Patent Assignment
Reel/Frame 061869/0669
Assignment of Assignor's Interest
Recorded: 2022-11-24
Pages: 5
Assignors
AKASU, YUTA
Executed: 2022-11-14
MIYAZAWA, EMI
Executed: 2022-11-14
KAWAMORI, TAKASHI
Executed: 2022-11-14
OYAMA, YASUYUKI
Executed: 2022-11-18
ENOMOTO, TETSUYA
Executed: 2022-11-14
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Temporary Fixation Layered Film and Production Method Therefor, Temporary Fixation Layered Body, and Semiconductor Device Production Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.