Patent Assignment
Reel/Frame 066599/0535
Assignment of Assignor's Interest
Recorded: 2024-02-29
Pages: 6
Assignors
YAMASHITA, NAOKI
Executed: 2024-02-06
SAWAMOTO, HAYATO
Executed: 2024-02-07
YAMAGUCHI, KAHO
Executed: 2024-02-08
OYAMA, YASUYUKI
Executed: 2024-02-08
YAMAKAWA, ARISA
Executed: 2024-02-14
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Element, Printed Wiring Board, and Method for Producing Printed Wiring Board
Application:
18/291,075 →
Publication:
US US20240337934A1
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.