Connector production method and adhesive film
A method of producing a connected body, containing: disposing an adhesive film between a first electronic member having a first electronic electrode and a second electronic member having a second electrode; and pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode; wherein the first electronic member has an indented surface, the first electrode is provided in a depressed portion of the indented surface, the second electrode has a substantially flat surface having an area larger than an area of the first electrode, the adhesive film contains: first conductive particles that are dendritic conductive particles; and second conductive particles containing a non-conductive core and a conductive layer provided on the core, and the second conductive particles have an average particle diameter of not less than a depth of the depressed portion.
1. A method of producing a connected body, comprising:
disposing an adhesive film between a first electronic member having a first electrode and a second electronic member having a second electrode; and
pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode,
wherein
the first electronic member has an indented surface,
the first electrode is provided in a depressed portion of the indented surface, the depressed portion having a depth of 25 μm or more, and
the second electrode is an electrode having a substantially flat surface having an area larger than an area of the first electrode, and
wherein
the adhesive film comprises:
first conductive particles that are dendritic conductive particles; and
second conductive particles that are conductive particles other than the first conductive particles, each second conductive particle comprising a non-conductive core and a conductive layer provided on the core, and
the second conductive particles have an average particle diameter of 25 μm or more and the average particle diameter of the second conductive particles is not less than the depth of the depressed portion.
2. The method according to claim 1 , wherein the adhesive film has a thickness of not less than the depth of the depressed portion.
3. The method according to claim 1 , wherein the average particle diameter of the second conductive particles is less than or equal to 2.5 times the depth of the depressed portion.
4. The method according to claim 1 , wherein the adhesive film has a thickness of between 1.2 times and 2 times the average particle diameter of the second conductive particles.
5. An adhesive film comprising:
first conductive particles that are dendritic conductive particles; and
second conductive particles that are conductive particles other than the first conductive particles, and each second conductive particle comprising a non-conductive core and a conductive layer provided on the core, wherein
the adhesive film is used for electrical connection of a first electronic member having a first electrode and a second electronic member having a second electrode,
the first electronic member has an indented surface,
the first electrode is provided in a depressed portion of the indented surface, the depressed portion having a depth of 25 μm or more,
the second conductive particles have an average particle diameter of 25 μm or more and the average particle diameter of the second conductive particles is not less than the depth of the depressed portion,
the second electrode is an electrode having a substantially flat surface having an area larger than an area of the first electrode, and
the substantially flat surface of the second electrode is electrically connected to the first electrode in the electrical connection.
6. The adhesive film according to claim 5 , wherein the adhesive film has a thickness of not less than the depth of the depressed portion.
7. The adhesive film according to claim 5 , wherein the average particle diameter of the second conductive particles is less than or equal to 2.5 times the depth of the depressed portion.
8. The adhesive film according to claim 5 , wherein the adhesive film has a thickness of between 1.2 times and 2 times the average particle diameter of the second conductive particles.