Patent Assignment
Reel/Frame 060987/0215
Assignment of Assignor's Interest
Recorded: 2022-09-05
Pages: 2
Assignor
SUKATA, SHINICHIROU
Executed: 2022-08-24
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Conductive Adhesive Composition, and Method for Producing Connection Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.