Patent Assignment
Reel/Frame 057181/0288
Assignment of Assignor's Interest
Recorded: 2021-08-16
Pages: 4
Assignors
SOBUE, SHOGO
Executed: 2021-06-23
OOYAMA, YASUYUKI
Executed: 2021-07-28
YAMAGUCHI, YUSHI
Executed: 2021-06-24
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition for Temporary Fixing Use, Resin Film for Temporary Fixing Use, Sheet for Temporary Fixing Use, and Method for Manufacturing Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.