Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method

1 . A method for producing a laminated film for temporarily fixing a semiconductor member to a support member, the method comprising:

providing a first curable resin layer on a first surface of a single-layered metal foil; and

providing a second curable resin layer on a second surface of the single-layered metal foil to obtain the laminated film.

2 . The method according to claim 1 , wherein the single-layered metal foil comprises at least one metal selected from the group consisting of silver, gold, platinum, copper, titanium, nickel, molybdenum, chromium, and aluminum.

3 . A laminated film for temporarily fixing a semiconductor member to a support member,

the laminated film comprising a first curable resin layer, a single-layered metal foil, and a second curable resin layer laminated in sequence.

4 . The laminated film according to claim 3 , wherein the single-layered metal foil comprises at least one metal selected from the group consisting of silver, gold, platinum, copper, titanium, nickel, molybdenum, chromium, and aluminum.

5 . A laminated body comprising the support member and the laminated film according to claim 3 ,

wherein the laminated film is provided on the support member, and

wherein the single-layered metal foil is laminated between the first curable resin layer and the second curable resin layer on the support member.

6 . A method for producing a semiconductor device including a semiconductor member, the method comprising:

temporarily fixing the semiconductor member to a support member, with a temporary fixing material layer interposed between the semiconductor member and the support member;

processing the semiconductor member temporarily fixed to the support member; and

separating the processed semiconductor member from the support member by irradiating the temporary fixing material layer with light from a side of the support member,

wherein the temporary fixing material layer comprises a first curable resin layer, a second curable resin layer, and a single-layered metal foil laminated between the first curable resin layer and the second curable resin layer on the support member.

7 . The method according to claim 6 , wherein the light is incoherent light.

8 . The method according to claim 7 , wherein the incoherent light is light comprising at least infrared light.

9 . The method according to claim 6 , wherein a light source of the light is a xenon lamp.

10 . The method according to claim 1 , wherein the single-layered metal foil has a glossy surface and a non-glossy surface.

11 . The method according to claim 10 , wherein the first surface of the single-layered metal foil is the non-glossy surface.

12 . The method according to claim 1 , wherein the first curable resin layer is provided on the first surface of the single-layered metal foil and the second curable resin layer is provided on the second surface of the single-layered metal foil either simultaneously or in any sequence.

13 . The method according to claim 1 , wherein the first curable resin layer is provided on the first surface of the single-layered metal foil and the second curable resin layer is provided on the second surface of the single-layered metal foil simultaneously with each other.

14 . The method according to claim 1 , wherein the first curable resin layer is provided on the first surface of the single-layered metal foil after the second curable resin layer is provided on the second surface of the single-layered metal foil.

15 . The method according to claim 1 , wherein the second curable resin layer is provided on the second surface of the single-layered metal foil after the first curable resin layer is provided on the first surface of the single-layered metal foil.