Patent Assignment
Reel/Frame 063280/0549
Change of Name
Recorded: 2023-04-10
Pages: 10
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Properties
(31)
Resin Gear and Resin Gear Manufacturing Method
Resin-Made Gear
Resin Member, Method for Producing Resin Member and Heat Storage Body
Application:
17/044,328 →
Publication:
US 2021/0024803
Method for Suppressing Corrosion Under Heat-Insulating Material, and Paste for Suppressing Corrosion Under Heat-Insulating Material
Method for Manufacturing Semiconductor Device, Heat-Curable Resin Composition, and Dicing-Die Attach Film
Adhesive Composition and Semiconductor Device Production Method
Temporary Protective Film for Producing Semiconductor Device, Reel Body, and Method for Producing Semiconductor Device
Semiconductor Device Production Method and Laminate Film for Temporary Fixation Material
Application:
17/296,547 →
Publication:
US 2022/0028722
Laminated Glass for Vehicle
Application:
17/297,457 →
Publication:
US 2021/0394491
Resin Composition for Temporary Fixing Use, Resin Film for Temporary Fixing Use, Sheet for Temporary Fixing Use, and Method for Manufacturing Semiconductor Device
Semiconductor Device Having Dolmen Structure and Method for Manufacturing Same
Semiconductor Device Having Dolmen Structure and Manufacturing Method Therefor, and Support Piece Formation Laminate Film and Manufacturing Method Therefor
Semiconductor Device Having Dolmen Structure and Manufacturing Method Therefor, and Support Piece Formation Laminate Film and Manufacturing Method Therefor
Method for Manufacturing Semiconductor Device Having Dolmen Structure, Method for Manufacturing Support Piece, and Laminated Film
Catalyst for Air Electrodes, Air Electrode and Metal Air Secondary Battery
Application:
17/598,877 →
Publication:
US 2022/0158201
Composite Material, Sheet, and Heat Insulator
Sound-Absorbing Material
Application:
17/602,276 →
Publication:
US 2022/0165244
Method for Evaluating Pickup Performance, Integrated Dicing/Die-Bonding Film, Method for Evaluating and Selecting Integrated Dicing/Die-Bonding Film, and Method for Manufacturing Semiconductor Device
Adsorbent Particles, Method for Producing Adsorbent Particles, Base Material Particles, Filling Column and Method for Recovering Rare Earth Element
Semiconductor Device Manufacturing Method
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame with Temporary Protective Film, Encapsulation Molded Body with Temporary Protective Film, and Method for Manufacturing Semiconductor Device
Adsorbent Particles, Base Particle, Packed Column, and Method for Recovering Rare-Earth Element
User Device and Case
Photosensitive Resin Composition, Photosensitive Resin Film, Method for Producing Cured Product, Laminate, and Electronic Component
Application:
17/624,846 →
Publication:
US 2022/0267484
Resin Composition, Heat Storage Material, and Article
Application:
17/633,211 →
Publication:
US 2022/0290025
Method of Manufacturing Semiconductor Device and Collet
Temporary Protective Film, Reel Body, Packaging Body, Package Body, Temporary Protective Body, and Method for Producing Semiconductor Device
Application:
17/641,101 →
Publication:
US 2022/0285200
Conductive Adhesive Composition, and Method for Producing Connection Structure
Adhesive for Semiconductor, Production Method Therefor, and Semiconductor Device and Production Method Therefor
Electrochemical Sensor
Application:
17/766,732 →
Publication:
US 2023/0236149
Resin Composition for Temporary Fixation, Substrate-Conveying Support Tape, and Electronic Equipment Device Manufacturing Method
Application:
17/770,627 →
Publication:
US 2022/0289920
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 7, 2020
