IP Library › Assignment 063284/0307
Patent Assignment
Reel/Frame 063284/0307

Change of Name

Recorded: 2023-04-11 Pages: 14
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Properties (27)
Substrate-Conveying Support Tape and Electronic Apparatus/Device Production Method
Application: 17/770,628 →
Publication: US US20230039482A1
Resin Composition for Provisional Fixation, Support Tape for Substrate Conveyance and Method for Producing Electronic Device
Application: 17/771,017 →
Publication: US US20220363954A1
Film-Like Adhesive and Method for Evaluating Ease of Splitting, Dicing/Die-Bonding Integrated Film and Method for Manufacturing, and Semiconductor Device
Application: 17/771,020 →
Publication: US US20230005782A1
Information Processing System, Information Processing Method, and Storage Medium
Application: 17/774,883 →
Publication: US US20220392584A1
Information Processing System, Information Processing Method, and Storage Medium
Application: 17/774,886 →
Publication: US US20220405049A1
Input Data Generation System, Input Data Generation Method, and Storage Medium
Application: 17/774,889 →
Publication: US US20220391699A1
Method for Dispersing Conductive Particles, and Electrostatic Adsorption Device
Application: 17/775,886 →
Publication: US US20220392670A1
Curable Composition and Article
Application: 17/779,129 →
Publication: US US20230002661A1
Curable Composition Set and Article
Application: 17/779,130 →
Publication: US US20230016868A1
Composition Containing Compound Having Polyoxyalkylene Chain
Application: 17/779,131 →
Publication: US US20220403081A1
Composition Set Containing Compound Having Polyoxyalkylene Chain
Application: 17/779,132 →
Publication: US US20220403082A1
Connector Production Method and Adhesive Film
Application: 17/781,729 →
Publication: US US20230002644A1
Adhesive Film Production Apparatus and Adhesive Film Production Method
Application: 17/791,994 →
Publication: US US20230040595A1
Adhesive Film Production Apparatus and Reel Bodies
Application: 17/791,996 →
Publication: US US20230039365A1
Reel Body, Method for Manufacturing Reel Body, and Method for Manufacturing Article
Application: 17/791,999 →
Publication: US US20230043876A1
Manufacturing Method for Coating Liquid and Manufacturing Method for Thermal Insulating Material
Application: 17/795,874 →
Publication: US US20230114711A1
Manufacturing Method for Thermal Insulating Material
Application: 17/795,878 →
Publication: US US20230151227A1
Information Processing System, Information Processing Method, and Storage Medium
Application: 17/904,295 →
Publication: US US20230060812A1
Adhesive Film and Reel Body
Application: 17/905,415 →
Publication: US US20230163489A1
Adhesive Composition and Coupling Structure
Application: 17/907,541 →
Publication: US US20230146296A1
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame Provided with Temporary Protective Film, Encapsulation Molded Body, and Method for Manufacturing Semiconductor Package
Application: 17/995,407 →
Publication: US US20230174828A1
Temporary Protection Film for Semiconductor Encapsulation, Production Method Therefor, Lead Frame with Temporary Protection Film, Temporarily Protected Encapsulation Object, and Method for Producing Semiconductor Package
Application: 17/995,408 →
Publication: US US20230178385A1
Temporary Fixation Layered Film and Production Method Therefor, Temporary Fixation Layered Body, and Semiconductor Device Production Method
Application: 17/999,848 →
Publication: US US20230207374A1
Adhesive Set, Adhesive Body, and Manufacturing Method Therefor
Application: 17/999,865 →
Publication: US US20230212430A1
Adhesive Set, Adhesive Body, and Method for Producing Same
Application: 17/999,866 →
Publication: US US20230212439A1
Method for Manufacturing Electronic Component, Resin Composition for Temporary Protection, and Resin Film for Temporary Protection
Application: 18/000,130 →
Publication: US US20230197630A1
Semiconductor Device and Method for Producing Same
Application: 18/003,345 →
Publication: US US20230253366A1
Related Assignments (21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 21, 2022
From: IRIZAWA, SHINJI; SOBUE, SHOGO; TANAKA, MIKA; OGAWA, SAEKO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059657/0262 →
Assignment of Assignor's Interest Apr 22, 2022
From: TANAKA, MIKA; SOBUE, SHOGO; IRIZAWA, SHINJI; OGAWA, SAEKO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059672/0731 →
Assignment of Assignor's Interest May 11, 2022
From: YAMANAKA, DAISUKE; KAYA, MICHIKO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059887/0313 →
Assignment of Assignor's Interest May 18, 2022
From: HANAOKA, KYOHEI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059942/0402 →
Assignment of Assignor's Interest May 18, 2022
From: HANAOKA, KYOHEI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059942/0208 →
Assignment of Assignor's Interest May 18, 2022
From: HANAOKA, KYOHEI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059942/0504 →
Assignment of Assignor's Interest May 26, 2022
From: YAMAZAKI, SHOHEI; IZAWA, HIROYUKI; SUGIMOTO, TOSHIYUKI
To: SHOWA DENKO MATERIALS CO., LTD.; NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY
Reel/Frame 060020/0269 →
Assignment of Assignor's Interest Jun 8, 2022
From: MATSUBARA, NOZOMI; NAKAMURA, YUKI; FURUKAWA, NAOKI; YOKOTA, HIROSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060128/0825 →
Assignment of Assignor's Interest Jun 8, 2022
From: NAKAMURA, YUKI; FURUKAWA, NAOKI; YOKOTA, HIROSHI; MORIMOTO, TSUYOSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060128/0836 →
Assignment of Assignor's Interest Jun 10, 2022
From: FURUKAWA, NAOKI; NAKAMURA, YUKI; YOKOTA, HIROSHI; MORIMOTO, TSUYOSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060156/0741 →
Assignment of Assignor's Interest Jun 10, 2022
From: MATSUBARA, NOZOMI; FURUKAWA, NAOKI; NAKAMURA, YUKI; YOKOTA, HIROSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060156/0761 →
Assignment of Assignor's Interest Jul 12, 2022
From: TOMORI, NAOKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060480/0566 →
Assignment of Assignor's Interest Jul 12, 2022
From: TOMORI, NAOKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060480/0526 →
Assignment of Assignor's Interest Jul 12, 2022
From: TOMORI, NAOKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060480/0601 →
Assignment of Assignor's Interest Aug 9, 2022
From: IZUMI, HIROYUKI; TOGASAKI, KEI; YOKOTA, HIROSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060750/0343 →
Assignment of Assignor's Interest Aug 9, 2022
From: TOGASAKI, KEI; IZUMI, HIROYUKI; YOKOTA, HIROSHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060750/0360 →
Assignment of Assignor's Interest Aug 13, 2022
From: NORTMAN, SCOTT; JASSIR, DAVID
To: RESTFUL ROBOTICS, INC.
Reel/Frame 062255/0947 →
Assignment of Assignor's Interest Aug 30, 2022
From: HANAOKA, KYOHEI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060934/0757 →
Assignment of Assignor's Interest Feb 10, 2023
From: SHIRAKAWA, TETSUYUKI; IZAWA, HIROYUKI; MORI, TAKUYA; KIKUCHI, KENTA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062647/0788 →
Assignment of Assignor's Interest Feb 10, 2023
From: SHIRAKAWA, TETSUYUKI; TOMISAKA, KATSUHIKO; FUKUI, TAKAHIRO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062647/0791 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →