Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package
The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.
1. A maleimide resin composition comprising
(A) one or more selected from a group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof, and
(B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein
the component (A) contains
(A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600, and
(A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more, and
the component (B) is (B1) a modified conjugated diene polymer obtained by modifying (b1) a conjugated diene polymer having a vinyl group in a side chain thereof with (b2) a maleimide compound having two or more N-substituted maleimide groups.
2. The maleimide resin composition according to claim 1 , wherein the component (A1) is an aromatic bismaleimide compound.
3. The maleimide resin composition according to claim 1 , wherein the component (A2) is a maleimide compound containing an alicyclic hydrocarbon group.
4. The maleimide resin composition according to claim 3 , wherein the alicyclic hydrocarbon group is contained as part of an indane ring.
5. The maleimide resin composition according to claim 1 , wherein the component (B) is a polymer having a hydrocarbon chain in a main chain thereof.
6. The maleimide resin composition according to claim 1 , wherein the component (B1) has, on a side chain thereof, a substituent obtained by reacting the vinyl group of the component (b1) with the N-substituted maleimide group of the component (b2).
7. The maleimide resin composition according to claim 1 , wherein the component (b1) is polybutadiene having a 1,2-vinyl group.
8. The maleimide resin composition according to claim 1 , wherein a content ratio of the component (A) and the component (B) [(A)/(B)] is 0.3 to 3.0 on a mass basis.
9. A prepreg comprising the maleimide resin composition according to claim 1 or a semi-cured product of the maleimide resin composition.
10. A laminated board comprising a cured product of the maleimide resin composition according to claim 1 .
11. A resin film comprising the maleimide resin composition according to claim 1 or a semi-cured product of the maleimide resin composition.
12. A printed wiring board comprising a cured product of the maleimide resin composition according to claim 1 .
13. A semiconductor package comprising the printed wiring board according to claim 12 and a semiconductor element.