PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
The present disclosure relates to a photosensitive resin composition for a permanent resist, the photosensitive resin composition including: (A) an acid-modified vinyl group-containing resin; (B) a photopolymerization initiator; and (C) a photopolymerizable compound, in which the photopolymerizable compound includes a photopolymerizable compound having four or more ethylenically unsaturated groups and a photopolymerizable compound having three or fewer ethylenically unsaturated groups.
1 . A photosensitive resin composition for a permanent resist, the photosensitive resin composition comprising:
(A) an acid-modified vinyl group-containing resin;
(B) a photopolymerization initiator; and
(C) a photopolymerizable compound,
wherein the photopolymerizable compound includes a photopolymerizable compound having four or more ethylenically unsaturated groups and a photopolymerizable compound having three or fewer ethylenically unsaturated groups.
2 . The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound having three or fewer ethylenically unsaturated groups has a dicyclopentadiene skeleton.
3 . The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound having three or fewer ethylenically unsaturated groups has an isocyanate group, a blocked isocyanate group, or an oxyalkylene group.
4 . The photosensitive resin composition according to claim 1 , further comprising (D) an inorganic filler.
5 . The photosensitive resin composition according to claim 1 , further comprising (E) a thermosetting resin.
6 . The photosensitive resin composition according to claim 1 , further comprising (F) a pigment.
7 . A photosensitive element comprising a support film and a photosensitive layer formed on the support film,
wherein the photosensitive layer includes the photosensitive resin composition according to claim 1 .
8 . A printed wiring board comprising a permanent resist including a cured product of the photosensitive resin composition according to claim 1 .
9 . A method for producing a printed wiring board, the method comprising:
a step of forming a photosensitive layer on a substrate by using the photosensitive resin composition according to claim 1 ;
a step of subjecting the photosensitive layer to exposure and development to form a resist pattern; and
a step of curing the resist pattern to form a permanent resist.
10 . A method for producing a printed wiring board, the method comprising:
a step of forming a photosensitive layer on a substrate by using the photosensitive element according to claim 7 ;
a step of subjecting the photosensitive layer to exposure and development to form a resist pattern; and
a step of curing the resist pattern to form a permanent resist.