Patent Assignment
Reel/Frame 056645/0501
Assignment of Assignor's Interest
Recorded: 2021-06-24
Pages: 4
Assignors
MIYAZAWA, EMI
Executed: 2021-06-03
INABA, YOSHIHITO
Executed: 2021-06-04
KAWAMORI, TAKASHI
Executed: 2021-06-03
OOYAMA, YASUYUKI
Executed: 2021-06-14
NISHIDO, KEISUKE
Executed: 2021-06-14
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Semiconductor Device Production Method and Laminate Film for Temporary Fixation Material
Application:
17/296,547 →
Publication:
US 2022/0028722
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.