Patent Assignment
Reel/Frame 059657/0262
Assignment of Assignor's Interest
Recorded: 2022-04-21
Pages: 6
Assignors
IRIZAWA, SHINJI
Executed: 2022-04-16
SOBUE, SHOGO
Executed: 2022-04-11
TANAKA, MIKA
Executed: 2022-04-11
OGAWA, SAEKO
Executed: 2022-04-11
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Substrate-Conveying Support Tape and Electronic Apparatus/Device Production Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.