Patent Assignment
Reel/Frame 058739/0911
Assignment of Assignor's Interest
Recorded: 2021-11-22
Pages: 4
Assignors
TAZAWA, TSUYOSHI
Executed: 2021-11-17
KIMURA, NAOHIRO
Executed: 2021-11-17
OHKUBO, KEISUKE
Executed: 2021-11-17
OZAKI, YOSHINOBU
Executed: 2021-11-17
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Evaluating Pickup Performance, Integrated Dicing/Die-Bonding Film, Method for Evaluating and Selecting Integrated Dicing/Die-Bonding Film, and Method for Manufacturing Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.