IP Library Granted Patent US 11,935,669
Granted Patent B2
US 11,935,669 · App. 17/775,886 · Granted Mar 19, 2024

Method for dispersing conductive particles, and electrostatic adsorption device

Inventors: Shohei Yamazaki (Tokyo, JP); Hiroyuki Izawa (Tokyo, JP); Toshiyuki Sugimoto (Yamagata, JP)
H01B13/0033B05D1/007B01J19/08B01J19/087
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Quick Facts
Patent No.
US 11,935,669
App. No.
17/775,886
Granted
Mar 19, 2024
Kind
B2
Abstract

A method for dispersing conductive particles includes: forming an electric field between a first electrode and a second electrode of an electrostatic adsorption device including the first electrode including a disposition part having electrostatic diffusivity or conductivity on which particles are disposed and the second electrode including an adsorption part having electrostatic diffusivity or conductivity and facing the disposition part, to cause a blend particle in which the conductive particles each having a particle size smaller than a particle size of an intermediate particle are attached to the intermediate particle and which is disposed on the disposition part, to reciprocate between the disposition part and the adsorption part, and to cause the conductive particles to be adsorbed onto the adsorption part.

Claims (22)

1. A method for preparing dispersed conductive particles, the method comprising:

disposing preformed blend particles on a disposition part of a first electrode of an electrostatic adsorption device, wherein each of the preformed blend particles comprises a plurality of the conductive particles attached to an intermediate particle that is larger in size than the conductive particles;

forming an electric field between the first electrode and a second electrode of the electrostatic adsorption device, the second electrode including an adsorption part facing the disposition part of the first electrode, wherein the adsorption and disposition parts each have electrostatic diffusivity or conductivity, and

forming an additional electric field between the second electrode and a third electrode facing the second electrode, wherein the third electrode includes an additional adsorption part that faces the adsorption part of the second electrode, the additional adsorption part having an insulating property,

wherein the electric field causes the preformed blend particles to reciprocate between the disposition part and the adsorption part of the electrostatic adsorption device, thereby causing the conductive particles to detach from the intermediate particle and be dispersedly adsorbed onto the adsorption part, and

wherein the additional electrical field causes the conductive particles dispersedly adsorbed onto the adsorption part to be electrostatically adsorbed onto the additional adsorption part.

2. The method for preparing dispersed conductive particles according to claim 1 , wherein the particle size of the intermediate particle is 10 to 100 times the particle size of the conductive particles.

3. The method for preparing dispersed conductive particles according to claim 1 , wherein the particle size of the conductive particles is 2 to 20 μm.

4. The method for preparing dispersed conductive particles according to claim 1 , wherein the adsorption part has an opening pattern including a plurality of opening portions that open toward the disposition part of the first electrode.

5. The method for preparing dispersed conductive particles according to claim 1 , wherein the additional adsorption part has an opening pattern including a plurality of opening portions that open toward the adsorption part of the second electrode.

6. A method for preparing dispersed conductive particles, the method comprising:

disposing blend particles on a disposition part of a first electrode of an electrostatic adsorption device, wherein each of the blend particles comprises a plurality of the conductive particles attached to an intermediate particle that is larger in size than the conductive particles;

forming an electric field between the first electrode and a second electrode of the electrostatic adsorption device, the second electrode including an adsorption part facing the disposition part of the first electrode, wherein the adsorption and disposition parts each have electrostatic diffusivity or conductivity,

wherein the electric field causes the blend particles to reciprocate between the disposition part and the adsorption part of the electrostatic adsorption device, thereby causing the conductive particles to detach from the intermediate particle and be dispersedly adsorbed onto the adsorption part;

providing an additional electrostatic adsorption device including a third electrode including an additional adsorption part;

disposing the second electrode including the adsorption part on which the conductive particles dispersedly adsorbed so that the adsorption part faces the additional adsorption part; and

forming an additional electric field between the second electrode and the third electrode of the additional adsorption device,

wherein the additional adsorption part has an insulating property, and

wherein the additional electrical field causes the conductive particles dispersedly adsorbed onto the adsorption part to be electrostatically adsorbed onto the additional adsorption part.

7. The method for preparing dispersed conductive particles according to claim 6 , wherein the additional adsorption part has an opening pattern including a plurality of opening portions that open toward the adsorption part of the second electrode.

8. The method for preparing dispersed conductive particles according to claim 6 , wherein the particle size of the intermediate particle is 10 to 100 times the particle size of the conductive particles.

9. The method for preparing dispersed conductive particles according to claim 6 , wherein the particle size of the conductive particles is 2 to 20 μm.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Apr 11, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063284/0307 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 13, 2022
From: NORTMAN, SCOTT; JASSIR, DAVID
To: RESTFUL ROBOTICS, INC.
Reel/Frame 062255/0947 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2022
From: YAMAZAKI, SHOHEI; IZAWA, HIROYUKI; SUGIMOTO, TOSHIYUKI
To: SHOWA DENKO MATERIALS CO., LTD.; NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY
Reel/Frame 060020/0269 →
Priority Claims (2)
JP 2019-204741 · Nov 12, 2019 · national
JP 2020-134877 · Aug 7, 2020 · national
Continuity (1)
Related Publication 20220392670A1 · Dec 8, 2022