IP Library Assignment 062647/0788
Patent Assignment
Reel/Frame 062647/0788

Assignment of Assignor's Interest

Recorded: 2023-02-10 Pages: 3
Assignors
SHIRAKAWA, TETSUYUKI
Executed: 2022-07-14
IZAWA, HIROYUKI
Executed: 2022-10-06
MORI, TAKUYA
Executed: 2022-08-10
KIKUCHI, KENTA
Executed: 2022-10-06
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Connector Production Method and Adhesive Film
Application: 17/781,729 →
Publication: US 2023/0002644
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 11, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063284/0307 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →