Patent Assignment
Reel/Frame 059672/0731
Assignment of Assignor's Interest
Recorded: 2022-04-22
Pages: 6
Assignors
TANAKA, MIKA
Executed: 2022-04-06
SOBUE, SHOGO
Executed: 2022-04-04
IRIZAWA, SHINJI
Executed: 2022-04-16
OGAWA, SAEKO
Executed: 2022-04-06
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition for Provisional Fixation, Support Tape for Substrate Conveyance and Method for Producing Electronic Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.