Patent Assignment
Reel/Frame 063068/0114
Change of Name
Recorded: 2023-03-13
Pages: 10
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device, Heat-Curable Resin Composition, and Dicing-Die Attach Film
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2021
From: YAMAMOTO, KAZUHIRO; KUNITO, YUI; FUJIO, SHUNSUKE
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055347/0244 →
Change of Name
Apr 10, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063280/0549 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →