Adhesive composition and semiconductor device production method
An adhesive composition contains a resin component, a thermal crosslinking agent, and a curing agent, in which the resin component contains a resin having a maleimide group. In a method for producing a semiconductor device having a plurality of connection units for connecting a semiconductor chip and a wiring circuit substrate to each other, or for connecting a plurality of semiconductor chips to each other, a first connection unit is electrically connected to a second connection unit, and at least a portion of the first and second connection units is sealed using the adhesive composition.
1. An adhesive composition comprising:
a resin component;
a thermal crosslinking agent; and
a curing agent,
wherein the resin component comprises a resin having a maleimide group.
2. The adhesive composition according to claim 1 , wherein the thermal crosslinking agent comprises an acrylic resin.
3. The adhesive composition according to claim 2 , wherein the acrylic resin is solid at 25° C.
4. The adhesive composition according to claim 1 , wherein the curing agent comprises a thermal radical generator.
5. The adhesive composition according to claim 4 , wherein the thermal radical generator is an organic peroxide.
6. The adhesive composition according to claim 1 , wherein the adhesive composition is in a film form.
7. A semiconductor device comprising:
a semiconductor chip;
a first connection unit of the semiconductor chip;
a wiring circuit substrate; and
a second connection unit of the wiring circuit substrate electrically connected to the first connection unit,
wherein the adhesive composition according to claim 1 is used for sealing the first connection unit and for sealing the second connection unit during the production of the semiconductor device.
8. A semiconductor device comprising:
a first semiconductor chip;
a first connection unit of the first semiconductor chip;
a second semiconductor chip; and
a second connection unit of the second semiconductor chip electrically connected to the first connection unit,
wherein the adhesive composition according to claim 1 is used for sealing the first connection unit and for sealing the second connection unit during the production of the semiconductor device.
9. A method for producing a semiconductor device having a plurality of connection units for connecting a semiconductor chip and a wiring circuit substrate to each other, or for connecting a plurality of semiconductor chips to each other, the method comprising:
electrically connecting a first connection unit to a second connection unit; and
sealing at least a portion of the first and second connection units using the adhesive composition according to claim 1 .