Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method therefor
A semiconductor device according to the present disclosure has a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip, on the substrate, and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, in which the support piece contains a cured product of a thermosetting resin composition, or includes a layer containing a cured product of a thermosetting resin composition, and a resin layer or a metal layer.
1 . A manufacturing method for a semiconductor device having a dolmen structure, the semiconductor device comprising: a substrate; a first chip disposed on the substrate; a plurality of support pieces disposed around the first chip on the substrate; and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, the method comprising:
preparing a laminate film comprising a base material film, an adhesive layer, and a support piece formation film in order, wherein the support piece formation film is constituted of one or more resin layers;
singulating the support piece formation film into singulated pieces of the support piece formation film;
picking up the singulated pieces from the adhesive layer, wherein the picked-up singulated pieces that are separated from the adhesive layer correspond to the support pieces, and wherein the support pieces have lower surfaces formed by a thermosetting resin of the support piece formation film, and upper surfaces formed by the thermosetting resin;
disposing the first chip at a given region on a surface of the substrate;
disposing the plurality of support pieces around the given region, wherein the lower surfaces of the plurality of support pieces are in contact with the surface of the substrate;
preparing an adhesive piece-attached chip comprising the second chip and a bonding adhesive piece provided on one surface of the second chip, wherein the bonding adhesive piece forms a lower surface of the adhesive piece-attached chip; and
constructing the dolmen structure after preparing the adhesive piece-attached chip, by disposing the adhesive piece-attached chip on the plurality of support pieces, wherein the lower surface of the adhesive piece-attached chip that is formed by the bonding adhesive piece is brought into contact with the upper surfaces of the plurality of support pieces.
2 . The manufacturing method according to claim 1 ,
wherein the adhesive layer is an ultraviolet-curable adhesive layer, and
wherein the method further comprises a process of irradiating the adhesive layer with an ultraviolet ray after singulating the support piece formation film and before picking up the singulated pieces from the adhesive layer.
3 . The manufacturing method according to claim 1 , further comprising a process of heating the support piece formation film or the singulated pieces before constructing the dolmen structure.
4 . The manufacturing method according to claim 1 , wherein the one or more resins layers of the support piece formation film in the laminate film, include a first thermosetting resin layer that contacts the adhesive layer and that is configured to form the lower surfaces of the support pieces, a second thermosetting resin layer configured to form the upper surfaces of the support pieces, and an intermediate resin layer extending between the first thermosetting resin layer and the second thermosetting resin layer, wherein the intermediate resin layer has a rigidity greater than a rigidity of the first thermosetting resin layer and of the second thermosetting resin layer.
5 . The manufacturing method according to claim 4 , wherein the intermediate resin layer is a polyimide layer.
6 . The manufacturing method according to claim 4 , wherein the intermediate resin layer contacts both the first thermosetting resin layer and the second thermosetting resin layer.
7 . The manufacturing method according to claim 4 , wherein the first thermosetting resin layer and the second thermosetting resin layer of the support piece formation film, contain an elastomer and a curing agent.
8 . The manufacturing method according to claim 4 , further comprising at least partially curing the first thermosetting resin layer and the second thermosetting resin layer by heating the support piece formation film prior to singulating the support piece formation film.
9 . The manufacturing method according to claim 4 , further comprising at least partially curing the first thermosetting resin layer and the second thermosetting resin layer in the singulated pieces, by heating the singulated pieces prior to picking up the singulated pieces.
10 . The manufacturing method according to claim 4 , further comprising curing the first thermosetting resin layer and the second thermosetting resin layer in the support pieces, by heating the support pieces prior to disposing the adhesive piece-attached chip on the plurality of support pieces.
11 . The manufacturing method according to claim 10 , wherein cured layers of the first thermosetting resin layer and the second thermosetting resin layer in the support pieces, have a greater rigidity than the intermediate resin layer.
12 . The manufacturing method according to claim 1 ,
wherein the support piece formation film is a single layer film of a thermosetting resin layer, and
wherein the thermosetting resin layer is configured to form the lower surfaces and the upper surfaces of the support pieces.
13 . The manufacturing method according to claim 1 , wherein the support pieces are disposed on the surface of the substrate by a compression treatment performed at a temperature of 80 to 180° C. and a pressure of 0.01 to 0.50 MPa, for a duration of 0.5 to 3.0 seconds, the compression treatment causing the lower surfaces of the support pieces to adhere to the surface of the substrate.
14 . The manufacturing method according to claim 1 ,
wherein the adhesive piece-attached chip is disposed on the plurality of support pieces by a compression treatment performed at a temperature of 80 to 180° C. and a pressure of 0.01 to 0.50 MPa, for a duration of 0.5 to 3.0 seconds, and
wherein the manufacturing method further comprises curing the bonding adhesive piece to the upper surfaces of the support pieces by a curing treatment of the bonding adhesive piece performed at a temperature of 60 to 175° C. under a pressure of 0.01 to 1.0 MPa, for a duration of 5 minutes or more.
15 . A manufacturing method for a semiconductor device having a dolmen structure, the method comprising:
preparing a laminate film comprising a base material film, an adhesive layer, and a support piece formation film in order, wherein the support piece formation film is constituted of one or more resin layers including a thermosetting resin layer that contacts the adhesive layer;
singulating the support piece formation film into singulated pieces of the support piece formation film;
picking up the singulated pieces from the adhesive layer, wherein the picked-up singulated pieces that are separated from the adhesive layer correspond to the support pieces, and wherein the support pieces have lower surfaces formed by the thermosetting resin layer of the support piece formation film, and upper surfaces located opposite the lower surfaces;
disposing a first chip at a given region on a surface of the substrate;
disposing the plurality of support pieces around the given region, wherein the lower surfaces of the plurality of support pieces are in contact with the surface of the substrate;
preparing an adhesive piece-attached chip comprising a second chip and a bonding adhesive piece provided on one surface of the second chip, wherein the bonding adhesive piece forms a lower surface of the adhesive piece-attached chip; and
constructing the dolmen structure after preparing the adhesive piece-attached chip, by disposing the adhesive piece-attached chip on the plurality of support pieces, wherein the lower surface of the adhesive piece-attached chip that is formed by the bonding adhesive piece is brought into contact with the upper surfaces of the plurality of support pieces.
16 . The manufacturing method according to claim 15 ,
wherein the thermosetting resin layer of the support piece formation film is a first thermosetting resin layer that is configured to form the lower surfaces of the support pieces, and
wherein the support piece formation film includes a second thermosetting resin layer configured to form the upper surfaces of the support pieces, and an intermediate resin layer extending between the first thermosetting resin layer and the second thermosetting resin layer.
17 . The manufacturing method according to claim 16 , wherein the intermediate resin layer has a rigidity greater than a rigidity of the first thermosetting resin layer and of the second thermosetting resin layer in the support piece formation film.
18 . The manufacturing method according to claim 15 ,
wherein the support piece formation film includes an upper resin layer configured to form the upper surfaces of the support pieces, and
wherein the upper resin layer extends on the thermosetting resin layer, and has a rigidity greater than a rigidity of the thermosetting resin layer.
19 . The manufacturing method according to claim 15 ,
wherein the support piece formation film is a single layer film formed by the thermosetting resin layer, and
wherein the thermosetting resin layer is configured to form the lower surfaces and the upper surfaces of the support pieces.
20 . The manufacturing method according to claim 15 , further comprising at least partially curing the thermosetting resin layer by heating the support piece formation film prior to picking-up the singulated pieces.