Patent Assignment
Reel/Frame 058042/0362
Assignment of Assignor's Interest
Recorded: 2021-11-08
Pages: 5
Assignors
OZAKI, YOSHINOBU
Executed: 2021-09-27
ITAGAKI, KEI
Executed: 2021-09-27
TANIGUCHI, KOHEI
Executed: 2021-10-18
HASHIMOTO, SHINTARO
Executed: 2021-09-25
YAHATA, TATSUYA
Executed: 2021-09-26
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device Having Dolmen Structure, Method for Manufacturing Support Piece, and Laminated Film
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.