a dicing/die-bonding integrated film comprising a base film, a pressure-sensitive adhesive layer, and the adhesive layer in order;

singulating the wafer to obtain a plurality of second chips;

picking up an adhesive-attached chip by using a first collet, the adhesive-attached chip comprising a second chip among the plurality of second chips, and an adhesive piece obtained by singulating the adhesive layer;

positioning the adhesive piece of the adhesive-attached chip to face the first chip on the substrate, wherein the adhesive piece is located between the first chip and the second chip; and

compressing the adhesive-attached chip against the substrate to embed the first chip into the adhesive piece that is located between the first chip and the second chip, by applying a pressing force from a compressing device to a second collet, wherein the second collet has a holding surface that has a greater area than an area of the first chip and that transmits a first pressure to a central portion of the adhesive-attached chip and a second pressure to a peripheral edge of the adhesive-attached chip, and wherein the first pressure is greater than the second pressure to suppress a deformation at the peripheral edge of the adhesive-attached chip when the first chip is embedded into the adhesive piece of the adhesive-attached chip.

2 . The method according to claim 1 , wherein the second collet is made of an elastic material having a shore A hardness of 30 to 95 that reduces the pressing force received from the compressing device, to the second pressure.

3 . The method according to claim 1 , wherein a thickness of the adhesive piece is 60 to 150 μm.

4 . The method according to claim 1 , wherein a temperature at which a shear viscosity of the adhesive piece is 5000 Pas or less is within a range of 60 to 150° C.

5 . The method according to claim 1 , wherein the second collet is used as the first collet for picking up the adhesive-attached chip.

6 . The method according to claim 1 ,

wherein the second collet includes:

a main body forming a first pressing surface that applies the first pressure by directly transmitting the pressing force from the compressing device; and

a projecting portion projecting from the main body and forming a second pressing surface that extends along an outer periphery of the first pressing surface, the first pressing surface and the second pressing surface forming the holding surface for the adhesive-attached chip, wherein the second pressing surface applies the second pressure, and

wherein the projecting portion is spaced away from the compressing device when the compressing device applies the pressing force to the second collet, to cause the first pressure to be greater than the second pressure, per surface unit of the adhesive-attached chip.

7 . The method according to claim 6 ,

wherein an area of the second chip of the adhesive-attached chip is larger than an area of the first chip in a plan view of the second collet,

wherein an area of the first pressing surface is larger than the area of the first chip and smaller than the area of the second chip, in the plan view, and

wherein when compressing the adhesive-attached chip, the first pressing surface entirely overlaps the first chip and the holding surface of the second collet entirely overlaps the second chip, in the plan view.

8 . The method according to claim 6 , wherein an area of the first pressing surface is 20% to 90% of an area of the second chip in a plan view of the second collet.

9 . The method according to claim 6 ,

wherein the pressing force is applied in a vertical direction that is orthogonal to the holding surface,

wherein a thickness of the projecting portion in the vertical direction is 0.5 mm to 3.0 mm, and

wherein the main body has a greater thickness than the projecting portion, in the vertical direction, to space apart the projecting portion from the compressing device, so as to cause the main body to apply the first pressure that is greater than the second pressure.

10 . A collet for compressing an adhesive-attached chip, the collet comprising:

a main body forming a first pressing surface configured to apply a first pressure to a central portion of the adhesive-attached chip by directly transmitting the pressing force from a compressing device; and

a projecting portion forming a second pressing surface extending along a periphery of the first pressing surface, wherein the first pressing surface and the second pressing surface form a holding surface for the adhesive-attached chip, and wherein the projecting portion is made of an elastic material having a shore A hardness of 30 to 95 that dampens the pressing force to cause the second pressing surface to apply a second pressure to a peripheral edge of the adhesive-attached chip, that is less than the first pressure.

11 . The collet according to claim 10 , wherein the projecting portion is configured to be spaced away from the compressing device when the main body transmits the pressing force from the compressing device, to apply the second pressure that is less than the first pressure.

12 . The collet according to claim 11 , wherein the projecting portion forms an upper surface opposite the second pressing surface, that is stepped from the main body, to avoid contact with the compressing device.

13 . The collet according to claim 10 , wherein the main body and the projecting portion are both made of the material having the shore A hardness of 30 to 95.

14 . The collet according to claim 10 ,

wherein the holding surface forms a flat surface, and

wherein the first pressing surface and the second pressing surface are both configured to contact the adhesive-attached chip at the holding surface.

15 . The collet according to claim 10 , wherein the main body forms at least one through-hole extending in the vertical direction of the collet to cause the holding surface to hold the adhesive-attached chip by suction, in addition to compressing the adhesive-attached chip.

Assignments (3)

Priority Claims (1)

Continuity (1)

References Cited (19)