Patent Assignment
Reel/Frame 056321/0888
Assignment of Assignor's Interest
Recorded: 2021-05-24
Pages: 4
Assignor
KIZAWA, KEIKO
Executed: 2021-04-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Member, Method for Producing Resin Member and Heat Storage Body
Application:
17/044,328 →
Publication:
US 2021/0024803
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 24, 2021
From: NAGAI, AKIRA; MORIMOTO, TSUYOSHI; FURUKAWA, NAOKI; MATSUBARA, NOZOMI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056321/0877 →
Change of Name
May 24, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056338/0001 →
Change of Name
Apr 10, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063280/0549 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →