Conductive adhesive composition, and method for producing connection structure
A conductive adhesive composition, the composition containing: (A) conductive particles; (B) a thermosetting resin; and (C) a flux activator. The conductive particles contain a metal having a melting point of 200° C. or lower. In a volume-based cumulative particle size distribution of the conductive particles, a cumulative 50% particle diameter D50 is 3 to 10 μm, and a cumulative 10% particle diameter D10 is 2.4 μm or more. The flux activator contains a compound having a hydroxyl group and a carboxyl group.
1. A conductive adhesive composition, comprising:
conductive particles;
a thermosetting resin; and
a flux activator,
wherein the conductive particles comprise a metal having a melting point of 200° C. or lower,
a cumulative 50% particle diameter is 3 to 10 μm, and a cumulative 10% particle diameter is 2.4 μm or more, in a volume-based cumulative particle size distribution of the conductive particles,
the flux activator comprises a compound having a hydroxyl group and a carboxyl group, and
a content of the conductive particles is 30 to 90% by mass with respect to a total mass of the conductive adhesive composition.
2. The conductive adhesive composition according to claim 1 , wherein a content of the flux activator is 1.0 to 3.9% by mass with respect to an amount of the conductive particles.
3. The conductive adhesive composition according to claim 1 , wherein a cumulative 90% particle diameter is 12 μm or less in the volume-based cumulative particle size distribution of the conductive particles.
4. The conductive adhesive composition according to claim 1 , wherein a minimum particle diameter is 1.0 μm or more in the volume-based cumulative particle size distribution of the conductive particles.
5. The conductive adhesive composition according to claim 1 , wherein a maximum particle diameter is 20 μm or less in the volume-based cumulative particle size distribution of the conductive particles.
6. The conductive adhesive composition according to claim 1 , wherein the metal having a melting point of 200° C. or lower that is comprised in the conductive particles comprises at least one selected from bismuth, indium, tin, and zinc.
7. The conductive adhesive composition according to claim 1 , wherein the thermosetting resin comprises an epoxy resin.
8. The conductive adhesive composition according to claim 7 , further comprising a curing catalyst.
9. The conductive adhesive composition according to claim 1 , wherein the conductive particles comprise metal particles containing only metal.
10. A method for producing a connection structure, comprising:
preparing a circuit board comprising two or more connection terminals and an electronic component comprising two or more connection terminals, and placing the conductive adhesive composition according to claim 1 on a connection terminal of the two or more connection terminals of the circuit board or on a connection terminal of the two or more connection terminals of the electronic component;
arranging the electronic component on the circuit board such that the connection terminal of the circuit board faces the connection terminal of the electronic component via the conductive adhesive composition, to obtain a temporary connection body comprising the circuit board, the conductive adhesive composition, and the electronic component; and
heating the temporary connection body and thereby forming a connection part comprising a conductive portion and a resin portion, said conductive portion comprising conductive particles in the conductive adhesive composition and electrically connecting the connection terminal of the circuit board and the connection terminal of the electronic component and said resin portion being formed around said conductive portion, to obtain a connection structure in which the circuit board and the electronic component are joined by the connection part.