Patent Assignment
Reel/Frame 058039/0626
Assignment of Assignor's Interest
Recorded: 2021-11-08
Pages: 6
Assignors
YAHATA, TATSUYA
Executed: 2021-09-26
TANIGUCHI, KOHEI
Executed: 2021-10-18
HASHIMOTO, SHINTARO
Executed: 2021-09-25
OZAKI, YOSHINOBU
Executed: 2021-09-27
ITAGAKI, KEI
Executed: 2021-09-27
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Semiconductor Device Having Dolmen Structure and Manufacturing Method Therefor, and Support Piece Formation Laminate Film and Manufacturing Method Therefor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.