From: MORIO, YOICHI; AOYAGI, TATSUYA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054569/0693 →
Assignment of Assignor's Interest
Jan 22, 2021
From: MORIO, YOICHI; AOYAGI, TATSUYA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054991/0863 →
Assignment of Assignor's Interest
Feb 18, 2021
From: IZUMI, HIROYUKI; MAKINO, TATSUYA; KOTAKE, TOMOHIKO; TAKAYASU, SATOSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055302/0245 →
Assignment of Assignor's Interest
Feb 22, 2021
From: YAMAMOTO, KAZUHIRO; KUNITO, YUI; FUJIO, SHUNSUKE
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055347/0244 →
Assignment of Assignor's Interest
Mar 12, 2021
From: HONDA, KAZUTAKA; UENO, KEIKO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055569/0643 →
Assignment of Assignor's Interest
Apr 27, 2021
From: KURODA, TAKAHIRO; NAGOYA, TOMOHIRO; TOMORI, NAOKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056045/0785 →
Change of Name
May 24, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056338/0001 →
Assignment of Assignor's Interest
May 24, 2021
From: NAGAI, AKIRA; MORIMOTO, TSUYOSHI; FURUKAWA, NAOKI; MATSUBARA, NOZOMI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056321/0877 →
Assignment of Assignor's Interest
May 24, 2021
From: KIZAWA, KEIKO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056321/0888 →
Assignment of Assignor's Interest
Jun 15, 2021
From: EMOTO, REIMI; MIWA, TOMOHIRO; ARAKI, TOMOHIRO; NAKAMURA, KYOSUKE
To: SHOWA DENKO MATERIALS CO., LTD.; TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 056539/0089 →
Assignment of Assignor's Interest
Jun 24, 2021
From: MIYAZAWA, EMI; INABA, YOSHIHITO; KAWAMORI, TAKASHI; OOYAMA, YASUYUKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056645/0501 →
Assignment of Assignor's Interest
Aug 16, 2021
From: SOBUE, SHOGO; OOYAMA, YASUYUKI; YAMAGUCHI, YUSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 057181/0288 →
Assignment of Assignor's Interest
Nov 4, 2021
From: HASHIMOTO, SHINTARO; TANIGUCHI, KOUHEI; YAHATA, TATSUYA; OZAKI, YOSHINOBU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058013/0409 →
Assignment of Assignor's Interest
Nov 8, 2021
From: YAHATA, TATSUYA; TANIGUCHI, KOHEI; HASHIMOTO, SHINTARO; OZAKI, YOSHINOBU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058042/0250 →
Assignment of Assignor's Interest
Nov 8, 2021
From: OZAKI, YOSHINOBU; ITAGAKI, KEI; TANIGUCHI, KOHEI; HASHIMOTO, SHINTARO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058042/0362 →
Assignment of Assignor's Interest
Nov 8, 2021
From: YAHATA, TATSUYA; TANIGUCHI, KOHEI; HASHIMOTO, SHINTARO; OZAKI, YOSHINOBU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058039/0626 →
Assignment of Assignor's Interest
Nov 15, 2021
From: SATO, NAOYOSHI; KOTAKE, TOMOHIKO; IZUMI, HIROYUKI; TAKAYASU, SATOSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058106/0708 →
Assignment of Assignor's Interest
Nov 22, 2021
From: TAZAWA, TSUYOSHI; KIMURA, NAOHIRO; OHKUBO, KEISUKE; OZAKI, YOSHINOBU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058739/0911 →
Assignment of Assignor's Interest
Nov 24, 2021
From: IKEDA, TOMOKI; TAKAOKA, KENJI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058201/0442 →
Assignment of Assignor's Interest
Dec 10, 2021
From: AOSHIMA, MASAHIRO; ISHIKAWA, YOHEI; WATANABE, MASARU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058354/0486 →
Assignment of Assignor's Interest
Jan 11, 2022
From: TAKAYASU, SATOSHI; YOKOKURA, AI; KOTAKE, TOMOHIKO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058693/0594 →
Change of Name
Mar 13, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063068/0114 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →