Patent Assignment
Reel/Frame 055347/0244
Assignment of Assignor's Interest
Recorded: 2021-02-22
Pages: 2
Assignors
YAMAMOTO, KAZUHIRO
Executed: 2021-01-25
KUNITO, YUI
Executed: 2021-01-26
FUJIO, SHUNSUKE
Executed: 2021-01-25
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device, Heat-Curable Resin Composition, and Dicing-Die Attach Film
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 13, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063068/0114 →
Change of Name
Apr 10, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063280/0549 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →